34results about How to "Short cooling path" patented technology

The invention provides a QFN surface-mounted RGB-LED encapsulation module and a manufacturing method thereof. The RGB-LED encapsulation module comprises an encapsulation bracket and light-emitting units arranged on the encapsulation bracket, wherein the number of the light-emitting units is at least two; the encapsulation bracket comprises a metal baseplate and an insulating frame; a bracket electrode for fixing crystal and bonding a wire is arranged at a region, where each light-emitting unit is located, by the metal baseplate; each light-emitting unit comprises an RGB-LED chip fixed on the metal baseplate and a bond and a wire for connecting the RGB-LED chip and a bracket electrode; a protective layer is arranged on each light-emitting unit; the bracket electrode is connected with an external circuit through a bonding pad arranged on the back of the metal baseplate. The encapsulation module is in direct contact with a PCB through the metal baseplate, so that chip heat can be quickly led out; a bowl-cup structure is formed on the front, so that a light-emitting surface is unique; the multiple light-emitting units are integrated on the one encapsulation module, so that the production efficiency is further improved.

The present invention provides an integrated RGB-LED display. The integrated RGB-LED display comprises a PCB board and a plurality of RGB-LED package modules welded to the PCB board; the package module comprises a package holder and a plurality of light emitting units arranged on the package holder; the number of light emitting units is at least two, and each set of light emitting units comprises a set of RGB-LED chips. According to the integrated RGB-LED display provided by the present invention, a plurality of light emitting units are integrated on a package module to further improve the production efficiency and reduce the production cost; and in addition, the plurality of light emitting units are integrated on a package module, so that overall resistance of the display to external mechanical strength is improved.

The invention relates to a high-reliability rectifier bridge device. The device comprises a first diode chip, a second diode chip, a third diode chip, a fourth diode chip and a negative pole metal strip which are wrapped by an epoxy packaging body; a first connecting sheet, a second connecting sheet, a third connecting sheet and a fourth connecting sheet are parallelly disposed in a front-rear direction; the front end of the negative pole metal strip, which is located between a first metal substrate and an E-shaped metal substrate, is provided with a bent portion; the bottom of the bent portion and the bottoms of the first metal substrate, a second first metal substrate and the E-shaped metal substrate are located on the same horizontal plane and all protrude out of the epoxy packaging body; the first metal substrate and the second metal substrate serve as alternating current input ends; the bent portion of the negative pole metal strips serves as a direct-current negative pole end; and the E-shaped metal substrate serves as a direct-current positive pole end. According to the high-reliability rectifier bridge device of the invention, a heat dissipation path between a chip and a PCB is the shortest; being made of a metal material, the heat dissipation sheets have optimal heat conductivity; and the heat dissipation capability of the PCB itself is fully utilized.

A package structure of light emitting diode includes a substrate and a light emitting diode die. The substrate has an upper surface and a lower surface opposite to each other. Two upper metal pads without mutual conduction are arranged on the upper surface. Two lower metal pads without mutual conduction are arranged on the lower surface. The light emitting diode die is disposed across the two upper metal pads. The light emitting diode die has a first electrode and a second electrode electrically connected to the two upper metal pads respectively. Wherein an orthographic projection area of one of the lower metal pads is greater than or equal to an orthographic projection area of the light emitting diode die, and the orthographic projection area of the light emitting diode die is totally located within the orthographic projection area of one of the lower metal pads.

The invention relates to the technical field of electric vehicle accessories, in particular to an elastically fixed radiator for an electric vehicle controller; On the upper top surface of the cavity, the outer side of a spring pressing edge is elastically pressed on the row of power switch tubes, so that the power switch tubes are pressed on the installation plane of the hollow inner cavity, and there is no need to install aluminum strips and power switch tubes one by one. The characteristics of convenient and fast installation, simplified production process, and reduced production cost; the present invention does not require bolts to pass through the power switch tube, avoiding the heat sink of the traditional heat sink due to the short creepage distance between the bolt and the power switch tube, which cannot fully meet the high voltage resistance The problem of insulation resistance requirements occurs; the heat dissipation path is shorter than the traditional heat sink, so that the heat can be dissipated faster, greatly reducing its overheating damage rate, and enhancing its service life.

The invention relates to a millimeter wave tile-type phased-array antenna TR module, and the invention aims at providing a TR module realization scheme with advantages of high reliability, low cost and high density integration for a millimeter wave frequency range high-power active phased-array antenna (APAA). The millimeter wave tile-type phased-array antenna TR module can be realized by the following scheme: a radio-frequency signal is fed from a radio-frequency vertical interconnection interface of a common port of the lower cavity bottom of the TR module, after the radio-frequency signal is performed the power distribution through a power divider mounting on the surface of a multi-layer circuit board and the like, the radio-frequency signal is fed in a multichannel amplitude-phase control chip connected with every transmit-receive channel, after the radio-frequency signal is performed the second power distribution by the multichannel amplitude-phase control chip, the amplitude-phase information of each channel radio-frequency signal is adjusted according to the state of the external control code and is outputted to a TR multi-function chip, the signal is amplified and outputted to the final power amplifier until saturation, the signal is outputted to a power switch, the emission access is gated, and the signal is transmitted to antenna radio-frequency vertical interconnection interfaces arranged on two ends of the cavity on the TR module; when the TR module receives a work, the radio-frequency signal passes through the TR module in a reverse direction.

