Self-cooling semiconductor laser

Abstract

The invention provides a self-cooling semiconductor laser, which overcomes the problems of long heat transfer path, large thermal resistance, large volume and the like of a laser semiconductor adopting an existing heat dissipation structural form. The self-cooling semiconductor laser comprises a semiconductor laser working area and a substrate, wherein the semiconductor laser working area grows on the substrate, and the substrate is divided into a first substrate and a second substrate which are stacked up and down; the upper surface of the first substrate is in contact with the semiconductor laser working area and is a current diffusion flow-through area; a cooling flow channel is formed in the second substrate and is used for cooling the semiconductor laser working area; heat generated by the semiconductor laser working area is conducted to the second substrate through the first substrate and exchanges heat with a refrigerant flowing in the cooling flow channel in the second substrate, so that the path between a hot spot and the refrigerant is shortened, the thermal resistance is reduced, and the purpose of improving the overall heat exchange effect is achieved; and meanwhile, an external cooling heat sink is not needed, the overall size of the device is reduced, and integrated design is facilitated.

Description

technical field [0001] The invention relates to a semiconductor laser, in particular to a self-cooling semiconductor laser. Background technique [0002] Semiconductor lasers are widely used in laser communication, laser processing and other fields because of their high electro-optical conversion efficiency, high reliability, and long service life. However, when the semiconductor laser is in use, a certain amount of heat will be generated inside it, and as time accumulates, the higher temperature will affect the working performance of the semiconductor laser, or even completely damage the semiconductor laser. Therefore, heat dissipation is extremely important for semiconductor lasers. [0003] At present, external microchannel heat sinks are generally used to realize heat dissipation of semiconductor lasers, such as figure 1 As shown, the chip 01 is fixed on the heat sink 03 by the solder 02, and this structural form results in a large overall structural volume of the semi...

AI Technical Summary

Problems solved by technology

[0005] 1. The heat transfer path is long, the thermal resistance is large, and the cooling capacity is limited;

[0006] 2. As the temperature rises, the power of semiconductor chips is further limited;

[0007] 3. Larger cooling flow;

[0008] 4. The heat transfer path is long, the thermal resistance is large, and the cooling capacity is limited;

Images