Heat-radiation packaging structure and packaging method

Abstract

The invention discloses a heat-radiation packaging structure and a packaging method which utilize a metal basal plate. The metal basal plate is provided with a plurality of conductive joints, a plurality of insulators, at least one chip, at least one light reflecting mirror and a packaging colloid, wherein the insulators are positioned in the metal basal plate and are arranged between the conductive joints; the chip is installed at the surface of the metal basal plate and is electrically connected with the conductive joints by a plurality of leading wires, and heat energy generated by the chipis dispersed by the metal basal plate; the light reflecting mirror is arranged at the periphery of the metal basal plate and increases the reflection efficiency of a light source; and the packaging colloid covers and protects the metal basal plate. The invention can maintain a favorable heat-radiation effect, simplify the packaging structure and the manufacturing procedure, and lower the production cost.

Description

【Technical field】 [0001] The invention relates to a semiconductor packaging technology, in particular to a heat dissipation packaging structure and a packaging method. 【Background technique】 [0002] In the early heat dissipation packaging structure, the copper foil printed circuit board was directly used as the heat dissipation medium, and the FR4 printed circuit board was most commonly used. However, as the component density becomes higher and higher, the speed requirements become faster and the power consumption of the assembled components is higher and higher, the heat energy will increase more and more, because the thermal conductivity of the FR4 printed circuit board is insufficient , so that it is gradually difficult to meet the heat dissipation requirements. [0003] Therefore, another metal core printed circuit board (Metal Core PCB, MCPCB) packaging structure that can effectively improve the heat dissipation problem has been proposed, such as figure 1 As shown, t...

AI Technical Summary

Problems solved by technology

However, due to the use of MCPCB as a heat dissipation medium, the heat conduction efficiency is limited, so that the heat dissipation effect is not perfect, and the volume of the heat dissipation package structure is relatively thick. The above two shortcomings will no longer meet the demands of high heat dissipation and high density of today's semiconductors.

Images