Disclosed is an improved process of the manufacture technology of semi-
colloid die-
cutting products. 1, in the procedure of compounding materials, a protective paper of which the size is wider than a double sticky tape via certain specification is chosen to proceed the double-faced compounding, which enables an upper layer protective paper and a lower layer protective paper of the double sticky tape to be equal in width, but to be a little bit wider than the double sticky tape via certain specification.2, the shape of the products is
cut by the die-
cutting of a
machine from the front surface in the manner of semi-
cutting, the key point is that a
handle portion is enabled to be
cut on the
adhesive-free protective paper, the left-right position of the material should be concentrated at any time, simultaneously, the
machine can automatically proceed arranging waste edges and cutting single sheet.3, finished products are produced after the
machine cuts sheet, inspectors check the positions of the semi-
adhesive, and the qualified products can be packed, consequently the procedure is finished. Take an ordinary semi-
adhesive product for example, 40,000 times of die-cutting can be finished in eight hours, and then 40,000 products can be produced by the calculation of one product by one time. The subsequent work of boding products by hand of 40,000 products
cut by the conventional technical process demands 15 persons and eight hours to accomplish. Compared with the conventional technical process, 40,000 products cut by the improved technology only demand one person and four hours to check and pack, thereby greatly saving labor resource and reducing cost.