3488 results about "N channel" patented technology

The gate electrode of a crystalline TFT is constructed as a clad structure which consists of a first gate electrode, a second gate electrode and a third gate electrode, thereby to enhance the thermal resistance of the gate electrode. Besides, an n-channel TFT is provided with a low-concentration impurity region which adjoins a channel forming region, and which includes a subregion overlapped by the gate electrode and a subregion not overlapped by the gate electrode, thereby to mitigate a high electric field near the drain of the TFT and to simultaneously prevent the OFF current of the TFT from increasing.

A family of semiconductor devices is formed in a substrate that contains no epitaxial layer. In one embodiment the family includes a 5V CMOS pair, a 12V CMOS pair, a 5V NPN, a 5V PNP, several forms of a lateral trench MOSFET, and a 30V lateral N-channel DMOS. Each of the devices is extremely compact, both laterally and vertically, and can be fully isolated from all other devices in the substrate.

An object is to realize high performance and low power consumption in a semiconductor device having an SOI structure. In addition, another object is to provide a semiconductor device having a high performance semiconductor element which is more highly integrated. A semiconductor device is such that a plurality of n-channel field-effect transistors and p-channel field-effect transistors are stacked with an interlayer insulating layer interposed therebetween over a substrate having an insulating surface. By controlling a distortion caused to a semiconductor layer due to an insulating film having a stress, a plane orientation of the semiconductor layer, and a crystal axis in a channel length direction, difference in mobility between the n-channel field-effect transistor and the p-channel field-effect transistor can be reduced, whereby current driving capabilities and response speeds of the n-channel field-effect transistor and the p-channel field-effect can be comparable.

A semiconductor integrated circuit device capable of achieving higher integration and simplification of manufacturing processes is provided. Circuitry is provided which includes a first N-channel MOSFET and a first p-channel MOSFET each having a gate insulating dielectric film with a first film thickness, wherein a poly-silicon layer making up a gate electrode is doped with an N-type impurity. The circuitry also includes a second N-channel MOSFET having a gate insulator film with a second film thickness thinner than the first thickness, wherein an N-type impurity is doped into a polysilicon layer making up a gate electrode, and a second P-channel MOSFET with a P-type impurity being doped into a polysilicon layer making up a gate electrode. The gate electrodes of the first N-channel MOSFET and first P-channel MOSFET are integrally formed and mutually connected together.

Display pixel circuits and a drive scheme utilizing a switching element operating in reverse direction in a data scan period to provide voltage reference are provided. Preferred embodiments and operation method leading to three-transistor solutions in current-control mode, common-cathode, and n-channel transistor drive configuration for light emitting device display are described.

A synchronous full bridge rectifier is controlled to provide a power factor near unity. The full bridge rectifiers are transistors each with a controlling input. The AC input signal and currents within the circuit are sensed and sent to a controller. In response, the controller output control signals to turn on / off the rectifying MOSFETS on a timely basis to form a power factor of near one with respect to the AC input signal. The full wave rectifier is made of N-channel MOSFET's, some with fast body diodes. The MOSFET's are rectifiers and PFC control elements. The result is a one stage synchronous rectifier with PFC. A solid state precision analog differential amplifier senses the AC line waveform and high frequency current transformers sense the currents. The controller accepts the inputs of the amplifier and the sensed currents and outputs control signals that turn on and off the four MOSFET's. The timing of turning on / off is arranged so that the current drawn from the AC source is sinusoidal and matches the phase of the sinusoidal AC source.

A semiconductor device and method of manufacture provide an n-channel field effect transistor (nFET) having a shallow trench isolation with overhangs that overhang Si—SiO2 interfaces in a direction parallel to the direction of current flow and in a direction transverse to current flow. The device and method also provide a p-channel field effect transistor (pFET) having a shallow trench isolation with an overhang that overhangs Si—SiO2 interfaces in a direction transverse to current flow. However, the shallow trench isolation for the pFET is devoid of overhangs, in the direction parallel to the direction of current flow.

A pixel circuit having a function of compensating for characteristic variation of an electro-optical element and threshold voltage variation of a transistor is formed from a reduced number of component elements. The pixel circuit includes an electro-optical element, a holding capacitor, and five N-channel thin film transistors including a sampling transistor, a drive transistor, a switching transistor, and first and second detection transistors. The sampling transistor samples and supplies an input signal from a signal line so as to be held into the holding capacitor. The driving transistor drives the electro-optical element with current in response to the held signal potential. The first and second detection transistors detect a threshold voltage of the drive transistor and supply the detected voltage into the holding capacitor in order to cancel an influence of the threshold voltage in advance.

A complementary metal-oxide-semiconductor field effect transistor structure includes ion implants in only one of the two complementary devices. The transistor structure generally includes a compound semiconductor substrate and an epitaxial layer structure that includes one or more donor layers that establish a conductivity type for the epitaxial layer structure. The ion implants function to “invert” or “reverse” the conductivity type of the epitaxial layer structure in one of the complementary devices. In the example embodiment, p-type acceptor implants are utilized in the p-channel device, while the n-channel device remains implant-free.