Miniature bridge rectifier

Abstract

The invention relates to a miniature bridge rectifier. According to the miniature bridge rectifier, a first metal substrate, a second metal substrate and an E-shaped metal substrate are located at thebottom of an epoxy packaging body and are distributed at the left side and right side of the epoxy packaging body; a negative pole metal strip is located between the first metal substrate, the secondmetal substrate and the E-shaped metal substrate; two ends of a first connecting sheet are electrically connected with the negative pole end of a first diode chip and the upper surface of the negative pole metal strip respectively; and the middle portion of a second connecting sheet is provided with a protruding portion which is isolated from the negative pole metal strip through the epoxy packaging body; a second positioning mechanism is composed of protruding points at two sides of the first metal substrate and two sides of the second metal substrate, and recessed portions at two sides of the tail end of the second connecting sheet and two sides of the tail end of a fourth connecting sheet, wherein the protruding points are embedded into the recessed portions; the thickness of the epoxypackaging body is smaller than 2 mm; and an end surface of the E-shaped metal substrate, which is located at the edge of the epoxy packaging body, is provided with four second pin outward-protrudingportions. An existing product dissipates heat through air convection in a chassis, as a result, the area of heat dissipation sheets can be 50% of the length*width area of the product, while, with theminiature bridge rectifier adopted, such kind of situation in the prior art can be avoided.

Description

technical field [0001] The invention relates to a rectifying semiconductor device, in particular to a miniature bridge stack rectifier. Background technique [0002] The rectifier is a bridge structure composed of four rectifying diodes. It uses the unidirectional conduction characteristics of the diodes to rectify the alternating current. Since the utilization efficiency of the bridge rectifier for the input sine wave is twice as high as that of the wave rectification, it is half of the diode. It is a significant improvement of wave rectification, so it is widely used in circuits that convert alternating current into direct current. [0003] On the one hand, the existing double-row laminated structure rectifier has a simple production process and is easy to operate. However, the flatness of the support sheet where each diode grain is located affects each other, resulting in unstable internal stress conditions during the production process, and damage to the grain or poor c...

AI Technical Summary

Problems solved by technology

To sum up, the existing technology has the disadvantages that the product has a large thickness and takes up a large space on the PCB board, which is not suitable for the miniaturization of the terminal product; the heat dissipation performance of the product is not good, resulting in a large heat generation of the terminal product, which is not conducive to energy saving and environmental protection; the reflow soldering method is not suitable Soldering, when other products on the PCB board need to be soldered by reflow soldering, the entire PCB board needs to be heated twice, which will cause technical problems such as damage to the assembled devices

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