Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat-conducting structure and heat-dissipation device

A heat-conducting structure and heat-dissipating device technology, applied in the direction of modification, heat transfer modification, indirect heat exchanger, etc. through conduction heat transfer, which can solve the problem of large radiator volume

Active Publication Date: 2015-11-25
JIANGSU CNANO TECHNOLOGY CO LTD
View PDF4 Cites 18 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, for the above-mentioned heat dissipation device, the heat sink is too large in size and cannot meet the light and thin requirements of today's thin and thin electronic products.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat-conducting structure and heat-dissipation device
  • Heat-conducting structure and heat-dissipation device
  • Heat-conducting structure and heat-dissipation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The heat conduction structure and heat dissipation device according to preferred embodiments of the present invention will be described below with reference to related drawings, wherein the same elements will be described with the same reference symbols.

[0029] Please refer to Figure 1A to Figure 1D As shown, among them, Figure 1A and Figure 1B are respectively an exploded schematic diagram and a schematic side view of a heat conduction structure 1 in a preferred embodiment of the present invention, and Figure 1C and Figure 1D respectively Figure 1B The enlarged schematic diagram of area A and area B of . hereby, Figure 1C and Figure 1D They are for illustration only and are not drawn to scale of actual components.

[0030] The heat conduction structure 1 can quickly lead out the heat energy generated by the heat source (such as an electronic component), and includes a first heat conduction layer 11 and a second heat conduction layer 12, and the first he...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a heat-conducting structure and a heat-dissipation device. The heat-conducting structure comprises a first heat-conducting layer and a second heat-conducting layer, wherein the first heat-conducting layer comprises a graphene material and first carbon nanotubes; the first carbon nanotubes are dispersed into the graphene material; the second heat-conducting layer is stacked on the first heat-conducting layer and comprises a porous material and second carbon nanotubes; and the second carbon nanotubes are dispersed into the porous material. The invention further discloses the heat-dissipation device. The heat-dissipation device comprises the heat-conducting structure and a heat-dissipation structure; the heat-conducting structure contacts a heat source; and the heat-dissipation structure is connected with the heat-conducting structure. The heat-conducting structure and the heat-dissipation device disclosed by the invention have the thinning characteristics, and conform to the lightweight requirements of current thin electronic products.

Description

technical field [0001] The invention relates to a heat conduction structure and a heat dissipation device, in particular to a thinned heat conduction structure and heat dissipation device. Background technique [0002] With the development of science and technology, for the design and development of electronic devices, thinness and high performance are always given priority. In the case of high-speed calculation, the electronic components of the electronic device will inevitably generate more heat than the previous electronic components, but because the high temperature working environment will not only affect the characteristics of the electronic components, but the high temperature may cause electronic permanent damage to the component. Therefore, in order to meet the trend of thinner products of electronic devices, thinner heat sinks have become one of the indispensable and important equipment in current electronic devices. [0003] The known cooling device generally in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCF28D2021/0029F28F13/003F28F21/02H01L23/373H01L23/3731H01L23/3736H01L23/3737H05K7/20181H05K7/20481H05K7/20172H05K7/20336H05K7/2039F28F3/00H05K7/20136
Inventor 蔡韋政杨智偉郑涛毛鸥张美杰
Owner JIANGSU CNANO TECHNOLOGY CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com