LED base plate with high power and high heat dissipation efficiency

Abstract

The invention discloses an LED base plate with high power and high heat dissipation efficiency. The LED base plate comprise an LED light emitting chip, a circuit board, a rubber insulating layer and aheat dissipation device. The LED base plate is characterized in that the circuit board and the rubber insulating layer are directly solidified on the installation end surface of the heat dissipationdevice, namely the rubber insulating layer is arranged on the installation end surface of the heat dissipation device, the circuit board is arranged on the rubber insulating layer, and the LED light emitting chip is arranged in the circuit board. The LED light emitting chip, the circuit board and the rubber insulating layer are directly solidified on the installation end surface of the heat dissipation device, compared with a traditional structure, and the structure omits the structure of a base plate body and only has a two-layer structure; and no gap exists between the rubber insulating layer and the installation end surface of the heat dissipation device, so that an air layer cannot be formed; a heat dissipation path is short, so that the heat dissipation effect is greatly improved, theluminous efficiency of the LED light-emitting chip is improved, the light attenuation is small, the heat conduction and heat convection of the LED photoelectric base plate are enhanced, the defect ofexcessively high junction temperature of an LED is thoroughly overcome, and the service life of an LED light source is prolonged.

Description

technical field [0001] The invention relates to a heat dissipation technology of an LED lamp, in particular to an LED substrate with high heat dissipation performance, high power and high heat dissipation efficiency. Background technique [0002] At present, the heat dissipation structure of LED lamps in most enterprises adopts a three-layer structure, which are LED chip layer, aluminum substrate or PC board layer and heat dissipation device. The aluminum substrate or PC substrate has a rubber insulating layer and a circuit board, and the chip is packaged in aluminum The LED light source module is formed on the substrate or the PC substrate, and then the light source module is installed on the heat sink to manufacture an LED lighting source or lamp. There are obvious unreasonable places in this system. Screws are generally used to connect the substrate and heat sink. In this way, there must be a gap between the substrate and the heat sink to form an air layer, which greatly ...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a high-power, high-efficiency LED substrate that can enhance the heat dissipation capability of the LED lighting system based on the current state of the art. Heat conduction and heat convection, improve light efficiency, reduce light decay, greatly improve the life of LED light source

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