268results about How to "Increase the on-resistance" patented technology

A converter circuit and related technique for providing high power density power conversion includes a reconfigurable switched capacitor transformation stage coupled to a magnetic converter (or regulation) stage. The circuits and techniques achieve high performance over a wide input voltage range or a wide output voltage range. The converter can be used, for example, to power logic devices in portable battery operated devices.

A power semiconductor device includes a plurality of trenches formed within a semiconductor body, each trench including one or more electrodes formed therein. In particular, according to embodiments of the invention, the plurality of trenches of a semiconductor device may include one or more gate electrodes, may include one or more gate electrodes or one or more source electrodes, or may include a combination of both gate and source electrodes formed therein. The trenches and electrodes may have varying depths within the semiconductor body.

A converter circuit and related technique for providing high power density power conversion includes a reconfigurable switched capacitor transformation stage coupled to a magnetic converter (or regulation) stage. The circuits and techniques achieve high performance over a wide input voltage range or a wide output voltage range. The converter can be used, for example, to power logic devices in portable battery operated devices.

A stereo class-D audio system includes a first die including four monolithically integrated NMOS high-side devices and a second a second die including four monolithically integrated PMOS low-side devices. The audio system also includes a set of electrical contacts for connecting the high and low-side devices to components within the a stereo class-D audio system, the set of electrical contacts including at least one supply contact for connecting the drains of the high-side devices to a supply voltage (Vcc) and at least one ground contact for connecting the drains of the low-side devices to ground, the electrical contacts also including respective contacts for each source of the high and low-side devices allowing the source of each high-side device to be connected to the source of a respective low-side device to form two H-bridge circuits.

In a semiconductor device in which a diode and a high electron mobility transistor are incorporated in the same semiconductor chip, a compound semiconductor layer of the high electron mobility transistor is formed on a main surface (first main surface) of a semiconductor substrate of the diode, and an anode electrode of the diode is electrically connected to an anode region via a conductive material embedded in a via hole (hole) reaching a p+ region which is the anode region of the main surface of the semiconductor substrate from a main surface of the compound semiconductor layer.

An MOS device is formed including a semiconductor layer of a first conductivity type, and source and drain regions of a second conductivity type formed in the semiconductor layer proximate an upper surface of the semiconductor layer. The source and drain regions are spaced apart relative to one another. A drift region of the second conductivity type is formed in the semiconductor layer proximate the upper surface of the semiconductor layer and at least partially between the source and drain regions, the drift region having an impurity doping concentration greater than about 2.0e12 atoms / cm2. An insulating layer is formed on at least a portion of the upper surface of the semiconductor layer. The device further includes a gate formed on the insulating layer at least partially between the source and drain regions, and a buried layer of the first conductivity type formed in the semiconductor layer in close relative proximity to and beneath at least a portion of the drift region. A substantially vertical distance between the buried layer and the drift region, and / or one or more physical dimensions of the buried layer are configured so as to optimize a power density of the device relative to at least one of an on-resistance and a maximum drain current of the device.

In a semiconductor device including a gate electrode buried in a trench of the device, the trench is constructed by a first opening with a uniform width the same as that of an upper portion of the first opening and a second opening beneath the first opening with a width larger than the uniform width. A bottom of a base region adjacent to the trench is adjacent to the second opening.

Embodiments of the present invention provide cross-coupled rectifiers that use near zero-threshold transistors in a switching topology, but provide a topology that avoids reverse conduction problems. Importantly, preferred embodiment rectifiers of the invention only provide a slightly increased on-resistance in each branch, while providing both very high operating efficiency and very low turn-on voltage. An embodiment of the invention is a voltage rectifier for the conversion of RF energy into DC voltage with a turn-on threshold voltages approaching 0V.

