199results about How to "Dispersion suppression" patented technology

A display device used for a display unit of portable electronic equipment, a light source device therefor and a light guide plate, suppressing dispersion in the brightness and featuring a high contrast and a good display quality. The constitution includes a light incidence surface on where light emitted from an LED falls, a light reflection surface formed facing the light incidence surface and reflects light from the light incidence surface, a light outgoing surface arranged between the light incidence surface and the light reflection surface, and has a circularly polarizing plate intimately adhered onto the surface thereof, and an opposing surface formed facing the light outgoing surface and in which there are alternately arranged first opposing surfaces for guiding the incident light to the light outgoing surface as well as to the light reflection surface, and second opposing surfaces for emitting the light reflected by the light reflection surface through the light outgoing surface.

An optical fiber includes: a core at a center; a first cladding layer; a second cladding layer; and a third cladding layer. A maximum refractive index of the core is greater than any of maximum refractive indices of the first cladding layer, the second cladding layer, and the third cladding layer, and the maximum refractive index of the second cladding layer is smaller than any of the maximum refractive indices of the first and the third cladding layer. Additionally, a ratio of a2 / a1 is not less than about 2.5 and not more than about 4.5, where a1 represents the radius of the core, and a2 represents the radius of an outer periphery of the first cladding layer, and a relative refractive index difference of the core with respect to a maximum refractive index of the third cladding layer is not less than 0.20% and not more than 0.70%.

A method for forming a bump structure and a bump structure for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon, used as an electric connection in an electronic circuit, includes the steps of forming a mandrel by steps including forming at least one opening extending through a bump-forming die body in the thickness direction thereof and positioning a bump-forming die lid on a surface of the bump-forming die body so as to cover one end of the opening and to thereby define a bump-forming recess. The bump-forming die body may be comprised of a metal sheet. A metal layer is formed at least on an inner surface of the bump-forming die lid exposed within the bump-forming recess. The mandrel is removed so as to expose the metal layer and form a bump structure.

A sputtering method and a sputtering apparatus are provided in which a target is disposed being inclined relative to a substrate placed on a substrate-placing table so that the condition of d≧D is satisfied, (d is the diameter of the substrate, and D is the diameter of the target), and the total number of rotations R of the substrate-placing table from the beginning of film-deposition on the substrate to the completion thereof becomes ten or more. Also the sputtering method and the sputtering apparatus are provided in which the rotational speed V of the substrate-placing table is controlled so that the total number of rotations R thereof satisfies the formula of0.95×S−0.025≦R≦1.05×S+0.025at R≦10, (R is the total number of rotations of the substrate-placing table from the beginning of film-deposition on the substrate to the completion thereof, and S is the value of the number of total rotations R rounded off to integer).

A disk valve comprises an inlet port, an outlet port, a first disk provided with a first through hole communicating with the inlet port and extending axially and a second through hole communicating with the outlet port and extending axially, and a second disk provided with a concave capable of communicating with the first through hole and the second through hole of the first disk on one end face and slidably and movably contacting one end face of the first disk at the one end face. A closed space is formed radially outside the second disk, and the second disk slides relative to the first disk to adjust the degree of overlap between the concave of the second disk and the first through hole of the first disk. The slidably and movably contacting part between the first disk and the second disk is self-lubricated. The disk valve further comprises a communication passage for always placing the first through hole into communication with the closed space radially outside the second disk. A portion of the one end face of the first disk adjacent to the part slidably and movably contacting the second disk opposes the closed space

Disclosed is a method of manufacturing a multilayer wiring substrate having a principal plane of the substrate and a rear plane thereof, having a structure such that a plurality of resin insulating layers and a plurality of conductor layers are laminated, and a plurality of chip component connecting terminals to which chip components are connectable are disposed on the principal plane of the substrate. This method has a feature including a plating layer forming process in which product plating layers which provide the plurality of chip component connecting terminals and a dummy plating layer on the surrounding of the product plating layers are formed on the surface of an exposed outermost resin insulating layer at the principal plane of the substrate. This method permits a thickness dispersion of the chip component connecting terminals to be suppressed and permits a connection reliability thereof to the chip components to be increased.

