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34results about How to "Meet the development application" patented technology

Flame-resistant and heat-resistant copper clad laminate preparation method

The present invention relates to a flame-resistant and heat-resistant copper clad laminate preparation method, which comprises: adopting nanometer silica foam, dodecyl benzenesulfonic acid, bismuth nitrate pentahydrate, methyl trichlorosilane and polyoxyethylene sorbitan monooleate as a raw materials to obtain a filler; adopting DOPO, a bisphenol A cyanate ester monomer, a phenol compound, a m-nitrobenzene sulfonic acid pyridine salt, 2,3-epoxy cyclopentyl cyclopentyl ether and dimethyl phosphonate as raw materials to obtain a resin prepolymer; adding the filler to o-phthalic acid diglycidyl este to obtain an active filler; mixing the resin prepolymer and an indole compound, and then adding the active filler and isomeric undecanol polyoxyethylene ether phosphate potassium salt to obtain a composite system; and carrying out hot pressing molding on the composite system, a reinforced material and metal foil to obtain the flame-resistant and heat-resistant copper clad laminate, wherein the flame-resistant and heat-resistant copper clad laminate has characteristics of excellent flame retardant property and excellent heat resistance, and meets the development applications of the flame-resistant and heat-resistant copper clad laminate.
Owner:SUZHOU YIKETAI ELECTRONICS MATERIAL

Biological enrichment method of conjugated linolenic acid isomer

The invention relates to a biological enrichment method of a conjugated linolenic acid isomer. The biological enrichment method comprises biological enrichment culture medium preparation, production strain preparation, biological enrichment of the conjugated linolenic acid isomer, and other steps to obtain the c9,t11,c15-conjugated linolenic acid isomer. According to the present invention, the c9,t11,c15-conjugated linolenic acid isomer mass content in the obtained product is more than 0.36%, and the substrate conversion rate is more than 90%; and with the biological enrichment culture, the c9,t11,c15-conjugated linolenic acid isomer-rich anti-cancer function product is obtained, proteins and cellulose in defatted soybean can be decomposed into polypeptides, soluble dietary fibers and other active factors having health functions through lactic acid bacteria, and the health function of the product is significantly enhanced so as to further broaden the application range of the product.
Owner:NANCHANG UNIV

Preparation method for flame-retardant heat-resistant antenna radome base material

The invention relates to a preparation method for a flame-retardant heat-resistant antenna radome base material. The preparation method comprises the following steps: preparing a filler with the average grain size of 180 nanometers by taking nano silicon dioxide foam, dodecylbenzene sulfonic acid, bismuth nitrate pentahydrate and methyl trichlorosilane as raw materials; preparing a resin prepolymer by taking DOPO, a bisphenol A cyanate ester monomer, a phenolic compound, 1,3,5-triglycidyl -S-triazinetrione, bisphenol A epoxy resin and diaminodiphenyl ether as raw materials; mixing the resin prepolymer with maleic anhydride; then sequentially adding poly(methylsilsesquioxane) and the filler; then adding isomeric undecanol polyoxyethylene ether phosphate potassium salt and glass beads to obtain a composite system; then injecting the composite system into a die coated with a release agent, carrying out mold pressing under a vacuum condition, and finally turning off a power supply and naturally cooling; and releasing the die to obtain the flame-retardant heat-resistant antenna radome base material. The flame-retardant heat-resistant antenna radome base material has excellent flame retardance and heat resistance, and the development application of the flame-retardant heat-resistant antenna radome base material is satisfied.
Owner:苏州凯欧曼新材料科技有限公司

Circular combined type plant root collecting device

The invention discloses a circular combined type plant root collecting device, comprising a collecting groove, crossbeam support pieces, a planting plate, planting holes, a hose and a kneading pump, wherein the collecting groove is composed of cross block plates, longitudinal plates and a base plate, wherein the cross block plates are in parallel and positioned at two ends, the longitudinal plates are in parallel and positioned at two sides, the base plate is positioned at the bottom of the collecting groove, and thus forming a rectangular frame of the collecting rove; one corner of the base plate is provided with a liquid outlet pipe; the longitudinal plate in the diagonal line of the liquid outlet pipe is provided with a liquid inlet pipe; the four corners of the lower surface of the base plate are provided with stand bars; the crossbeam support piece is arranged in parallel with the cross block plates, and the length of the e crossbeam support piece is smaller than these of the cross block plates; two adjacent crossbeam support pieces are respectively connected with the longitudinal plates at two sides in a staggering manner; the bottoms of the crossbeam support pieces are connected with the base plate; the planting plate is placed on the crossbeam support pieces, the length of the planting plate is accordant with the internal size of the collecting groove; the planting plate is provided with a plurality of planting hole along the transverse and longitudinal directions; one corner of the planting plate is provided with a liquid adding pipe; planting pipes are arranged in the planting holes; the kneading pump, the liquid outlet pipe and the liquid inlet pipe are connected by the hose.
Owner:JIANGSU UNIV