An MOS device is formed including a semiconductor layer of a first conductivity type, and source and drain regions of a second conductivity type formed in the semiconductor layer proximate an upper surface of the semiconductor layer. The source and drain regions are spaced apart relative to one another. A drift region of the second conductivity type is formed in the semiconductor layer proximate the upper surface of the semiconductor layer and at least partially between the source and drain regions, the drift region having an impurity doping concentration greater than about 2.0e12 atoms / cm2. An insulating layer is formed on at least a portion of the upper surface of the semiconductor layer. The device further includes a gate formed on the insulating layer at least partially between the source and drain regions, and a buried layer of the first conductivity type formed in the semiconductor layer in close relative proximity to and beneath at least a portion of the drift region. A substantially vertical distance between the buried layer and the drift region, and / or one or more physical dimensions of the buried layer are configured so as to optimize a power density of the device relative to at least one of an on-resistance and a maximum drain current of the device.

A transistor includes a first semiconductor layer formed on a substrate, a second semiconductor layer formed on the first semiconductor layer and has a band gap larger than that of the first semiconductor layer, a control layer formed on the second semiconductor layer and contains p-type impurities, a gate electrode formed in contact with at least part of the control layer and a source electrode and a drain electrode formed on both sides of the control layer, respectively. A third semiconductor layer made of material having a lower etch rate than that of the control layer is formed between the control layer and the second semiconductor layer.

There is a need for turning off a transistor in a power supply switch circuit irrespective of relative potential relationship between a contact power supply terminal and an internal power supply line and making it possible to decrease an on-resistance of an MOS transistor without increasing the size of the MOS transistor constituting the power supply switch circuit. The power supply switch circuit is comprised of two PMOS transistors whose gate terminals connect with two pull-up circuits. A charge pump circuit generates a negative voltage and is connected to a pull-down circuit. The pull-down circuit is connected to the gate terminals in common. During a contactless operation, the pull-up circuit short-circuits one gate terminal to a contact power supply terminal VDD and the other gate terminal to an internal power supply line VDDA. During a contact operation, the pull-up circuit supplies both gate terminals with a negative voltage from the charge pump circuit.

Improved highly reliable power RFP structures and fabrication and operation processes. The structure includes plurality of localized dopant concentrated zones beneath the trenches of RFPs, either floating or extending and merging with the body layer of the MOSFET or connecting with the source layer through a region of vertical doped region. This local dopant zone decreases the minority carrier injection efficiency of the body diode of the device and alters the electric field distribution during the body diode reverse recovery.

In a manufacturing method of a semiconductor device, first, a first semiconductor layer, a second semiconductor layer, and a p-type third semiconductor layer are sequentially epitaxially grown on a substrate. After that, the third semiconductor layer is selectively removed. Then, a fourth semiconductor layer is epitaxially grown on the second semiconductor layer. Then, a gate electrode is formed on the third semiconductor layer.

The invention discloses a synchronous rectification control method and circuit, and the method comprises a plurality of working steps. At a later working stage of synchronous rectification, a drain-source voltage rises to a closed-loop threshold voltage along with the decrease of a current, and a grid-source voltage starts to decrease, thereby enabling conduction resistance to increase. Through enabling a drain-source voltage of a synchronous rectification tube to be close to a reference voltage, the drain-source voltage remains equal to the closed-loop threshold voltage. Therefore, the drain-source voltage remains unchanged in a later period of synchronous rectification conduction, and primary side detection is enabled to be more accurate. Meanwhile, a grid-source switching-off threshold voltage is used for judging the switching-off time, thereby guaranteeing that the synchronous rectification tube is precisely switched off at a moment of current zero crossing.

The invention relates to the field of a radio frequency power device, and discloses a radio frequency SOI LDMOS device with close body contact. The device comprises bottom layer silicon, an embedding oxidation layer, top layer silicon, a P region an N region, a gate oxidation layer, a polysilicon gate layer, a gate poly-silicide layer, a gate electrode, a silicon nitride side wall, an N drift region, a drain region, a drain region silicide layer, a drain electrode, a source region, a body contact region, a body region, a source region silicide layer and a source electrode. The radio frequency LDMOS device is manufactured on an SOI substrate, and forms the close body contact which is in short circuit with the source region by utilizing a heavily doped region in the same form as the P region; the source / body, a drain / body and the gate and the electrodes are interconnected by the silicide; a plurality of gate bars are connected in parallel in the forked mode so as to improve the driving capability of the device; a method for adjustment, back-gate injection, N region injection and N drift region injection, which is compatible with the CMOS process, is designed; and a method for hiding the silicide in the N drift region, which is compatible with the CMOS process, is designed.