A staggered grid 3D seismic prestack reverse time migration imaging method based on GPU small storage capacity is a very important technology for 3D prestack depth migration imaging of complex structures. The reverse time migration method based on the two-way wave equation has been realized, which can accurately image the rotary wave and the large-angle reflected wave, and at the same time solve the problem of the large amount of calculation of this method. Utilizing parallel computing technology based on GPU hardware, staggered grid difference format, checkpoint storage and other technologies, and relying on Laplace imaging conditions, the pre-stack reverse time migration imaging of 3D seismic data is realized, which greatly shortens the computing time. The efficiency has been increased hundreds of times, and the imaging accuracy has been significantly improved.

An information carrier in which an IC element formed integrally with a coil is mounted and which has an extended communication range and a method of manufacturing the same and a structure of the IC element appropriately suited for this sort of information carrier and a method of manufacturing the same. In the IC element, a conductor constituting the coil 3 is implemented in a multilayer structure including a metal-sputtered layer or alternatively a metal-evaporated layer 6 and a metal-plated layer 7. In the method of manufacturing the IC element, a precision electroforming method is employed as a means for forming the metal-plated layer 7. The information carrier is implemented in such a structure in which the IC element 1 is disposed at a center portion in a planar direction of a substrate 21. In a method of manufacturing the information carrier, strip material or materials 41 to 45 a given one of which has mounted thereon desired parts inclusive of the IC elements are manufactured, whereon desired information carriers 20a, . . . , 20h are formed by punching the strip material(s).

A method for forming a bump structure and a bump structure for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon, used as an electric connection in an electronic circuit, includes the steps of forming a mandrel by steps including forming at least one opening extending through a bump-forming die body in the thickness direction thereof and positioning a bump-forming die lid on a surface of the bump-forming die body so as to cover one end of the opening and to thereby define a bump-forming recess. The bump-forming die body may be comprised of a metal sheet. A metal layer is formed at least on an inner surface of the bump-forming die lid exposed within the bump-forming recess. The mandrel is removed so as to expose the metal layer and form a bump structure.

Processing technique using plasma to process the surface of a sample such as semiconductor device. The phases of RF bias voltages applied to a substrate electrode and an antenna electrode opposed thereto are controlled to be opposite to each other so that either one of the electrodes is forced to always function as ground. Therefore, the current flowing to cross the magnetic field for controlling the plasma is decreased, and the potential distribution difference in the surface of the sample to be processed is reduced, so that the charging damage can be suppressed. Energy of ions incident to the sample to be processed can be controlled to perform high-precision etching. The plasma potential can also be controlled so that the strength of the ion impact to the inner wall of the chamber can be reduced, thereby reducing particles detached from the inner wall of the processing apparatus to improve the throughput.

In an image recording apparatus equipped with plural printing heads each for jetting ink drops having a photo-setting property towards a recording medium, a conveyance unit for conveying the recording medium to the printing heads, and each of plural light radiation devices for radiating light to the ink drops landed on the recording medium to harden, is arranged at the downstream side of each of the plural printing heads, one having largest light energy, which is located at the most downstream position among the plural light radiation devices is determined at least to satisfy the light energy necessary for hardening of the ink drops jetted by any one of the printing heads positioned upstream thereof, and the light energy becomes smaller gradually for every light radiation device in the order from the light radiation device at the most downstream position to those at more upstream positions.

A method for manufacturing a head suspension is capable of suppressing the dispersion in the vibration control effect of a head suspension and improve productivity, the manufacturing method includes a step of punching, by use of a hollow punch having a tooth portion at a distal end thereof, a vibration damper piece out from a base material having a vibration damper provided detachably on a liner through an attaching surface, to hold the vibration damper piece on a hollow internal surface of the punch, a step of positioning the punch holding the vibration damper piece on an objective portion of a semi-finished head suspension, and a step of attaching, by use of an extruding implement, the vibration damper piece on the objective portion with the attaching surface through extruding the vibration damper piece from the punch.

