Cobweb type micro channel heat radiation apparatus

Abstract

The invention discloses a cobweb type micro channel heat radiation apparatus. The cobweb type micro channel heat radiation apparatus includes a substrate, and is characterized in that the bottom of the substrate is provided with a fluid micro channel which is distributed uniformly in a cobweb shape; the center of the substrate is the central position of the fluid micro channel; the fluid micro channel radiates outward from the central position, and is displayed in the shape of circles with different diameter; the fluid micro channel takes the central position as the base to set *-shaped fluidmicro straight channels; the *-shaped fluid micro straight channels divide the fluid micro channel into 8 equal symmetrically distributed sectors; two ends of one of the *-shaped fluid micro straightchannels are respectively connected with cooling working medium inlet and outlet at the bottom of the substrate; and the inner wall of the fluid micro channel is wave-shaped, and a heat source is arranged at the central position of the substrate. The cobweb type micro channel heat radiation apparatus has the advantages of being simple in structure, being more uniform in overall heat radiation, andbeing able to improve heat radiation performance of a radiator.

Description

technical field [0001] The invention relates to a microelectronic high-power chip heat dissipation technology, in particular to a spider web type micro flow channel heat dissipation device. Background technique [0002] With the increasing demand for more functions, smaller size and higher integration of electronic products such as smart phones, tablet computers, mobile storage devices and automotive electronic devices. The system on chip (SOC) is to integrate a complete system on a single chip, including the central processing unit, memory, and peripheral circuits, etc., and the package system (SIP) tool will seal the chip with certain functions in a shell that is suitable for it. In the body, these two technologies have also been continuously improved, and the functions and function density realized by microelectronic chips have increased exponentially. As functions increase, power consumption and heat generation also increase. Studies have shown that more than 55% of ele...

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Problems solved by technology

[0003] In order to solve the heat dissipation problem of electronic components, it is necessary to innovate a new type of heat dissipation device. Luo Xiaobing and others proposed a heat dissipation device for microelectronic components. In the channel, the heat generated by the heat source is taken away by heat convection heat transfer, so as to achieve the effect of heat dissipation. There are certain problems in this traditional micro-channel cooling device. Because the micro-channel structure of the straight channel has a single flow channel direction, resulting in fluid The flow mode is laminar flow, which is not easy for the fluid to exchange heat with the wall of the flow channel, the overall convective heat transfer coefficient is reduced, and the heat dissipation efficiency is low

In order to improve the heat dissipation efficiency of the fluid, the fluid flow mode can be improved, and Jin Zunlong and Zhang Zhichao et al. provided a curved microchannel heat exchanger. Through this point, the curved microchannel structure was introduced, and the cooling medium is no longer a single flow. In the curved channel with a relatively large slope, the fluid flow path becomes tortuous, and at the same time, the heat exchange process between the cooling medium and the wall surface is increased. The entire curved channel has a corresponding improvement over the traditional straight channel radiator, but there are also certain The disadvantage is that there is a certain interval between adjacent channels, which makes the overall heat dissipation uneven; what’s more, the direction of the inlet and outlet of the cooling working fluid is still the front and back of the substrate, so there is a hidden danger to the inlet and outlet of the cooling working fluid, making the fluid The source is inconvenient to enter the microfluidic channel

[0004] Xia Guodong and others also proposed a micro-channel heat sink structure. This heat dissipation device is mainly used in the package heat dissipation of multi-chip components. Since the uneven temperature distribution in multi-chip components needs to consider the uniform heat dissipation of multiple areas, the structure uses Multiple micro-channel heat sinks are used for integrated heat dissipation, which can solve the problem of uneven heat sources in multi-chip modules, but the patented micro-channel structure is too simple, the heat dissipation area is too small, and there is still the problem of low efficiency of straight channel fluid convection heat transfer , and the import and export of cooling working fluid is too cumbersome

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