Modified method for semi-glue die-cut product processing technique

A processing technology and product technology, which is applied in the field of improvement of the processing technology of semi-plastic die-cutting products, can solve the problems of unattainable cleanliness, low efficiency, secondary pollution of double-sided tape, etc.

Inactive Publication Date: 2008-05-28
TIANJIN NIUSIDA PACKAGE NEW TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the subsequent sequence requires manual operations by a large number of personnel, and the efficiency is low
At the same time, this process requires manual replacement of the protective paper, which is likely to cause secondary pollution of the double-sided adhesive tape and fail to meet the cleanliness requirements

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] Improve the original semi-adhesive die-cut product process, the improved semi-adhesive product processing method:

[0015] It consists of the following procedures:

[0016] 1. In the material compounding process, select a protective paper with a certain specification wider than the double-sided adhesive tape for double-sided compounding, so that the upper and lower layers of the double-sided adhesive tape have the same width but a certain specification wider than the double-sided adhesive tape.

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PUM

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Abstract

Disclosed is an improved process of the manufacture technology of semi-colloid die-cutting products. 1, in the procedure of compounding materials, a protective paper of which the size is wider than a double sticky tape via certain specification is chosen to proceed the double-faced compounding, which enables an upper layer protective paper and a lower layer protective paper of the double sticky tape to be equal in width, but to be a little bit wider than the double sticky tape via certain specification.2, the shape of the products is cut by the die-cutting of a machine from the front surface in the manner of semi-cutting, the key point is that a handle portion is enabled to be cut on the adhesive-free protective paper, the left-right position of the material should be concentrated at any time, simultaneously, the machine can automatically proceed arranging waste edges and cutting single sheet.3, finished products are produced after the machine cuts sheet, inspectors check the positions of the semi-adhesive, and the qualified products can be packed, consequently the procedure is finished. Take an ordinary semi-adhesive product for example, 40,000 times of die-cutting can be finished in eight hours, and then 40,000 products can be produced by the calculation of one product by one time. The subsequent work of boding products by hand of 40,000 products cut by the conventional technical process demands 15 persons and eight hours to accomplish. Compared with the conventional technical process, 40,000 products cut by the improved technology only demand one person and four hours to check and pack, thereby greatly saving labor resource and reducing cost.

Description

technical field [0001] The invention belongs to a processing method for semi-glue die-cut products, in particular to an improvement method for the processing technology of semi-rubber die-cut products. Background technique [0002] Semi-adhesive die-cutting products Double-sided adhesive die-cutting products are one of the main products in the die-cutting industry. The general double-sided tape die-cut products are half-cut products, that is, only the protective paper and double-sided tape on the surface layer are cut through, and the protective paper on the lower layer is not cut through, and the waste edge at the edge is peeled off at the same time. With the continuous improvement of customer requirements, more and more double-sided adhesive products require that on the basis of the original products, the upper protective paper has a part of the non-adhesive area as a handle for easy operation, which we call semi-adhesive products. That is to say, the upper and lower laye...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02
Inventor 周荣军
Owner TIANJIN NIUSIDA PACKAGE NEW TECH
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