Optical module component packaging structure with refrigerator and packaging process

Abstract

The invention discloses an optical module component packaging structure with a refrigerator. The device comprises a heat dissipation cylinder body, a sealing cover body and an optical cable access cylinder body; a circle of heat dissipation fence is arranged on the outer wall of the heat dissipation cylinder body; a refrigerator long strip body is embedded in the inner wall; the cooling surface ofthe refrigerator long strip body is in sliding fit with a micro heat pipe through a U-shaped groove; a laser emitting head is erected at the evaporation end of the micro heat pipe and fixedly connected with a laser generator boss, and the middle of the micro heat pipe is fixedly connected with a concentric-square-shaped heat insulation frame and a supporting sliding rod; a laser generator boss, aconcentric-square-shaped heat insulation frame body, a first lens frame, an isolator cylinder body and a second lens frame are sequentially erected on the supporting sliding rod, and the supporting sliding rod is connected with the optical cable access cylinder body and an optical cable body in a clamped mode. The invention further provides a corresponding packaging process. According to the invention, a sealed rapid heat dissipation packaging structure is realized, the dustproof and waterproof functions are better, the structure is simple and clear, and the characteristics of simple structure and low cost of the existing coaxial packaging and the rapid heat dissipation characteristic of butterfly packaging are integrated at the same time.

Description

technical field [0001] The invention relates to the technical field of optical device packaging, in particular to an optical module component packaging structure with a refrigerator and a packaging process. Background technique [0002] TOSA, ROSA and electrical chips are the three parts with the highest cost proportion in optical modules, accounting for 35%, 23% and 18% respectively. The technical barriers in TOSA and ROSA mainly lie in two aspects: optical chip and packaging technology. [0003] Generally, ROSA is packaged with optical splitter, photodiode (to replace light voltage with voltage) and transimpedance amplifier (to amplify voltage signal), and TOSA is packaged with laser driver, laser and multiplexer. Among them, the heat dissipation speed of the laser driver and the laser is related to the operation stability of the entire chip. Therefore, the cooler is generally used outside the laser emitting cylinder, which is mainly used for heat dissipation of the laser...

AI Technical Summary

Problems solved by technology

[0005] The advantages of butterfly packaging are obvious, but it is certain that the packaging cost is much higher than that of TO-CAN coaxial packaging. The so-called TO-CAN coaxial packaging: the shell is usually cylindrical, because of its small size, it is difficult to build in refrigeration and heat dissipation is difficult , it is difficult to be used for high power output under high current, so it is difficult to be used for long-distance transmission

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