Heat-conducting electronic material composition

ActiveCN105400134AIncrease in microcracksPrevents the growth of microcracksTri-n-butylamineEpoxide
The invention relates to a heat-conducting electronic material composition which is obtained by mixing N,N'-carbonyldimidazole, tetra-functional epoxy resin, tri-n-butylamine, indoline-2,3-diketone, 2,6-di(4-aminophenoxy) cyanobenzene, a filler, cycloaliphatic epoxide resin, sodium triacetate and acraldehyde. Raw materials in a preparation method disclosed by the invention are wide in source, and the preparation process is simple and controllable, only needs normal operation and is easy to realize industrialization, therefore, the prepared heat-conducting electronic material composition has good heat conductivity and mechanical properties, and development applications of the heat-conducting electronic material composition can be met.
Owner:WUJIANG XINTA FORWARD HARDWARE FACTORY

Electronic material and preparation method thereof

InactiveCN108327363ADoes not affect the curing processHigh densitySynthetic resin layered productsLaminationHeat resistanceMetal foil
The invention relates to an electronic material and a preparation method thereof. The preparation method comprises the following steps: mesoporous silica is modified firstly, then epoxy with monofunctional groups and epoxy with bifunctional groups are prepared, and a glue solution is obtained by mixing; the glue solution, a reinforcing material and metal foil are subjected to hot-press molding, and the electronic material can be obtained. The electronic material has the excellent flame retardance and heat resistance, and requirements for development and application of the electronic material are met.
Owner:SUZHOU YIKETAI ELECTRONICS MATERIAL

Preparation method of novel composite solid gum

The invention relates to a preparation method of a novel composite solid gum. The preparation method comprises the following steps: mixing a filling material, ethylene glycol monobutyl ether, and silica sol for one hour to obtain a mixture; then adding sodium metaborate, a dispersant, and succinic anhydride into the mixture in sequence, stirring for 0.5 hour, then adding epoxy resin prepolymer, stirring for 3 hours at a temperature of 140 DEG C; finally adding polyvinylpyrrolidone and zinc chloride hydrate, stirring for 8 hours at a temperature of 60 DEG C to obtain a compound; then filling the compound into a mould, and cold-pressing the compound to obtain the composite solid gum. The disclosed preparation method has the advantages that the raw material resources are wide, the preparation process is simple and controllable, only normal operation is needed, and the preparation method can be easily applied to industrialization.
Owner:佛山市顺德区领锋新材料有限公司

Low-dielectric-loss casting body

The invention relates to a low-dielectric-loss casting body which is prepared by the following steps: preparing a resin-base composite system from a bismaleimide resin monomer, maleic anhydride, octamethylcyclotetrasiloxane, pentaerythritol tetraacrylate, a phenoxy oxygen resin, isomerized tridecyl alcohol polyethenoxy ether, a polycaprolactam resin, a filler and ethylene glycol; and adding the resin-base composite system into a mold, and carrying out hot pressing to obtain the low-dielectric-loss casting body. The low-dielectric-loss casting body has excellent mechanical properties and heat resistance, and satisfies the development and application of the low-dielectric-loss casting body.
Owner:苏州凯欧曼新材料科技有限公司

High dielectric property copper-clad board glue and preparation method thereof

The invention relates to high dielectric property copper-clad board glue and a preparation method thereof. The preparation method comprises adding methyl butynol into diglycidyl phthalate, stirring the mixture at 75 DEG C for 5 minutes, then adding 1, 8-octanedithiol and N, N-dicyclohexylcarbodiimide into the mixture, stirring the mixture for 5 minutes, then adding a modified silica system and nano-hollow alumina into the mixture, stirring the mixture for 15 minutes, finally, adding a modified epoxy system into the mixture, stirring the mixture at 125 DEG C for 2 hours, adding a butanone / PMA mixed solution into the mixture to obtain glue, dipping a 1080 glass cloth into the glue to obtain a prepreg, heating to dry the prepreg and preparing the modified epoxy resin-based copper clad board.The modified epoxy resin-based copper clad board has excellent dielectric properties and heat resistance and meets the development and application requirements of the modified epoxy resin-based copper-clad board.
Owner:苏州巨峰新材料科技有限公司

