The invention discloses a forming device of
metal ions via passing through deposition and bilateral constraint. The forming device consists of an outer mold,
grinding material particles, a
grinding wheel base body or inner mold, an
electroplating bath, an
electroplating liquid, a power supply, a
control system of the power supply and an
electroplating metal material, wherein the
grinding wheel body or inner mold is placed in the outer mold; an inner space is formed by the inner surface of the outer mold and the outer surface of the
grinding wheel base body or inner mold; the electroplating
metal material is arranged outside the outer mold and connected with the
anode of the power supply; the
grinding wheel base body or inner mold is connected with the
cathode of the power supply; and the
grinding wheel base body or inner mold is integrally connected with the outer mold through a clamp. After
electrification, the metal cations on the electroplating metal material swim through the electroplating liquid and pass through the micro pores on the outer mold to reach the outer surface of the grinding wheel base body or inner mold under the action of an
electric field, so as to attach a metal electroplating layer on the grinding wheel base body or inner mold. The invention also discloses a forming method of metal ions via passing through deposition and bilateral constraint, and the method comprises eight steps. The forming device and method have practical value in the electroplating and
abrasive machining fields.