An optical modulator and an optical transmission system convert continuous light of a multiple wavelength light source, which generates the continuous light with a fixed and complete phase but different frequencies, to a modulator driving signal so as to generate a light subcarrier with each frequency at the center and modulate the continuous light to the light subcarrier by using the modulator driving signal. In the case where an optical modulation is carried out by an optical IQ-modulator, transmitting data, for example, is converted to two parallel data A(t) and B(t), an I phase signal, in which the data A(t)+B(t) are modulated with a clock signal with a frequency ω, and a Q phase signal, in which the data A(t)−B(t) are modulated with a clock signal with a π / 2 phase shifted, are generated, and the I phase signal and the Q phase signal are applied to electrodes of the optical IQ-modulator, respectively.

On the back surface of a transparent plate having a light extracting part 14 for outputting lights to the outside, an electrode 16 for wiring, and an electrode 17 for an electromagnetic shield, an optical device 11 is flip-chip mounted right under the light extracting part 14, an a driver IC 12 is flip-chip mounted at a desired position with metal bumps 15. When currents driving the optical device 11 flow from the driver IC 12 according to an electric logical signal from the outside, an optical signal is emitted from the optical device 11, and is output to the outside through the light extracting part 14. The light extracting part 14 may be provided with a light coupling material or an optical axis converter.

A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 μm or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

A semiconductor memory device comprises a plurality of memory cells each having a source terminal and a drain terminal and a ferroelectric capacitor having a first terminal connected to the source terminal, wherein the plurality of memory cells are connected in series, and one or more selected transistors connected to at least one terminal of the series connected memory cells to constitute a memory cell block, the memory cell block having one terminal connected to a bitline and another terminal connected to a plate electrode, and wherein two memory cell blocks, which are respectively connected to two bit lines forming a bit line pair and also connected to the same word line, are respectively connected to a first plate electrode and a second plate electrode.

A memory transistor of an EEPROM has a floating gate electrode of a shape such that it covers the entirety of a tunnel film and a channel region and does not cover a region between the channel region and an embedded layer. And, a control gate electrode is formed on an interlayer insulating film on the floating gate electrode into a shape such that it is wider than the floating gate electrode above the tunnel film, and is narrower than the floating gate electrode above the channel region.

The magnetic recording medium includes an underlayer 12 formed of an inorganic compound layer, and a magnetic layer 13 formed over the underlayer 12. The inorganic compound layer as the underlayer 12 has crystal grains and at least one kind of oxide, the crystal grains having as main elements at least one of cobalt oxide, chromium oxide, iron oxide and nickel oxide, the at least one kind of oxide lying as a non-crystalline phase in grain boundaries between the crystal grains and selected from among silicon oxide, aluminum oxide, titanium oxide, tantalum oxide and zinc oxide.

The embodiment of the invention provides a globally optimized staggered mesh finite-difference forward simulation method and device. The method comprises the steps that a staggered mesh finite-difference operator is obtained; a target function is established based on a maximized norm and is calculated to obtain a staggered mesh finite-difference decentralization coefficient for optimizing the staggered mesh finite-difference operator, wherein the staggered mesh finite-difference decentralization coefficient is calculated in the maximum wave number coverage range of the optimized staggered mesh finite-difference operator and under the maximum spectrum error margin of the optimized staggered mesh finite-difference operator; the calculated staggered mesh finite-difference decentralization coefficient is adopted to optimize the spatial staggered mesh finite-difference operator, and forward simulation of seismic waves is performed. By adopting the scheme, absolute spectrum errors of the optimized staggered mesh finite-difference operator are more flexibly controlled, numerical value frequency dispersion is more effectively constrained, and the seismic simulation precision is improved.