The invention discloses a shield gate trench MOSFET. The gate trench includes a top trench and a bottom trench. A polysilicon gate is formed on both sides of the top trench. Source polysilicon is located in the middle of the gate trench and extends longitudinally through the entire gate trench. Channel regions are formed on semiconductor substrate surfaces between gate structures and source regions are formed on the surfaces of the channel regions. A polysilicon gate on one side of the top trench is connected to a gate formed by a front metal layer. A polysilicon gate on the other side of the top trench and the source regions are connected to a source through a second contact hole to form a structure for reducing the gate-drain capacitance of a device. The second contact hole reduces the distance between the gate trenches and reduces the on-resistance of the device and form an on-resistance compensation structure. The invention also discloses a method for manufacturing the shield gate trench MOSFET. The shield gate trench MOSFET can reduce the gate-drain capacitance, can increase the switching speed of the device, and can reduce the size of a unit device and improve an integration level.

The invention discloses an LDMS (Laterally Diffused Metal Oxide Semiconductor) device with a stepped multiple discontinuous filed plate and a manufacturing method for the LDMS device. The LDMS device comprises a semiconductor body, wherein the semiconductor body comprises a semiconductor substrate region, a semiconductor epitaxial layer and a semiconductor medium layer which are sequentially arranged from bottom to top; a grid extending along a channel and at least two field plates are arranged in the semiconductor medium layer; at least two field plates are sequentially arranged in a horizontal direction from the grid to a leakage-drift region; a first field plate adjacent to the grid horizontally extends in the leakage-drift region; field plates which are not adjacent to the grid are respectively in a horizontal strip shape; the distance between every two field plates is greater than zero; the distance between a second field plate adjacent to the first field plate and the leakage-drift region is greater than the distance between a horizontally-extending part of the first field plate and the leakage-drift region; and the distance between other horizontal strip field plates and the leakage-drift region is gradually increased. According to the LDMS device disclosed by the invention, the contradiction between source and drain breakdown voltage and the optimal requirement of a conducting resistor is relieved and the performance of the LDMS device is improved.

A dummy bit line is provided between a pair of bit lines. The pair of bit lines is set at a power supply voltage and the dummy bit line is set at a ground voltage, and then the pair of bit lines and the dummy bit line are equalized. When a word line is activated in subsequent read operation, the pair of bit lines is at an intermediate potential lower than the power supply voltage, so that an apparent current drive capability of an access transistor decreases, and the static noise margin of a memory cell increases.

A method for manufacturing a semiconductor device includes the steps of: forming, on a principal face of a substrate, a semiconductor layer including a first semiconductor region of a first conductivity type; and forming, in the semiconductor layer, a trench having a bottom located in the first semiconductor region. The method further includes a step of forming a trench bottom impurity region being of a second conductivity type and covering the bottom of the trench by performing annealing to cause part of the semiconductor layer corresponding to an upper corner portion of the trench to move to be placed on the bottom of the trench.

A process for manufacturing a semiconductor device of the trench variety with reduced feature sizes and improved characteristics which process includes forming a termination structure having a field oxide disposed in a recess below the surface of the semiconductor die in which the active elements of the device are formed, and forming source regions after the major thermal steps have been performed.

