Electronic material and preparation method thereof

An electronic material, mesoporous silica technology, applied in the direction of electronic equipment, chemical instruments and methods, other household appliances, etc., to achieve the effect of good adhesion, excellent heat resistance and flame retardancy, and avoid adverse effects

Inactive Publication Date: 2018-07-27
SUZHOU YIKETAI ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Simple resins can no longer meet the application of copper clad laminates. Therefore, the use of composite technology not only integrates the advantages of organic and inorganic materials, but also matches different organic components. It is hopeful to prepare copper clad laminates that meet industrial applications.

Method used

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  • Electronic material and preparation method thereof

Examples

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Effect test

Embodiment 1

[0039] Embodiment 1 An electronic material, its preparation method comprises the following steps:

[0040] (1) Add mesoporous silica to concentrated sulfuric acid, filter to obtain a filter cake after ultrasonic treatment for 10 minutes, then wash and dry the filter cake to obtain acid-etched mesoporous silica; combine acid-etched mesoporous silica with normal After mixing ethyl silicate, stir at 150°C for 1 hour, then add 3,3'-dithiodipropionic acid and butyl acrylate, and stir at 70°C for 40 minutes to obtain a modified silica system;

[0041] (2) At room temperature, mix 3,3'-dithiodipropionic acid, dichloromethane, and acetone; then add pyridinium m-nitrobenzenesulfonate and manganese acetate, stir for 30 minutes, and then add N-methylolpropene Amide, after stirring for 3 hours, add 2,3-epoxy cyclopentyl cyclopentyl ether, after stirring for 50 minutes, add methylcyclohexene tetracarboxylic dianhydride, continue stirring for 20 minutes; then add N, N' -dicyclohexylcarbodi...

Embodiment 2

[0047] Embodiment 2 An insulating board for electronic materials, the preparation method of which comprises the following steps:

[0048] (1) Add mesoporous silica to concentrated sulfuric acid, filter to obtain a filter cake after ultrasonic treatment for 10 minutes, then wash and dry the filter cake to obtain acid-etched mesoporous silica; combine acid-etched mesoporous silica with normal After mixing ethyl silicate, stir at 150°C for 1 hour, then add 3,3'-dithiodipropionic acid and butyl acrylate, and stir at 70°C for 40 minutes to obtain a modified silica system;

[0049] (2) At room temperature, mix 3,3'-dithiodipropionic acid, dichloromethane, and acetone; then add pyridinium m-nitrobenzenesulfonate and manganese acetate, stir for 30 minutes, and then add N-methylolpropene Amide, after stirring for 3 hours, add 2,3-epoxy cyclopentyl cyclopentyl ether, after stirring for 50 minutes, add methylcyclohexene tetracarboxylic dianhydride, continue stirring for 20 minutes; then ...

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PUM

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Abstract

The invention relates to an electronic material and a preparation method thereof. The preparation method comprises the following steps: mesoporous silica is modified firstly, then epoxy with monofunctional groups and epoxy with bifunctional groups are prepared, and a glue solution is obtained by mixing; the glue solution, a reinforcing material and metal foil are subjected to hot-press molding, and the electronic material can be obtained. The electronic material has the excellent flame retardance and heat resistance, and requirements for development and application of the electronic material are met.

Description

technical field [0001] The invention belongs to the technical field of electronic composite materials, and in particular relates to an electronic material and a preparation method thereof. The obtained product can be used in the fields of aerospace, signal transmission, and electronic communication. Background technique [0002] The main performance of the PCB board, especially the signal transmission performance, is only determined by the CCL, and the performance of the CCL has a great relationship with the resin matrix. With the continuous development of science and technology, the application of polymer matrix composites is becoming more and more extensive. At the same time, various application fields also put forward higher requirements for different materials. Especially in cutting-edge science and technology fields such as the aerospace industry, the performance requirements of materials are more stringent. For example, they require composite materials to have high sp...

Claims

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Application Information

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IPC IPC(8): B32B17/02B32B15/20B32B15/14B32B17/06B32B27/04B32B7/06B32B7/12B32B37/12B32B37/10B32B37/06C08J5/24C08L63/00C08K9/04C08K9/02C08K7/26
CPCB32B5/02B32B7/06B32B7/12B32B15/14B32B15/20B32B17/061B32B37/06B32B37/10B32B37/12B32B2260/021B32B2260/046B32B2262/101B32B2307/202B32B2307/306B32B2307/50B32B2457/04B32B2457/08C08J5/24C08J2363/00C08K7/26C08K9/02C08K9/04
Inventor 彭代信宋晓静韩建
Owner SUZHOU YIKETAI ELECTRONICS MATERIAL
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