A pn junction type Group III nitride semiconductor light-emitting device 10 (11) of the present invention has a light-emitting layer 2 of multiple quantum well structure in which well layers 22 and barrier layers 21 including Group III nitride semiconductors are alternately stacked periodically between an n-type clad layer 105 and a p-type clad layer 107 which are formed on a crystal substrate and which include Group III nitride semiconductors, in which one end layer 21m of the light-emitting layer 2 is closest to and opposed to the n-type clad layer, and the other end layer 21n of the light-emitting layer 2 is closest to and opposed to the p-type clad layer, both the one and the other end layers are barrier layers, and the other end layer 21n is thicker than the barrier layer of the one end layer.

Processing technique using plasma to process the surface of a sample such as semiconductor device. The phases of RF bias voltages applied to a substrate electrode and an antenna electrode opposed thereto are controlled to be opposite to each other so that either one of the electrodes is forced to always function as ground. Therefore, the current flowing to cross the magnetic field for controlling the plasma is decreased, and the potential distribution difference in the surface of the sample to be processed is reduced, so that the charging damage can be suppressed. Energy of ions incident to the sample to be processed can be controlled to perform high-precision etching. The plasma potential can also be controlled so that the strength of the ion impact to the inner wall of the chamber can be reduced, thereby reducing particles detached from the inner wall of the processing apparatus to improve the throughput.

A liquid jet head and apparatus prevent an increase in the viscosity of liquid in the liquid path during long term storage. The recording head has a liquid path unit 1 with nozzle openings 8, pressure generation chambers 7, liquid reservoirs 9, and a diaphragm 5, and a head case 2 bonded to the liquid path unit 1. A damper chamber 12 for releasing pressure change inside the liquid reservoir is formed at a part of the head case or seal plate 5 corresponding to the liquid reservoir 9. A release path 14B for releasing pressure in the damper chamber to the air is formed in the head case. A control path 14A communicating with the damper chamber and release path and having a specific flow resistance restricting dispersion of moisture vapor from the liquid is formed in the head case and / or seal plate.

Disclosed is a nonvolatile magnetic memory device including a magntoresistance device having a recording layer formed of a ferromagnetic material for storing information by use of variation in resistance depending on the magnetization inversion state. The plan-view shape of the recording layer includes a pseudo-rhombic shape having four sides, at least two of the four sides each include a smooth curve having a central portion curved toward the center of the pseudo-rhombic shape. The easy axis of magnetization of the recording layer is substantially parallel to the longer axis of the pseudo-rhombic shape. The hard axis of magnetization of the recording layer is substantially parallel to the shorter axis of the pseudo-rhombic shape. The sides constituting the plan-view shape of the recording layer are smoothly connected to each other.

In a high-frequency coil device having small dispersion in coil inductance and suitable for use in GHz band and a method of manufacturing the high-frequency coil device, a spirally-shaped fine-pitch coil is embedded in the surface of a polyimide layer as a dielectric substrate so that the bottom surface and side surface of the coil is covered by the polyimide layer. The spirally-shaped coil has an Ni—Cu laminate structure in which an Ni plating layer and a Cu plating layer are laminated, and also the side surface thereof is made substantially vertical while the width thereof is uniform with high precision. The surface of the spirally-shaped coil, that is, the surface of the Ni plating layer serving as the upper layer is coated with an Au plating layer.

A magnetic recording head and a method of manufacturing the magnetic recording head are provided. The perpendicular magnetic recording head includes a main magnetic pole layer and a return path layer that face each other with a gap therebetween in a lamination direction. A non-magnetic insulating layer is interposed between the main magnetic pole layer and the return path layer. At least one stepped portion is formed on a facing surface of at least one of the main magnetic pole layer and the return path layer.

Disclosed herein is a pixel circuit, including: three pixels to which three primary colors are allocated; a power supply line. In the pixel circuit, each of the three pixels includes a sampling transistor configured to sample an image signal, a retaining capacitor configured to retain the sampled image signal, a drive transistor configured to output drive current corresponding to the retained image signal within a predetermined light emission period, and a light emitting element configured to emit light in the color allocated to the three pixels in response to the drive current. The pixel circuit includes a single switching transistor disposed commonly to the three pixels for connecting the drive transistors of the pixels to the power supply line within the light emission period.