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Heat sink and semiconductor refrigeration equipment

A heat dissipation device and heat conductor technology, applied in lighting and heating equipment, refrigerators, refrigeration and liquefaction, etc., can solve the problem of high energy consumption of semiconductor refrigeration equipment, achieve the effect of reducing energy consumption and improving heat dissipation capacity

Active Publication Date: 2019-03-05
QINGDAO HAIER SPECIAL ICEBOX
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, a fan is usually installed directly on the hot end of the semiconductor refrigeration module for air cooling, but in actual use, the fan needs to be in working state all the time, resulting in high energy consumption of the semiconductor refrigeration equipment

Method used

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  • Heat sink and semiconductor refrigeration equipment
  • Heat sink and semiconductor refrigeration equipment
  • Heat sink and semiconductor refrigeration equipment

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Embodiment Construction

[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] Such as Figure 1-Figure 2 As shown, the semiconductor refrigeration equipment in this embodiment includes at least two heat conduction inner tanks 100 spaced apart from each other, each of the heat conduction inner tanks 100 is provided with a semiconductor refrigeration module, and the semiconductor refrigeration module includes a se...

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PUM

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Abstract

The invention provides a cooling device and semiconductor refrigeration equipment. The cooling device comprises a plurality of radiators. Each radiator comprises a heat conductor, a plurality of heat pipes, a cooling fin set and a fan, wherein the heat pipes are connected to the heat conductor, the cooling fin set is connected to the heat pipes, and the fan and the cooling fin set are arranged side by side. An auxiliary heat pipe is further connected to each heat conductor, and the auxiliary heat pipe in any radiator is further connected with at least one cooling fin set in the rest of the radiators. Heat at the heat ends of semiconductor refrigeration modules is absorbed by means of the heat conductors, the heat conductors can transmit the heat to the cooling fin sets with large cooling areas through the heat pipes for automatic cooling, and the requirement for powering on the fans all the time for air cooling is avoided; and in addition, the heat conductors can conduct cooling by utilizing the cooling fin sets in the multiple radiators at the same time, so that the multiple cooling fin sets are in the cooling state all the time, and accordingly the cooling capacity of the multiple cooling fin sets is brought into full play, the cooling capacity of the semiconductor refrigeration equipment is improved, and energy consumption of the semiconductor refrigeration equipment is reduced.

Description

technical field [0001] The invention relates to a refrigeration device, in particular to a heat dissipation device and semiconductor refrigeration equipment. Background technique [0002] At present, refrigeration equipment (such as refrigerators, freezers, and wine cabinets) is an electrical appliance commonly used in people's daily life. Refrigeration equipment usually has a refrigeration system. Generally, the refrigeration system is composed of a compressor, a condenser, and an evaporator, which can achieve a lower temperature. of refrigeration. However, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for refrigeration is also widely used. The semiconductor refrigeration equipment in the prior art cools the storage space in the cabinet by releasing cold energy from the cold end of the semiconductor refrigeration module, and at the same time, the hot end of the semiconductor refrigeration mod...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B21/02F28D15/02
Inventor 肖长亮慕志光肖曦芦小飞杨末张进刘华
Owner QINGDAO HAIER SPECIAL ICEBOX
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