High dielectric property copper-clad board glue and preparation method thereof
A copper-clad laminate and high-dielectric technology, which is applied in the field of glue for high-dielectric copper-clad laminates and its preparation, can solve the problems of high water absorption, high dielectric constant, low resistance to heat and humidity, and low shrinkage, and achieve fluidity Good compatibility, improved compatibility, and improved heat resistance
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[0032] (1) Disperse 2-methylpentanal in ethanol, then add the hexane solution of the catalyst (the mass concentration of the catalyst in the hexane solution of the catalyst is 1%), stir at room temperature for 15 minutes; then add allylboronic acid, Continue to stir for 5 minutes, then add dibutylzinc dilaurate, continue to stir for 1 hour, finally add N-benzylidene aniline, 2,3-epoxycyclopentyl cyclopentyl ether, and stir at 60°C for 30 minutes to obtain Modified epoxy systems; 2-methylpentanal, ethanol, catalyst in hexane, allylboronic acid, dibutylzinc dilaurate, N-benzylidene aniline, 2,3-epoxycyclopentyl The mass ratio of cyclopentyl ether is 5: 20: 1: 4: 0.002: 8: 100;
[0033] The chemical structural formula of described catalyst is:
[0034]
[0035] The chemical structural formula of described allyl boronic acid is:
[0036]
[0037] (2) Add mesoporous silica to concentrated sulfuric acid, ultrasonically treat (power 400W, frequency 20KHz) for 10 minutes and t...
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