A switch circuit includes a first MOS transistor and a second MOS transistor of a same conductivity type connected in parallel between a first terminal and a second terminal. The first and second MOS transistors have respective gate terminals coupled to the control terminal to receive a control signal to turn the switch circuit on or off where the control signal transitions from a first voltage level to a second voltage level at a slow rate of change. The first MOS transistor has a first threshold voltage and the second MOS transistor has a second threshold voltage where the first threshold voltage is less than the second threshold voltage

The invention discloses a power supply and a power supply system with multiple power supplies. The power supply is used for receiving an electric energy of an input voltage and generating an output voltage and an output current. The power supply comprises a power convertor, an output protecting circuit and a control unit, wherein the power convertor is used for receiving the electric energy of the input voltage and generating an inner output voltage; the output protecting circuit is connected with an output end of the power convertor and comprises a plurality of switch circuit sets in parallel connection; the output protecting circuit is used for limiting a current direction of the output current under an switch-on / off action of the switch circuit sets; the control unit is electrically connected with the output protecting circuit; and the control unit is used for outputting a plurality of control signals for respectively controlling the switch circuit sets, wherein at least two control signals are included and are used for respectively controlling at least two switch circuit sets to switch off at different moments. The power supply provided by the invention can be used for increasing power supply efficiency under the normal running of the power supply and the production cost is lower.

A semiconductor device includes a semiconductor substrate, a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a first semiconductor region of the first conductivity type, a second semiconductor region of the second conductivity type, a gate insulating film, and a gate electrode. The semiconductor device further includes, in a region of the first semiconductor layer across or adjacent to a p-n junction therein that does not overlap the second semiconductor region in a plan view except lateral edges thereof, a lifetime killer region having lifetime killers implanted therein.

A high voltage LDMOS transistor according to the present invention includes at least one P-field block in the extended drain region of the N-well. The P-field blocks form junction-fields in the N-well for equalizing the capacitance of parasitic capacitors between the drain region and the source region and fully deplete the drift region before breakdown occurs. A higher breakdown voltage is therefore achieved and the N-well having a higher doping density is thus allowed. The source region and P-field blocks enclose the drain region, which makes the LDMOS transistor self-isolated.

The subject matter disclosed herein relates to super-junction (SJ) power devices and, more specifically, to edge termination techniques for SJ power devices. A semiconductor super-junction (SJ) device includes one or more epitaxial (epi) layers having a termination region disposed adjacent to an active region. The termination region includes a plurality of vertical pillars of a first and a second conductivity-type, wherein, moving outward from the active region, a respective width of each successive vertical pillar is the same or smaller. The termination region also includes a plurality of compensated regions having a low doping concentration disposed directly between a first side of each vertical pillar of the first conductivity-type and a first side of each vertical pillar of the second conductivity-type, wherein, moving outward from the active region, a respective width of each successive compensated region is the same or greater.

The invention relates to a SiC junction barrier Schottky diode and a manufacturing method of the SiC junction barrier Schottky diode. The SiC junction barrier Schottky diode comprises a substrate of a first conductive type, an epitaxial layer of the first conductive type, a Schottky metal contact, a heavily doped region of a second conductive type, a light doped region of the second conductive type, a light doped trap of the second conductive type and an ohmic contact, wherein the epitaxial layer of the first conductive type is formed on the substrate, the Schottky metal contact is formed on the epitaxial layer, the heavily doped region of the second conductive type is formed below the Schottky metal contact, the light doped region of the second conductive type is formed below the heavily doped region, the light doped trap of the second conductive type is formed below the light doped region, the width of the light doped trap is smaller than that of each light doped region, and the ohmic contact is formed on the reverse side of the substrate. The SiC junction barrier Schottky diode can obviously reduce the electric field concentration effect in the corner of a PN junction, and further improves the reverse breakdown voltage of a device and a quality factor (BFOM) value of Baliga.

This semiconductor device that is provided with a vertical semiconductor element has a trench gate structure and a dummy gate structure. The trench gate structure has a first trench (7) which is formed to reach a first conductivity-type region (2b) in a super junction structure by penetrating a first impurity region (5) and a base region (4). The dummy gate structure has a second trench (10), which reaches the super junction structure by penetrating the base region (4), and is formed deeper than the first trench (7).