2771results about How to "Lower assembly costs" patented technology

The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

A bussed haptic actuator system includes a plurality of haptic actuators and a master control subsystem. Each haptic actuator includes a memory with an address storable therein and a slave controller subsystem configured to control the actuator in response to a received command signal. The master control subsystem is connected via a bus to the plurality of haptic actuators. The master control subsystem includes sequencer configured to determine which of the plurality of haptic actuators are to be activated and logic configured to provide, on the bus, a command signal including one or more addresses corresponding to haptic actuators to be activated as determined by the sequencer.

An improved process for manufacturing a biopsy needle assembly is provided. The process may comprise the steps of forming an aperture for receiving tissue to be sampled in an exterior surface of an elongated tube for receiving a cutter, wherein the elongated tube comprises a proximal portion and a distal portion; forming a hole in the exterior surface of the elongated tube; and applying a coating of material over the elongated tube to form a lumen for receiving vacuum on the exterior surface of the elongated tube, wherein the hole in the exterior surface of the elongated tube provides communication between an interior of the elongated tube and an interior of the lumen. In one version, the elongated tube may be placed in a mold configured to form the vacuum lumen when material is injected into the mold. A proximal hub may advantageously be formed by overmolding.

A cloud broker and procurement system and method is closed. In particular embodiments, the method includes receiving an offer of a computing resource from each of a plurality of providers. The method further includes receiving, from each of the plurality of providers, a service level agreement associated with each respective offered computing resource. Additionally, the method includes normalizing each of the service level agreements associated with the offered computing resources. The method further includes receiving a request from a requesting computer for a computing resource and selecting, based at least in part on the normalized service level agreements, one of the providers to provide the requested computing resource. The method also includes transmitting a service match indicator to the client, wherein the service match indicator indicates a time at which the offered computing resource will be utilized, and utilizing the computing resource on the selected provider.

The invention relates to a ring binder mechanism comprising a housing (10) for receiving two carrier rails (20), wherein the carrier rails are positioned adjacent one another with at least a portion of their inner longitudinal edges (23) facing each other to form a linkage axis (22) and at least a portion of their outer longitudinal edges (24) engaging the housing (10). The carrier rails (20) have at least two half-rings (16) rigidly connected with the carrier rails, which together form a ring (14). The carrier rails (20) are limitedly pivotable relative to each other about the linkage axis (22), taking along the half-rings (16), between an open position and a closed position. A locking rod (31) having at least one locking element (32) is movable parallel to the linkage axis (22) relative to the housing (10) and the carrier rails (20) via an actuating element (18). The locking rod is provided adjacent the bottom or exterior surface of the carrier rails (i.e. the surface facing away from the housing). The locking element (32) engages a portion of the carrier rails and blocks the pivot path of the carrier rails (20) in the closed position. Abutments or bearings are provided on the carrier rails (20) or on the housing flanks (28) for receiving locking forces, against which the locking element (32) is supported in the closed position.

An electrodialysis method and apparatus include a source of concentrate fluid, a source of dilute fluid, a collector of treated concentrate fluid, a collector of dilute fluid, an anode and a cathode. A plurality of generally planar spacers are interleaved with a plurality of membranes to define a plurality of cells providing electrically conductive fluid connection between the anode and the cathode. Each of the spacers comprises a gasket that defines a first aperture and a second aperture. Each of said first and second apertures define an independent cell between interleaved membranes. The symmetrical, multiple split cell spacer configuration channels fluid flow through two or more narrow and elongated paths. The split cell arrangement allows for operation of the stack in parallel or in series. The invention improves the ion removal efficiency of a given membrane area, requires significantly less energy than other electrodialysis systems and substantially reduces stack assembly, materials and fabrication costs.

A rectifier for rectifying alternating current into direct current is described, in which a three-phase generator includes a three-phase stator winding. The phases of the stator winding are triggered via switching elements of a power circuit. The power circuit is controlled via a control part, which includes a controller component. The rectifier includes a control part (control module) having control terminals and a power circuit (power module) controlled by the control module and optionally provided with a cooling device, in which all the power-conducting components are designed as power MOS components and integrated in a stacked construction.

