Composite graphene infrared radiation and heat conduction film and manufacturing method thereof

Abstract

The invention discloses a composite graphene infrared radiation and heat conduction film and a manufacturing method of the composite graphene infrared radiation and heat conduction film, and is characterized in that a substrate is provided with a composite graphene infrared radiation coating layer. According to the manufacturing method of the composite graphene infrared radiation and heat conduction film disclosed by the invention, a thin film manufactured by utilizing good infrared radiation capacity and good heat conduction capacity of a composite graphene infrared radiation material has the good heat conduction capacity in both directions which are parallel to and vertical to the substrate, so that heat can be rapidly transferred from a heating part to a heat sink device or an environment, the heat conduction efficiency is increased, local hot points in a device are removed, and temperature gradient in a heat conduction path is reduced; the composite graphene infrared radiation and heat conduction film disclosed by the invention has the advantages that the manufacturing is simple and convenient, and a powerful support is provided for high integration of electronic devices and rapid heat conduction of heating devices.

Description

technical field [0001] The invention relates to a high-performance heat-conducting material, in particular to a graphene composite infrared radiation heat-conducting film and a manufacturing method thereof. technical background [0002] With the high integration of electronic products, the computing speed and computing frequency are getting higher and higher, and electronic devices often generate a lot of heat locally, resulting in excessive local temperature, which makes the function of electronic devices invalid or even destructive, shortening the The service life of electronic devices. The lightness and thinning of modern electronic products requires that the heat sink cannot be made too large and heavy. Due to the limitation of the structure and shape of electronic devices, direct contact between the heating device and the heat sink is often impossible, which seriously affects the heat dissipation speed and efficiency. In addition, in traditional heating equipment, heat...

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Problems solved by technology

[0002] With the high integration of electronic products, the computing speed and frequency are getting higher and higher, and electronic devices often generate a lot of heat locally, resulting in excessive local temperature, which makes the function of electronic devices invalid or even destructive, shortening the Electronic device service life

The lightness and thinning of modern electronic products requires that the heat sink cannot be made too large or too heavy. Due to the limitation of the structure and shape of electronic devices, direct contact between the heating device and the heat sink is often impossible, which seriously affects the heat dissipation speed and efficiency.

In addition, in traditional heating equipment, heat is required to be transmitted to an ideal position in time, but the heat generated by current heating equipment is mainly transported through heat contact conduction and air convection heat conduction, which is inefficient and has a large temperature gradient. The heat transfer is not uniform, and it is urgent to improve the heat conduction efficiency

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