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Forming method and device of metal ions via passing through deposition and bilateral constraint

A metal ion and electroplating metal technology, which is applied in the direction of electrolytic coating, coating, plating tank, etc., to achieve low-cost characteristics and solve the effect of direct electroforming processing

Active Publication Date: 2014-05-14
陈谦 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The deposition process is essentially over when the metal plating is in contact with the inner surface of the outer mold

Method used

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  • Forming method and device of metal ions via passing through deposition and bilateral constraint
  • Forming method and device of metal ions via passing through deposition and bilateral constraint
  • Forming method and device of metal ions via passing through deposition and bilateral constraint

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Embodiment Construction

[0029] Figure 1a Schematic diagram of the structure of the metal ion through deposition and bidirectional confinement forming device;

[0030] Figure 1b Schematic diagram of the metal ion cross-deposition and bidirectional confinement forming device used to make electroplated grinding wheel blocks;

[0031] Figure 1c Schematic diagram of a region-selective electroplating wheel block for the metal ion traverse deposition and bidirectional confinement forming device;

[0032] Figure 2a An example diagram for making complex precision electroplated grinding wheels by using natural accumulation and ion passing through deposition, Figure 2b An example diagram for making complex and precise electroplating grinding wheels by centrifugal stacking and ion crossing deposition; Figure 2a Among them, 1 is the power supply and its control system; 2r is the electroplating metal material; 3r is the outer mold; 4r is the grinding wheel substrate; 5 is the metal ion; 6 is the electrop...

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PUM

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Abstract

The invention discloses a forming device of metal ions via passing through deposition and bilateral constraint. The forming device consists of an outer mold, grinding material particles, a grinding wheel base body or inner mold, an electroplating bath, an electroplating liquid, a power supply, a control system of the power supply and an electroplating metal material, wherein the grinding wheel body or inner mold is placed in the outer mold; an inner space is formed by the inner surface of the outer mold and the outer surface of the grinding wheel base body or inner mold; the electroplating metal material is arranged outside the outer mold and connected with the anode of the power supply; the grinding wheel base body or inner mold is connected with the cathode of the power supply; and the grinding wheel base body or inner mold is integrally connected with the outer mold through a clamp. After electrification, the metal cations on the electroplating metal material swim through the electroplating liquid and pass through the micro pores on the outer mold to reach the outer surface of the grinding wheel base body or inner mold under the action of an electric field, so as to attach a metal electroplating layer on the grinding wheel base body or inner mold. The invention also discloses a forming method of metal ions via passing through deposition and bilateral constraint, and the method comprises eight steps. The forming device and method have practical value in the electroplating and abrasive machining fields.

Description

technical field [0001] The invention relates to a method and a device for making electroplating grinding wheels and precise and complex micro parts through metal ion deposition and two-way constrained forming, belonging to the technical field of electroplating and grinding. Background technique [0002] Electroplated grinding wheel is a widely used grinding wheel. Currently, two manufacturing processes are mainly used: external plating method and internal plating method. The so-called external plating method refers to an electroplating method in which superhard diamond abrasives or CBN abrasives are directly coated on the grinding wheel substrate by electroplating. The internal plating method refers to firstly adhering the abrasive in a mold cavity with the same outer shape as the desired grinding wheel but with opposite concave-convexity by the same process as the external plating method, and then using a low-melting point alloy on the grinding wheel substrate and electropl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D15/00C25D5/00C25D1/00C25D17/02
Inventor 陈谦
Owner 陈谦
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