An LED based omni-directional light engine includes a toroidal lens coupled to a controller circuit board and two or more evenly spaced LEDs mounted to the controller circuit board. The toroidal lens includes an inner surface coated with a layer of reflection materials, an outer surface, and a flat base surface. The controller circuit board is electrically coupled to a power source. The LEDs are located immediately under the flat base surface. The inner surface substantially reflects light beams emitted from the LEDs to the outer surface which refracts the beams to the omni-directions.

A method for making structural automotive components and the like provides a strip of high strength steel having a selected thickness. A predetermined thickness of a metal coating, such as nickel, is applied to the opposite faces of the steel strip. The coated steel strip is cut to form a blank. The blank is heated in a generally open atmosphere to a temperature in the range of 800° C. to 1000° C. within less than ten minutes, thereby diffusing at least a portion of the metal coating a predetermined distance into the faces of the steel strip portion of the blank to alleviate scale formation, and simultaneously raise the temperature of the blank for hot forming the same. The heated blank is hot formed in a pressing tool, and cooled therein to heat treat the formed component through microstructure phase change, without substantial scale formation, such that the component need not be descaled prior to post-form processing and/or assembly in a vehicle.

An RFID tag which couples a radiating element or antenna to an integrated circuit without a physical conductor. The radiating element comprises a coil. The integrated circuit is affixed to the substrate having the antenna in such a way that the circuit chip coil is inductively coupled to the antenna coil. When the RFID tag is excited via the antenna, the inductive coupling causes both signaling and power to couple from the antenna to the circuit chip coil without a physical conductor connecting the antenna to the RFID tag integrated circuit.

Fiber composite materials using thin plies with a thickness of less than 0.08 mm provide improved delamination resistance and thinner minimum gauge for laminates. Thin plies may be hybridized with conventional plies, interlaced for strength, and used with adhesives as reinforcement in bonding.

A urea solution injection system and an injector with which urea solution or other exhaust treatment liquid from a source tank can be injected as an atomized spray into an exhaust pipe. A metering pump with integrated injection nozzle are contained in a common housing mounted directly to the exhaust pipe, thereby eliminating the separate electric motor driven pump, line between pump, and injector in conventional systems.

A card reorienting mechanism and an input hopper of plastic card processing equipment, for example a desktop plastic card printer. The card reorienting mechanism is a modular unit that permits the entire mechanism to be inserted or removed as a single unit from the printer. In addition, the input hopper is designed as an interchangeable system that permits alteration in the card capacity of the hopper.

An RF transceiver module for wireless communication devices includes a multi-layered substrate, an RF transceiver IC mounted on the multi-layered substrate for receiving and transmitting voice or data signals, at least one band selection filter mounted on the multi-layered substrate for filtering received RF signals, an antenna switch integrated in the multi-layered substrate which can be switched to transmit RF signals generated by the power amplifiers to the external antenna or to receive RF signals from an external antenna to the RF transceiver IC through the band selection filter, a plurality of passive devices embedded in the multi-layered substrate, and wiring embedded in the multi-layered substrate for electrically connecting the passive devices, the RF transceiver IC, and the band selection filter.

The invention relates to a heat curing in-situ forming high-conductivity silicon rubber composition and application thereof. The composition is composed of the following components: (1) 60-90 parts by weight of mixture of ethylene end-blocked polyorganosiloxane in the same or different viscosities; (2) 10-35 parts by weight of silicone oil containing hydrogen; (3) 1-25 parts by weight of one or multiple R<6>cSiX4-c or partial hydrolytic condensation product thereof; (4) 100-500 parts by weight of metal base conductive filler with the average particle size of 10-150 Mum; (5) 0.01-10 parts by weight of organic metal compound or chelate which contains chloroplatinic acid or contains platinum or palladium and is used as metal base catalyst of heat curing; (6) 1-30 parts by weight of reinforcing filler or functional filler. The invention is applied to the shielding case part of RF equipment requiring electromagnetic shielding and sealed environment. The invention reduces material consumption, simplifies production technology and improves production efficiency and cost performance of product.