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Preparation method of high frequency electronic medium material

An electronic medium and high-frequency technology, applied in the field of new electronic composite materials, can solve problems such as leakage current flow and conductance loss, and achieve excellent heat resistance, uniform density, and good curing effect

Inactive Publication Date: 2018-05-18
SUZHOU YIKETAI ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the action of an electric field, there will be leakage current flowing in the medium, causing conductance loss

Method used

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  • Preparation method of high frequency electronic medium material
  • Preparation method of high frequency electronic medium material
  • Preparation method of high frequency electronic medium material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The preparation of embodiment one packing

[0031] Disperse 1Kg of triphenylchlorosilane in deionized water, then add 500g of diethylmagnesium and 20g of 2-ethyl-1-hexanol titanium; then conduct a hydrothermal reaction at 120°C for 3 hours; then filter the reaction solution and bake the filter cake After drying, calcinate at 600°C for 1 hour, cool naturally and then sinter at 950°C for 2 hours, add the obtained powder into ethanol, disperse evenly, then add 10g of polyoxyethylene sorbitan monooleate, and stir at 60°C for 2 hours , and finally dried to obtain a filler (particle size of 450nm to 680nm); 1000g of the filler was added to 1.6Kg of diglycidyl phthalate, and stirred at 125°C for 1 hour to obtain an active filler.

Embodiment 2

[0033] According to the composition of Table 1 and Table 2, proceed according to the following steps, mix cyclopentadienyl iron tricarbonyl and cyanate monomer, stir at 95°C for 10 minutes, then add amino compound and aliphatic glycidyl ether in turn, at 120 Stir for 1 hour at ℃, then add dipropylene phthalate, stir at 120°C for 0.5 hours, and obtain a resin prepolymer after cooling; then add the resin prepolymer to methyl ethyl ketone and stir for 1 hour; add active filler and propylene Nitrile; then add PMA and diallyl diphenyl ether, and continue to stir for 2.5 hours to obtain glue.

[0034] Table 1 raw material composition (g)

[0035]

1#

2#

3#

4#

5#

Cyclopentadienyl iron tricarbonyl

0.01

0.024

0.018

0.02

0.03

Cyanate monomer

100

100

100

100

100

Amino compound

10

12

16

14

18

Aliphatic glycidyl ether

81

85

88

90

95

Dipropylene phthalate

8

8.2

8.5...

Embodiment 3

[0039] Example 3 Preparation of high-frequency electronic dielectric material

[0040] Coat the above glue with electronic grade glass cloth and bake in an oven at 170°C for 2 minutes to prepare a prepreg; cut off the burrs of the prepreg; take 5 pieces of lamination and cover both sides with a release film, The high-frequency electronic dielectric material can be obtained by hot pressing.

[0041] The conditions of hot pressing adopt the method of gradually increasing temperature and increasing pressure. The temperature is raised from 50°C to 180°C for 10 minutes, kept for 60 minutes, then raised to 200°C for 10 minutes, kept for 90 minutes, then raised to 230°C for 5 minutes, kept for 90 minutes, and finally cooled to 50°C for 180 minutes. ; 1min pressure from 0Kg / cm 2 Rise to 15Kg / cm 2 , then keep the pressure for 45min, then rise to 20Kg / cm in 1min 2 Keep the pressure for 50 minutes, and rise to 35Kg / cm in the last 1 minute 2 , keep the pressure for 200min.

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Abstract

The invention relates to a preparation method of a high frequency electronic medium material, which is prepared by hot pressing of a reinforcement material coated with a glue solution. The preparationmethod of the glue solution includes: dispersing triphenylchlorosilane in deionized water, then adding diethyl magnesium and 2-ethyl-1-hexanotitanium, and then adding polyoxyethylene sorbitan monostearate to obtain filler; adding the filler into phthalic diglycidyl ester to obtain active filler; mixing cyclopentadienyl iron tricarbonyl and a cyanate monomer, then adding an amino compound, aliphatic glycidyl ether and diallyl phthalate, and performing cooling to obtain a resin prepolymer; then adding the resin prepolymer into butanone and conducting stirring; adding the active filler and acrylonitrile; then adding PMA and diallyl diphenyl ether, and further performing stirring to obtain the glue solution. The high frequency electronic medium material prepared by the method provided by theinvention has the characteristics of excellent mechanical properties and heat resistance, and meets the development and application of high frequency electronic medium materials.

Description

[0001] This invention belongs to the patent application number 201510551972.4, the patent application date is September 2, 2015, and the patent name is a divisional application of high-frequency electronic dielectric materials, which belongs to the technical scheme of the preparation method of the product technical field [0002] The invention belongs to the technical field of novel electronic composite materials, and in particular relates to a preparation method of a high-frequency electronic dielectric material, which has excellent dielectric properties. Background technique [0003] The development and research of new materials is the forerunner of the development of materials science. Composite material is a new type of material. It has been widely used in aviation, aerospace, energy, transportation, machinery, construction, etc. in the past 30 years due to its diverse functions and excellent performance such as voltage resistance, light weight, designability, high temper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/04C08L63/00C08G73/06C08G59/58C08G59/32C08K9/04C08K5/00C08K7/14C08J5/04
CPCC08G59/32C08G59/58C08G73/0644C08K5/0091C08K7/14C08K9/08C08L2201/08C08L2203/20C08L79/04C08L63/00
Inventor 彭代信宋晓静
Owner SUZHOU YIKETAI ELECTRONICS MATERIAL
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