30results about How to "Reduce processing failure" patented technology

In a vertical-type semiconductor device, a method of manufacturing the same and a method of operating the same, the vertical-type semiconductor device includes a single-crystalline semiconductor pattern having a pillar shape provided on a substrate, a gate surrounding sidewalls of the single-crystalline semiconductor pattern and having an upper surface lower than an upper surface of the single-crystalline semiconductor pattern, a mask pattern formed on the upper surface of the gate, the mask pattern having an upper surface coplanar with the upper surface of the single-crystalline semiconductor pattern, a first impurity region in the substrate under the single-crystalline semiconductor pattern, and a second impurity region under the upper surface of the single-crystalline semiconductor pattern. The vertical-type pillar transistor formed in the single-crystalline semiconductor pattern may provide excellent electrical properties. The mask pattern is not provided on the upper surface of the single-crystalline semiconductor pattern in the second impurity region, to thereby reduce failures of processes.

In a semiconductor device and a method of manufacturing the same, a first insulation layer is removed from a cell area of a substrate and a first active pattern is formed on the first area by a laser-induced epitaxial growth (LEG) process. Residuals of the first insulation layer are passively formed into a first device isolation pattern on the first area. The first insulation layer is removed from the second area of the substrate and a semiconductor layer is formed on the second area of the substrate by a SEG process. The semiconductor layer on the second area is patterned into a second active pattern including a recessed portion and a second insulation pattern in the recessed portion is formed into a second device isolation pattern on the second area. Accordingly, grain defects in the LEG process and lattice defects in the SEG process are mitigated or eliminated.

An operational control method is provided for a machine tool that includes a plurality of tool holders with a cutting-tool. The machine tool relatively moves the tool holders with respect to a workpiece to process the workpiece. The operational control method includes determining whether an abnormality has occurred in the cutting-tool during a processing or not, determining whether a simultaneous processing in which at least two or more of the tool holders perform the processings to an identical workpiece is being performed or not and whether the cutting-tool having the detected abnormality is the cutting-tool that is performing the simultaneous processing or not when the abnormality is detected, and causing the tool holder with the cutting-tool having the detected abnormality to take an abnormality avoidance operation and another of the tool holders to take a response operation based on a determination result at the determining of the simultaneous processing.

The invention discloses a method for machining spatial holes by using a large ellipsoid on a numerical control boring-milling machine. The method comprises the following steps of: determining the range and the clamping datum of a machined hole by applying a software analysis workpiece; compiling a numerical control machining program of the spatial hole; checking the numerical control machining program by applying simulation software; clamping and correcting according to a numerical control requirement and machining the spatial hole with an allowance; detecting the spatial position precision of the machined hole, adjusting the numerical control machining program according to a detection result and then machining the spatial hole to a required precision; and repeatedly clamping and machining a spatial hole in another range until holes on the workpiece are all machined. The invention has the advantages that multiple groups of spatial holes on the large ellipsoid can be machined by using a numerical control boring-milling machine, thereby meeting the requirement on the position precision; the maximum utilization ratio of a process is realized without being limited by the system of thenumerical control boring-milling machine, and the compiling of the machining program can be finished only by updating part models and mathematical parameters; and the process is safe and reliable andhas high efficiency.