Circulation combined root exudate collection device

The invention discloses a circular combined type plant root collecting device, comprising a collecting groove, crossbeam support pieces, a planting plate, planting holes, a hose and a kneading pump, wherein the collecting groove is composed of cross block plates, longitudinal plates and a base plate, wherein the cross block plates are in parallel and positioned at two ends, the longitudinal plates are in parallel and positioned at two sides, the base plate is positioned at the bottom of the collecting groove, and thus forming a rectangular frame of the collecting rove; one corner of the base plate is provided with a liquid outlet pipe; the longitudinal plate in the diagonal line of the liquid outlet pipe is provided with a liquid inlet pipe; the four corners of the lower surface of the base plate are provided with stand bars; the crossbeam support piece is arranged in parallel with the cross block plates, and the length of the e crossbeam support piece is smaller than these of the cross block plates; two adjacent crossbeam support pieces are respectively connected with the longitudinal plates at two sides in a staggering manner; the bottoms of the crossbeam support pieces are connected with the base plate; the planting plate is placed on the crossbeam support pieces, the length of the planting plate is accordant with the internal size of the collecting groove; the planting plate is provided with a plurality of planting hole along the transverse and longitudinal directions; one corner of the planting plate is provided with a liquid adding pipe; planting pipes are arranged in the planting holes; the kneading pump, the liquid outlet pipe and the liquid inlet pipe are connected by the hose.
Owner:JIANGSU UNIV

High-frequency electronic medium material

The invention relates to a high-frequency electronic medium material. The material is manufactured in the mode that a reinforcing material is coated with glue and then hot-pressed. The glue preparation method includes the steps that triphenylsilyl chloride is dispersed in deionized water, then diethyl magnesium and 2-ethyl-1-hexanol titanium are added, then sorbitan monooleate ethoxylate is added, and filler is obtained; the filler is added into phthalic diglycidyl ester, and active filler is obtained; cyclopentadienyl iron tricarbonyl and a cyanate ester monomer are mixed, then an amino compound, aliphatic glycidol ether and diallyl phthalate are sequentially added, and resin prepolymer is obtained after cooling; then, the resin prepolymer is added into butanone and stirred; the active filler and acrylonitrile are added; PMA and diallyl diphenyl ether are added and continuously stirred to obtain a glue solution. The prepared high-frequency electronic medium material has excellent mechanical properties and heat resistance, and the requirements of development and application of the high-frequency electronic medium material are met.
Owner:NANJING ANERTAI COMM SCI & TECH

A preparation method of composite hard sheet for tropical blister packaging

The invention relates to a preparation method of a composite hard sheet for tropical bubble cap package. The preparation method comprises the specific steps that a mixture of titanium dioxide, ytterbium fluoride and zirconia is calcined after being ball-milled to obtain a filler; dihexylamine and the filler are mixed, and then N-formyl morpholine, diethyl phosphonate and benzimidazole are mixed; diisoprene bicyclo oxide, polyamide and ethoxylated trimethylolpropane triacrylate are sequentially added into the mixture, and stirring is performed at the temperature of 170 DEG C for 5 minutes to obtain a compound; the compound is added to an extruder; then, a polyester film with the surface subjected to corona treatment is prepared into a composite polyester film through the extruder; the composite polyester film and an aluminum foil are subjected to hot-pressing compounding to obtain an aluminum plastic material; then the aluminum plastic material is prepared into the composite hard sheet for tropical bubble cap package through the extruder. The raw materials adopted in the preparation method are wide in source, the preparation process is simple and controllable, only conventional operation is needed, and industrialization is easy.
Owner:JIANGSU ZHENMEI PACKAGING TECH

Polypropylene-based polymer material

The invention relates to a polypropylene-based polymer material, which is prepared through the steps of mixing nickel nitrate, magnesium nitrate and carclazyte evenly and then sintering in a muffle furnace at 1050 DEG C for 2h to obtain a solid; crushing the solid, and filtering through an 800-mesh sieve, wherein screen underflow is taken as a composite filler; melting and mixing polypropylene with the molecular weight of 13,000-16,000, phenoxyacetic acid, the composite filler, acrylic ester and benzoguanamine to prepare a polypropylene composition; and carrying out extrusion molding on the polypropylene composition through extrusion equipment and treating at 80 DEG C for 10min to prepare the polypropylene-based polymer material. The raw materials in the preparation method are readily available, the preparation process is simple and controllable, only normal operation is needed by post-treatment equipment and industrialization is easy to implement.
Owner:安徽省鸿鑫生物科技有限公司
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