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A kind of preparation method of high-precision ultra-thin PCB

A high-precision, ultra-thin technology, used in printed circuit manufacturing, multi-layer circuit manufacturing, and manufacturing of printed circuit precursors, etc., can solve the problems of poor heat dissipation performance and overall thickness of copper lines, and achieve improved precision. , The width is easy to control, and the effect of strengthening the bonding strength

Active Publication Date: 2022-03-08
光臻精密制造(苏州)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defects that direct copper plating in the existing printed circuit board process is likely to cause copper lines to warp, and direct stacking to form multilayer circuit boards will easily increase the overall thickness and deteriorate the heat dissipation performance. Thereby providing a high-precision ultra-thin PCB preparation method

Method used

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  • A kind of preparation method of high-precision ultra-thin PCB
  • A kind of preparation method of high-precision ultra-thin PCB
  • A kind of preparation method of high-precision ultra-thin PCB

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Embodiment 1

[0052] This embodiment provides a high-precision ultra-thin PCB preparation method, such as figure 1 shown, including the following steps:

[0053] (1) Provide substrate

[0054] The base material 1 is cut according to the preset size, and the purpose is to reduce waste as much as possible; the material of the base material 1 is a copper-free core board with at least one of FR-4, PTFE, PI, and ceramics as the medium. In this embodiment, the substrate 1 adopts a copper-free core board with PTFE as the medium, and the thickness is controlled within the range of 20-25 μm.

[0055] In order to facilitate subsequent processing, the base material 1 needs to be pretreated, such as roughening, cleaning, drying, and punching.

[0056] Wherein, the roughening treatment process is: soaking in lye at 65-70° C. for 40-50 minutes, and the lye includes the following raw materials in parts by weight: 8-10 parts of sodium methoxide and 4-5 parts of potassium tert-butoxide. The purpose is to...

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Abstract

The invention belongs to the technical field of circuit board manufacturing, and specifically relates to a method for preparing a high-precision ultra-thin PCB. The steps include: forming a mask on the surface of a substrate; The pattern of the area and the raised area; the nickel-based metal ion-polyethylene glycol methacrylate resin mixture is injected into the recessed area to form a primer layer; the Cu layer is deposited on the surface of the primer layer and the raised area; it will be located in the raised area The Cu layer and the remaining mask are removed; a flat insulating layer is formed to obtain a high-precision ultra-thin PCB. By adding poly(ethylene glycol methacrylate) resin to form a mixture with nickel-based metal ions, the bonding strength between the primer layer and the substrate is improved, and the Cu layer is deposited on the primer layer, which strengthens the bonding strength between the Cu layer and the primer layer, and finally achieves The bonding strength between the copper line and the base material, there is no problem of short circuit or open circuit caused by the lifting of the copper line, ensuring high-quality transmission of PCB signals.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a method for preparing a high-precision ultra-thin PCB. Background technique [0002] In recent years, with the rapid development of the electronic information technology industry, the structure of electronic products has become more and more complex, and the functions have become more and more comprehensive, which will promote the development of printed circuit boards (PCBs) that constitute electronic products in the following two directions: (1 ) There are more and more functional components integrated on electronic products, but the overall size is getting smaller and smaller, which will promote the continuous development of PCBs in the direction of high precision and high integration, requiring PCBs to gradually change from conventional single-layer design to multi-layer design or even High-density interconnection structure design; (2) Electron...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/38H05K1/02H05K3/02H05K3/46
CPCH05K3/386H05K1/0271H05K1/0209H05K3/022H05K3/4644H05K3/4673
Inventor 郝家胜
Owner 光臻精密制造(苏州)有限公司
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