The invention provides a lamination sheet type coil integration member, comprising at least two coils and a plurality of insulating layers. Each coil comprises multi-layer electrode patterns connected layer upon layer in a spiral shape, the electrode pattern layers in different coils are embedded, staggered and overlapped with each other, the insulating layers are positioned between the adjacent electrode pattern layers in the different coils at intervals, and the adjacent electrode pattern layers in the same coil are electrically connected with each other by spanning the insulating layers positioned between the same. The invention also provides a forming method of the lamination sheet type coil integration member. The multi-layer electrode patterns of the two coils of the lamination sheet type coil integration member are embedded, staggered and overlapped with each other, thereby enhancing the utility ratio of space, the force factor of the coils and the integration density, being suitable for the requirement of the high-density assembly of a surface mounting technique and also being used for an inductance component, common mode signal inhibition, signal transformation, voltage change, and the like.