Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

High dielectric property copper-clad board glue and preparation method thereof

A copper-clad laminate and high-dielectric technology, which is applied in the field of glue for high-dielectric copper-clad laminates and its preparation, can solve the problems of high water absorption, high dielectric constant, low resistance to heat and humidity, and low shrinkage, and achieve fluidity Good compatibility, improved compatibility, and improved heat resistance

Inactive Publication Date: 2018-09-28
苏州巨峰新材料科技有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the reactive phosphorus-based flame retardants widely used in the field of copper clad laminates are mainly DOPO compounds, mainly phosphorus-containing epoxy resins and phosphorus-containing phenolic resins, and the phosphorus content is between 2-10%. However, practical applications It was found that DOPO compounds have a large water absorption rate and a high dielectric constant, and the board made of it has low heat and humidity resistance.
Simple resins can no longer meet the application of copper clad laminates. Even cyanate resins with better heat resistance have excellent dielectric properties (dielectric coefficient: 2.8-3.2; dielectric loss factor: 0.002-0.003), high Heat resistance (glass transition temperature: 280 ~ 295 ° C), while cyanate resin also has low shrinkage, excellent mechanical properties and bonding properties, etc., but also due to defects such as insufficient curing and brittleness, it has not been used in copper clad laminates. A large number of applications in the field

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High dielectric property copper-clad board glue and preparation method thereof
  • High dielectric property copper-clad board glue and preparation method thereof
  • High dielectric property copper-clad board glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] (1) Disperse 2-methylpentanal in ethanol, then add the hexane solution of the catalyst (the mass concentration of the catalyst in the hexane solution of the catalyst is 1%), stir at room temperature for 15 minutes; then add allylboronic acid, Continue to stir for 5 minutes, then add dibutylzinc dilaurate, continue to stir for 1 hour, finally add N-benzylidene aniline, 2,3-epoxycyclopentyl cyclopentyl ether, and stir at 60°C for 30 minutes to obtain Modified epoxy systems; 2-methylpentanal, ethanol, catalyst in hexane, allylboronic acid, dibutylzinc dilaurate, N-benzylidene aniline, 2,3-epoxycyclopentyl The mass ratio of cyclopentyl ether is 5: 20: 1: 4: 0.002: 8: 100;

[0033] The chemical structural formula of described catalyst is:

[0034]

[0035] The chemical structural formula of described allyl boronic acid is:

[0036]

[0037] (2) Add mesoporous silica to concentrated sulfuric acid, ultrasonically treat (power 400W, frequency 20KHz) for 10 minutes and t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to high dielectric property copper-clad board glue and a preparation method thereof. The preparation method comprises adding methyl butynol into diglycidyl phthalate, stirring the mixture at 75 DEG C for 5 minutes, then adding 1, 8-octanedithiol and N, N-dicyclohexylcarbodiimide into the mixture, stirring the mixture for 5 minutes, then adding a modified silica system and nano-hollow alumina into the mixture, stirring the mixture for 15 minutes, finally, adding a modified epoxy system into the mixture, stirring the mixture at 125 DEG C for 2 hours, adding a butanone / PMA mixed solution into the mixture to obtain glue, dipping a 1080 glass cloth into the glue to obtain a prepreg, heating to dry the prepreg and preparing the modified epoxy resin-based copper clad board.The modified epoxy resin-based copper clad board has excellent dielectric properties and heat resistance and meets the development and application requirements of the modified epoxy resin-based copper-clad board.

Description

technical field [0001] The invention belongs to the technical field of electronic composite materials, and in particular relates to a glue solution for copper-clad laminates with high dielectric properties and a preparation method thereof. The obtained product can be used in the fields of aerospace, signal transmission, and electronic communication. Background technique [0002] With the continuous development of science and technology, the application of polymer matrix composites is becoming more and more extensive. At the same time, various application fields also put forward higher requirements for different materials. Especially in cutting-edge science and technology fields such as the aerospace industry, the performance requirements of materials are more stringent. For example, they require composite materials to have high specific strength, high specific stiffness, high temperature resistance, and ablation resistance. The copper clad laminate is obtained by hot pressi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L63/00C08K13/06C08K3/36C08K7/24C08J5/24C08G59/42C08G59/68B32B15/092B32B27/04B32B27/20
CPCB32B15/092B32B27/20B32B2260/046B32B2307/204B32B2307/306B32B2457/08C08G59/4215C08G59/4223C08G59/686C08J5/24C08J2363/00C08K3/36C08K7/24C08K13/06C08K2201/011
Inventor 徐伟红梁国正夏宇朴龙星
Owner 苏州巨峰新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products