High-reliability rectifier bridge device

Abstract

The invention relates to a high-reliability rectifier bridge device. The device comprises a first diode chip, a second diode chip, a third diode chip, a fourth diode chip and a negative pole metal strip which are wrapped by an epoxy packaging body; a first connecting sheet, a second connecting sheet, a third connecting sheet and a fourth connecting sheet are parallelly disposed in a front-rear direction; the front end of the negative pole metal strip, which is located between a first metal substrate and an E-shaped metal substrate, is provided with a bent portion; the bottom of the bent portion and the bottoms of the first metal substrate, a second first metal substrate and the E-shaped metal substrate are located on the same horizontal plane and all protrude out of the epoxy packaging body; the first metal substrate and the second metal substrate serve as alternating current input ends; the bent portion of the negative pole metal strips serves as a direct-current negative pole end; and the E-shaped metal substrate serves as a direct-current positive pole end. According to the high-reliability rectifier bridge device of the invention, a heat dissipation path between a chip and a PCB is the shortest; being made of a metal material, the heat dissipation sheets have optimal heat conductivity; and the heat dissipation capability of the PCB itself is fully utilized.

Description

technical field [0001] The invention relates to a rectifying semiconductor device, in particular to a rectifying bridge stack device with high reliability. Background technique [0002] The rectifier is a bridge structure composed of four rectifying diodes. It uses the unidirectional conduction characteristics of the diodes to rectify the alternating current. Since the utilization efficiency of the bridge rectifier for the input sine wave is twice as high as that of the wave rectification, it is half of the diode. It is a significant improvement of wave rectification, so it is widely used in circuits that convert alternating current into direct current. [0003] On the one hand, the existing double-row laminated structure rectifier has a simple production process and is easy to operate. However, the flatness of the support sheet where each diode grain is located affects each other, resulting in unstable internal stress conditions during the production process, and damage to...

AI Technical Summary

Problems solved by technology

To sum up, the existing technology has the disadvantages that the product has a large thickness and takes up a large space on the PCB board, which is not suitable for the miniaturization of the terminal product; the heat dissipation performance of the product is not good, resulting in a large heat generation of the terminal product, which is not conducive to energy saving and environmental protection; the reflow soldering method is not suitable Soldering, when other products on the PCB board need to be soldered by reflow soldering, the entire PCB board needs to be heated twice, which will cause technical problems such as damage to the assembled devices

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