Modified epoxy resin-based copper clad laminate and preparation method thereof

Abstract

The invention relates to a modified epoxy resin-based copper clad laminate and a preparation method thereof. The preparation method comprises: adding a modified silica foam system into a bifunctionalepoxy system, stirring for 30 min at a temperature of 120 DEG C, adding a monofunctional epoxy system and hollow nanometer alumina at a temperature of 95-105 DEG C, and stirring for 20 min to obtain aglue solution; and carrying out hot pressing molding on the glue solution, a reinforcing material and metal foil to obtain a modified epoxy resin-based copper clad laminate, wherein the obtained modified epoxy resin-based copper clad laminate has excellent flame retardancy and excellent heat resistance, such that the development and application of modified epoxy resin-based copper clad laminatescan be met.

Description

technical field [0001] The invention belongs to the technical field of electronic composite materials, and in particular relates to a modified epoxy resin-based copper clad laminate and a preparation method thereof. The obtained product can be used in the fields of aerospace, signal transmission and electronic communication. Background technique [0002] The printed circuit board is formed by the copper clad laminate after the circuit is made. The copper clad laminate is obtained by hot pressing the glass cloth and the resin layer and the conductor layer attached to the glass cloth. Therefore, the main performance of the PCB board, especially the signal transmission performance, only needs CCL decision, while the performance of CCL has a great relationship with the resin matrix. With the development of light, thin, small, high-density, and multi-functional electronic products, the assembly density and integration of components are getting higher and higher, the frequency of ...

AI Technical Summary

Problems solved by technology

At present, the reactive phosphorus-based flame retardants widely used in the field of copper clad laminates are mainly DOPO compounds, mainly phosphorus-containing epoxy resins and phosphorus-containing phenolic resins, and the phosphorus content is between 2-10%. However, practical applications It was found that DOPO compounds have a large water absorption rate and a high dielectric constant, and the board made of it has low heat and humidity resistance.

Simple resins can no longer meet the application of copper clad laminates. Even cyanate resins with better heat resistance have excellent dielectric properties (dielectric coefficient: 2.8-3.2; dielectric loss factor: 0.002-0.003), high Heat resistance (glass transition temperature: 280 ~ 295 ° C), while cyanate resin also has low shrinkage, excellent mechanical properties and bonding properties, etc., but also due to defects such as insufficient curing and brittleness, it has not been used in copper clad laminates. A large number of applications in the field

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