The invention relates to the technical field of electric vehicle parts, particularly an electric vehicle controller heat dissipation device fixed by an elastic sheet. A heat dissipation seat of the heat dissipation device is provided with a long strip-shaped elastic sheet; a fixed edge of the long strip-shaped elastic sheet is fixed on the upper top surface of a hollow cavity through a connecting piece; the long strip-shaped elastic sheet is provided with a downward elastically pressing edge; the elastically pressing edge elastically abuts against power switch tubes arranged in rows at the inner side of the fixed edge, and therefore, the power switch tubes can abut against a mounting plane of the hollow cavity, and aluminum strips are not required to be mounted, and the power switch tubes are not required to be mounted one by one.; and thus, the electric vehicle controller heat dissipation device fixed by the elastic sheet is advantageous in convenient installation, simplification of production process and reduction of production cost; bolts are not required to pass through the power switch tubes, and therefore, the problem of incapability of fully satisfying a requirement of high-voltage resistant insulation resistance caused by close creepage distance between the bolts and the power switch tubes of a heat dissipation seat of a traditional heat dissipation device can be avoided; and the heat dissipation path of the heat dissipation seat is shorter than that of the traditional heat dissipation seat, such that, heat energy can be dissipated faster, and therefore, overheating damage rate of the heat dissipation seat is greatly reduced, and the service life of the heat dissipation seat can be prolonged.

The invention relates to a miniature bridge rectifier. According to the miniature bridge rectifier, a first metal substrate, a second metal substrate and an E-shaped metal substrate are located at thebottom of an epoxy packaging body and are distributed at the left side and right side of the epoxy packaging body; a negative pole metal strip is located between the first metal substrate, the secondmetal substrate and the E-shaped metal substrate; two ends of a first connecting sheet are electrically connected with the negative pole end of a first diode chip and the upper surface of the negative pole metal strip respectively; and the middle portion of a second connecting sheet is provided with a protruding portion which is isolated from the negative pole metal strip through the epoxy packaging body; a second positioning mechanism is composed of protruding points at two sides of the first metal substrate and two sides of the second metal substrate, and recessed portions at two sides of the tail end of the second connecting sheet and two sides of the tail end of a fourth connecting sheet, wherein the protruding points are embedded into the recessed portions; the thickness of the epoxypackaging body is smaller than 2 mm; and an end surface of the E-shaped metal substrate, which is located at the edge of the epoxy packaging body, is provided with four second pin outward-protrudingportions. An existing product dissipates heat through air convection in a chassis, as a result, the area of heat dissipation sheets can be 50% of the length*width area of the product, while, with theminiature bridge rectifier adopted, such kind of situation in the prior art can be avoided.

A fiber optic gyro combination device used for satellite attitude control, innovatively designed the system body in the structural form of H-shaped longitudinal section and mouth-shaped cross-sectional connection surface connecting four support columns. The system body is the main structure supporting each component, while ensuring three orthogonal mounting surfaces for the three orthogonal optical path components; in order to ensure the stable operation of the device, it provides an independent working area for the secondary power circuit components; the present invention It has a good heat dissipation design to ensure the accuracy and reliability of the equipment during the satellite's working process; the invention has sufficient structural natural frequency and good mechanical resistance. The present invention optimizes materials and processing methods for non-load-bearing parts (outer cover, bottom cover), and realizes light weight and low cost. The invention has good processability in designing and assembling, and modularizes components with relatively independent functions, and belongs to the technical field of structural design of optical fiber gyro devices.

The invention discloses an LED (light-emitting diode) dot matrix display screen which comprises a heat-dissipating substrate, LED light-emitting units, an imaging controller and a layout circuit conducting layer, wherein the LED light-emitting units are uniformly arrayed; each LED light-emitting unit is separately electrically connected with the imaging controller through the layout circuit conducting layer; the LED light-emitting units are fixed on the heat-dissipating substrate; the central position of every four adjacent LED light-emitting units is provided with a straight heat-dissipating through hole, each LED light-emitting unit is adjacent to the straight heat-dissipating through hole, and the straight heat-dissipating through hole passes through the heat-dissipating substrate; the LED dot matrix display screen also comprises a display-screen outline border, and the display-screen outline border is provided with an accommodating cavity (the bottom surface thereof is provided with an opening); and a position (facing to each LED light-emitting unit) on the front surface of the display-screen outline border is provided with a through hole for covering the LED light-emitting unit, the through hole is provided with a light-pervious seal plate, a position (close to the upside of the display-screen outline border) on the back face of the display-screen outline border is provided with heat-dissipating holes, and the back face of the display-screen outline border is also convexly provided with a rain cover for preventing rainwater from entering the accommodating cavity. The LED dot matrix display screen has the advantages of good heat dissipation and waterproof properties.

A lightweight lithium-ion battery module for an underwater device and a manufacturing method thereof. The overall structure of the module is an open structure with single-sided bonding and suspension support, including a panel, a first insulating plate, a battery stack, a second insulating plate, Guide supports, side supports, bottom supports, top supports, and electrical connectors. The first insulating board and the panel are respectively coated with silicone rubber and the silicone rubber is bonded together and cured for more than one day. The battery stack and the first insulating board are respectively coated with silicon rubber and bonded together and cured for more than five days. The second insulating board Installed to the other side of the battery stack for insulation without support. The guide support, the side support, the bottom support and the top support are not in contact with the battery stack. The invention adopts the one-sided adhesive suspension and flexible interconnection technology of the lithium-ion battery combination, which significantly reduces the specific gravity of the structural parts of the lithium-ion battery module and ensures its reliability at the same time.