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Semi-curing sheet for high dielectric property copper clad laminate and preparation method thereof

A technology of prepregs and copper clad laminates, which is applied in the field of prepregs for high dielectric performance copper clad laminates and its preparation, can solve the problems of high water absorption, low dielectric constant, low moisture and heat resistance, and insufficient curing, so as to achieve good fluidity and improve Compatibility, the effect of ensuring strength

Inactive Publication Date: 2018-08-28
苏州巨峰新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the reactive phosphorus-based flame retardants widely used in the field of copper clad laminates are mainly DOPO compounds, mainly phosphorus-containing epoxy resins and phosphorus-containing phenolic resins, and the phosphorus content is between 2-10%. However, practical applications It was found that DOPO compounds have a large water absorption rate and a high dielectric constant, and the board made of it has low heat and humidity resistance.
Simple resins can no longer meet the application of copper clad laminates. Even cyanate resins with better heat resistance have excellent dielectric properties (dielectric coefficient: 2.8-3.2; dielectric loss factor: 0.002-0.003), high Heat resistance (glass transition temperature: 280 ~ 295 ° C), while cyanate resin also has low shrinkage, excellent mechanical properties and bonding properties, etc., but also due to defects such as insufficient curing and brittleness, it has not been used in copper clad laminates. A large number of applications in the field

Method used

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  • Semi-curing sheet for high dielectric property copper clad laminate and preparation method thereof
  • Semi-curing sheet for high dielectric property copper clad laminate and preparation method thereof
  • Semi-curing sheet for high dielectric property copper clad laminate and preparation method thereof

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Embodiment 1

[0036] (1) Disperse 2-methylpentanal in ethanol, then add the hexane solution of the catalyst (the mass concentration of the catalyst in the hexane solution of the catalyst is 1%), stir at room temperature for 15 minutes; then add allylboronic acid, Continue to stir for 5 minutes, then add dibutylzinc dilaurate, continue to stir for 1 hour, finally add N-benzylidene aniline, 2,3-epoxycyclopentyl cyclopentyl ether, and stir at 60°C for 30 minutes to obtain Modified epoxy systems; 2-methylpentanal, ethanol, catalyst in hexane, allylboronic acid, dibutylzinc dilaurate, N-benzylidene aniline, 2,3-epoxycyclopentyl The mass ratio of cyclopentyl ether is 5: 20: 1: 4: 0.002: 8: 100;

[0037] The chemical structural formula of described catalyst is:

[0038]

[0039] The chemical structural formula of described allyl boronic acid is:

[0040]

[0041] (2) Add mesoporous silica to concentrated sulfuric acid, ultrasonically treat (power 400W, frequency 20KHz) for 10 minutes and t...

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Abstract

The invention relates to a semi-curing sheet for high dielectric property copper clad laminate and preparation method thereof. The method includes the following steps of: adding methyl butynol2-methylbutyraldehyde into diglycidyl phthalate, stirring at 75 DEG C for 5 minutes, then adding 1, 8-octanedithiol, N, N-dicyclohexylcarbodiimide and stirring for 5 minutes, then adding modified silicon dioxide system, nano hollow alumina and stirring for 15 minutes, finally adding modified epoxy system, stirring at 125 DEG C for 2 hours to obtain the glue solution; adjusting the solid content of the glue solution to be 65% by using butanone / PMA mixture, then dipping the reinforced material 1080 glass cloth into the glue solution to obtain the prepreg. The prepreg is heated and dried to obtain thesemi-curing sheet for the high dielectric property copper clad laminate. The modified epoxy resin-based copper clad laminate is prepared, has excellent dielectric property and heat resistance, and meets the development and application of the modified epoxy resin-based copper clad plate.

Description

technical field [0001] The invention belongs to the technical field of electronic composite materials, and in particular relates to a prepreg for copper-clad laminates with high dielectric properties and a preparation method thereof. The obtained product can be used in the fields of aerospace, signal transmission, and electronic communication. Background technique [0002] With the continuous development of science and technology, the application of polymer matrix composites is becoming more and more extensive. At the same time, various application fields also put forward higher requirements for different materials. Especially in cutting-edge science and technology fields such as the aerospace industry, the performance requirements of materials are more stringent. For example, they require composite materials to have high specific strength, high specific stiffness, high temperature resistance, and ablation resistance. The copper clad laminate is obtained by hot pressing of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/02C08K9/10C08K7/26C08K7/24C08K7/14C08G59/68
CPCC08G59/686C08K7/14C08K7/24C08K7/26C08K9/02C08K9/10C08K2201/011C08L63/00
Inventor 徐伟红夏宇朴龙星梁国正
Owner 苏州巨峰新材料科技有限公司
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