36results about How to "Increased junction" patented technology

An embodiment of the invention provides a semiconductor fabrication method. The method comprises forming an isolation region between a first and a second region in a substrate, forming a recess in the substrate surface, and lining the recess with a uniform oxide. Embodiments further include doping a channel region under the bottom recess surface in the first and second regions and depositing a gate electrode material in the recess. Preferred embodiments include forming source/drain regions adjacent the channel region in the first and second regions, preferably after the step of depositing the gate electrode material. Another embodiment of the invention provides a semiconductor device comprising a recess in a surface of the first and second active regions and in the isolation region, and a dielectric layer having a uniform thickness lining the recess.

A low resistance tunnel junction that uses a natural polarization dipole associated with dissimilar materials to align a conduction band to a valence band is disclosed. Aligning the conduction band to the valence band of the junction encourages tunneling across the junction. The tunneling is encouraged, because the dipole space charge bends the energy bands, and shortens a tunnel junction width charge carriers must traverse to tunnel across the junction. Placing impurities within or near the tunnel junction that may form deep states in the junction may also encourage tunneling in a tunnel junction. These states shorten the distance charge carriers must traverse across the tunnel junction.

A photodiode designed to capture incident photons includes a stack of at least three superposed layers of semiconductor materials having a first conductivity type The stack includes: an interaction layer designed to interact with incident photons so as to generate photocarriers, a collection layer to collect the photocarriers; a confinement layer designed to confine the photocarriers in the collection layer. The collection layer has a band gap less than the band gaps of the interaction layer and confinement layer. The photodiode also includes a region which extends transversely relative to the planes of the layers. The region is in contact with the collection layer and confinement layer and has a conductivity type opposite to the first conductivity type so as to form a p-n junction with the stack.

Method for assembling thermoelectric unicouples is provided and applied with silicon-based nanostructure thermoelectric legs. The method includes preparing and disposing both n-type and p-type thermoelectric material blocks in alternative columns on a first shunt material. The method includes a sequence of cutting processes to resize the thermoelectric material blocks to form multiple cingulated unicouples each having an n-type thermoelectric leg and a p-type thermoelectric leg bonded to a section of the first shunt material. Additionally, the method includes re-disposing these cingulated unicouples in a serial daisy chain configuration with a predetermined pitch distance and bonding a second shunt material on top. The method further includes performing additional cutting processes to form one or more parallel series of thermoelectric unicouples in daisy chain configuration. The first shunt material is coupled to a cold-side heat sink and the second shunt material is coupled to a hot-side heat sink.

An object of this invention is to provide a Schottky diode structure to increase the contact area at a Schottky junction between the Schottky Barrier metal and a semiconductor substrate. The larger contact area of the Schottky junction is, the lower of the forward voltage drop across the Schottky diode will be, thereby improving the performance and efficiency of the Schottky diode.

The present invention also discloses that a plurality of trenches with adjacent top mesas can be used to form a Schottky diode with even larger contact area, wherein the trenches are built using the isolation area between two cells of MOSFET with minimum extra overhead by shrinking the dimension of pitch between two trenches.

Gusset plates are incorporated for reinforcement at the junctions of the wide flanged, cross and longitudinal beams of a rig mat frame. The junctions thus have a square tubing configuration.

A reinforcing arrangement for reinforcing a joint portion between two support units of a foldable furniture object, comprising a first mounting unit which comprises a first mounting body and a first guiding member outwardly protruded from the first mounting body mounting on the first support unit; a second mounting unit which comprises a second mounting body and a second guiding member or a second guiding groove complimentary to and moveably engaging with the first mounting unit to define a maximum extending angle of movement, thereby the first and second support unit are guided to lock into position at an unfolded position at the maximum extending angle and to unlock at a folded position; and a connecting unit pivotally connecting the first support unit and the second support unit between which the two mounting units are positioned, thereby the joint portion is reinforced.

In a strip wind construction method, the invention provides a manufacturing method of a rubber member for a tire which can reduce an air remnant in a rubber member. A rubber member has an inside first layer formed by spirally winding a rubber strip from a starting point corresponding to any one of reference positions of a center position of a wound body and a side edge to the other reference position in an axial direction in a half region between the center position and an outer edge in a tire axial direction of a winding region, and a second layer formed by folding back from a starting point corresponding to the other reference position to the other in an axial direction, and the reference position corresponding to the starting pint is set to a line-symmetrical position around the center position.

The present invention provides a liquid container which has a check valve for preventing a flow of outside air into its inside and which is capable of maintaining the performance of the check valve constant. An ink pack (25) includes a bag portion (36), which holds an outlet portion by heat-welding. An internal space (S) is formed in the bag portion (36), and ink is contained therein. The outlet portion has a first flow path forming component (41). A first recess portion (47) is recessed from the one side surface (41a) of the first flow path forming component (41). First and second ink flow paths (46, 51), which communicate with the internal space (S), extend from a bottom surface (47a) of this first recess portion (47). A valve seat (53) is formed in a projecting shape so as to surround the second ink flow path (51). A laminate film (36a) sealingly closes the first recess portion (47). Thus, a valve body accommodating chamber (55) is formed. The valve body accommodating chamber (55) accommodates a first valve body (58). The valve body (58) and the valve seat (53) form a first valve device (59).

An apparatus for a facility for additively manufacturing a component having a base forming a manufacturing surface, wherein the base includes a plurality of portions, and a plurality of temperature sensors being arranged in or below the manufacturing surface. At least one temperature sensor is further arranged in each portion and the temperature sensors are configured such that a temperature of each of the portions can be measured individually by the temperature sensors.

A thin film transistor array panel is provided according to one or more embodiments. In an embodiment, the thin film transistor array panel includes: a base substrate that has a display area and a peripheral area; a plurality of thin film transistors that are formed in the display area; a plurality of signal input pads that are formed in the peripheral area and that are formed long in a first direction; and a plurality of signal lines that are connected to the thin film transistors and the signal input pads, wherein at least a part of each of the plurality of signal input pads is arranged in a line along the first direction.

Diodes for use in FinFET technologies having increased junction electric fields without the need for increased dopant concentrations, as well as methods, apparatus, and systems for fabricating such diodes. The diodes may comprise a semiconductor substrate and a plurality of fins formed on the semiconductor substrate; wherein each of the plurality of fins comprises an N channel doped region comprising an N channel dopant, and the semiconductor substrate further comprises a plurality of P channel doped regions comprising a P channel dopant, wherein each of the P channel doped regions is disposed under one of the plurality of fins and is adjacent to the N channel doped region of the fin.

Provided are dietary supplement composition comprising one or both of L-theanine and a trace mineral complex, optionally in combination with bioactive peptides, in an amount or amounts individually or in combination effective to promote gut health. Further optional components include a fiber oligosaccharide prebiotic, a polyphenol prebiotic, and a polynucleotide or blend. Examples of benefits include one or more of: —an increase in the amount of total short-chain fatty acid production or of at least one of propionate, acetate and butyrate; —an increase the expression or level of at least one tight junction protein (for example, claudin-1, claudin-3, claudin-4, occludin, or a zona occludens protein) or mucin-3 or decrease the expression or level of claudin-2; —an increase in transepithelial electrical resistance; —an increase in the abundance or diversity of a member or phylum of the intestinal bacterial community of the Intestinal lumen or mucus area (for example, Firmicutes, Bacteroidetes, Lactobacilli, Bifidobacteria, F. prausnitzii, or A. muciniphila); —an increase in the expression or level of at least one intestinal surface area marker protein (for example, villin, myosin, cadherin or sucrase-isomaltase). Methods for using such supplements are also disclosed.