Heat dissipation assembly structure
A technology for assembling structures and heat dissipation components, which is applied in the direction of cooling/ventilation/heating transformation, etc., and can solve problems such as damage to electronic components, decreased performance, and increased heat dissipation costs
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[0030] A number of implementations of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some conventional structures and elements will be shown in a simple and schematic way in the drawings.
[0031] Please also refer to figure 1 and figure 2 ,in figure 1 A side view showing a heat dissipation assembly structure according to an embodiment of the present invention, figure 2 draw figure 1 An exploded view of the thermally assembled structure of . The heat dissipation assembly structure includes a circuit board 100 , a heat source 200 , a first heat dissipation element 300 , a second heat ...
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