49results about How to "Easy thermoforming" patented technology

Thermotropic liquid crystalline polymers are produced by the reaction of a polyester made from an aromatic dicarboxylic acid and a diol, one or more hydroxycarboxylic acids, a stoichiometric excess of an aromatic diol, and a carboxylic acid anhydride. Also disclosed are novel liquid crystalline polymers that may be produced by this process. These liquid crystalline polymers are useful as molding resins and shaped articles thereof are produced. In particular, the articles include films, sheets, containers and portions thereof comprising these LCPs.

Polyester compositions that provide a higher throughput in calendering processes may be prepared from a polyester having crystallization half time of at least 5 minutes, an inherent viscosity of about 0.55 to about 0.75 dL / g, a branching monomer, and a release additive. The polyester compositions show a combination of excellent melt strength with good shear response that permits higher calendering line speeds before melt fracture occurs. Also disclosed are processes for film or sheet by calendering the above compositions and the film or sheet produced therefrom. The polyester compositions, film, or sheet also may include plasticizers and / or flame retardants to increase their flexibility and enable their use in commercial applications requiring flame resistance. The film and sheet have excellent appearance and can be used in a wide range of decorative and packaging applications.

The invention relates to a PU-integral skin carbon-containing foam for making shoe pads. The PU-integral skin carbon-containing foam comprises 65-75 parts of polyether polyol, 25-35 parts of POP grafted polyether, 10-15 parts of nanometer calcium powder, 2-3 parts of bamboo charcoal powder, 25-30 parts of diisocyanate, 2 parts of triethanolamine with the purity of 99%, 1 part of glycol, 1.5 parts of a foaming agent, 0.2 parts of high-resilience silicone oil and 0.1-0.5 parts of an amine catalyst. The foam is prepared through the following steps: stirring and mixing above raw materials, pumping the above obtained mixture solution into a foaming cylinder, injecting the obtained solution into a planar conveyor belt in the discharge process, controlling the foaming thickness by using a scraper pressure roller, slaking the solution on the conveyor belt in an oven, coiling when the integral skin side of the foam is completely slaked and is nonstick, and obliquely peeling the integral skin at the other side to obtain the finished foam. The PU-integral skin carbon-containing foam has the functions of compression deformation resistance, moisture absorption, humidity elimination and long-acting stinking prevention, and can be used to make shoe pads with durability and lasting elasticity and capable of maintaining dryness of foot vola and surfaces and inhibiting the peculiar smell in shoes.

The invention discloses a high-sound-insulation epoxy resin building material for architecture and relates to the technical field of building materials. According to the epoxy resin building material,a thermal radiation resisting layer, a sound insulating layer and a base layer structure which are subjected to hot-press forming from outside to inside are adopted, and three layer structures all adopt bisphenol A type epoxy resin as adhesives; in the sound insulating layer, carboxymethyl chitosan / sodium alginate is added to coat silicon dioxide aerogel microspheres, ingredients of silicon dioxide aerogel can be controllably released, thermal radiation is effectively partitioned, and a relatively small coefficient of thermal conductivity is kept; meanwhile, sound insulating and mechanical properties are excellent, the thermal radiation resisting layer can reinforce thermal radiation resistance through silicon dioxide aerogel micropowder, and a variety of fillers absorb noises of different frequencies. The epoxy resin building material disclosed by the invention is remarkable in heat-resisting, flame-retarding and sound-insulating effects and can be used in high-temperature environments of 150 DEG C to 300 DEG C.

A Y-doped pseudo-ternary semiconductor refrigeration material and a preparation method thereof, relating to a semiconductor refrigeration material and a preparation method thereof. The purpose is to solve the existing Bi 2 Te 3 The semiconductor-based cooling material is prone to splitting during the cutting process. The molecular formula of the Y-doped pseudo-ternary semiconductor refrigeration material is: (Bi 2 Te 3 ) (1‑2x) (Sb 2 Te 3 ) x (Bi 2 Se 3 ) x ‑Y, x in the molecular formula is 0.04~0.06. Preparation: Weigh yttrium powder, tellurium powder, bismuth powder, antimony powder and selenium powder as raw materials; the raw materials are mechanically alloyed, the sample is sintered in vacuum at high temperature, and finally hot-pressed. The mechanical properties of the Y-doped pseudo-ternary semiconductor refrigeration material prepared by the invention are greatly improved, and the problem of easy splitting is solved. The Y-doped concentration is 1% and the ZT value of the material at 300K when the Y-doped concentration is 1% and is hot-pressed at 200°C 0.73. The invention is suitable for preparing semiconductor refrigeration materials.

A preparation process of a mesh plug type patch belongs to the technical field of hernia repair patches, and in particular relates to a preparation process of a mesh plug type patch. It is characterized in that it includes the following steps: step 1, cutting the petal-shaped polypropylene mesh: cutting the polypropylene mesh into petal-shaped polypropylene mesh; step 2, processing the hot-pressing forming device: the hot-pressing forming device includes a base, the base The fixing holes are arranged on the base; the fixing holes are arranged vertically and horizontally on the base, and a shaping device is movably arranged on the fixing hole; 3. Heating and shaping: heating at 120°C-180°C for 90min-150min to set the shape; step 4, cooling and moulding: after cooling to 20°C-35°C, take out; step 5, sterilization of the packaged product: sterilize with ethylene oxide . The invention has the positive effects of simple process, low labor intensity and low scrap rate.