601results about How to "Suppress manufacturing cost" patented technology

A light emission apparatus includes: a wiring board; a plurality of LED chips that are disposed on an LED chip mounting surface of the wiring board and are grouped into a plurality of LED groups; a wavelength conversion member that is disposed at a position corresponding to the LED chip mounting surface of the wiring board, converts a wavelength of light emitted by the corresponding LED chips, and emits first-order light with a different color temperature for each wavelength conversion region; a current supply section that supplies a driving current to the LED chips independently for each LED group through the wiring board; and a control section that controls the current amount supplied for each LED group in response to a control signal. The control section independently controls timing of starting to light the LED groups in accordance with the light control level.

The lighting device includes a first resin layer having a first refractive index and a second resin layer having a second refractive index lower than the first refractive index and higher than the refractive index of the air, which are over a light-emitting element layer, a plurality of granules provided at the interface between the first resin layer and the second resin layer and each having the second refractive index or a plurality of projections each having an apex provided inside the first resin layer and a flat surface in contact with the interface between the first resin layer and the second resin layer and having the second refractive index, an uneven structure provided at the interface with the air, and a resin substrate having the second refractive index.

There is provided a printed circuit board having a differential signal transmission line composed of non-skew-adjusting portions and skew-adjusting portions. The non-skew-adjusting portion consists of parallel conductive traces spaced apart by a spacing. The skew-adjusting portion consists of a pair of meander traces for the skew adjustment. The skew-adjusting portion include convex transmission line segments and concave transmission line segments. The convex transmission line segment has parallel traces having a differential trace pair spacing greater than the differential trace pair spacing in the non-skew-adjusting portion. The concave transmission line segment has parallel traces having a differential trace pair spacing smaller than the differential trace pair spacing in the non-skew-adjusting portion.

The invention relates to a motor and a method of manufacturing the same. The motor includes a rotor having a shaft which has its center on a center axis extending in one direction; a stator which surrounds the rotor in the axial circumference, and includes a plurality of coils; and bus bars connecting coil ends extending from the coils. The bus bars may include a plate shape member bent in a thickness direction, a width direction of the bus bars being identical to an axial direction of the motor. Each of the bus bars may include a main body portion, and a coil end connection portion which extends from the main body portion and grips one of the coil ends at an opening that is open toward one direction within a plane perpendicular to the axial direction.

A spatial light modulator for changing transmittance of incident light from a light source to perform light modulation, the spatial light modulator comprising: a plane substrate transparent for the incident light; a first electrode being provided on the plane substrate; a deformable member being provided above the plane substrate and containing a second electrode placed with a gap above said first electrode, the deformable member deforming in response to an electrostatic force occurring as voltage is applied to said first electrode and the second electrode; and an optical function film being formed on the deformable member, wherein the optical function film has incidence angle dependency that the transmittance of the incident light changes in response to an incidence angle of the incident light on the optical function film, and is inclinable relative to the plane substrate in response to the electrostatic force.

A pressure container manufacturing method for manufacturing a pressure container by forming an outer shell made of a fiber reinforced composite material on a periphery of a liner, by: preparing a first fiber bundle which has a large diameter fiber bundle unimpregnated with a resin, and a second fiber bundle which has a small diameter fiber bundle and a thermoplastic resin covering the small diameter fiber bundle; forming a body on the periphery of the liner by braiding the first fiber bundle and the second fiber bundle with a braider; impregnating the first fiber bundle with the thermoplastic resin in the second fiber bundle which is heated and melted; and curing the thermoplastic resin to form the outer shell, wherein tension applied to the first fiber bundle is larger than tension applied to the second fiber bundle when forming the body and / or impregnating the thermoplastic resin.

Body or structural noise transmitted through a connector such as a strut, that connects a noise source, such as an engine, to an enclosure, such as a passenger cabin or cell of a helicopter, is suppressed by at least one piezoactuator which is excited to counteract any vibrations of the strut caused by body noise so that body noise vibrations are cancelled or at least substantially suppressed. The excitation of the piezoactuator is controlled in closed loop fashion in response to feedback signals from a sensor secured to the connector.

In a working vehicle in which a backhoe support frame for reinforcing is provided in a rear end portion of a vehicle body frame, and a transmission case is mounted on a rear portion of the vehicle body frame so as to be close to the backhoe support frame, each of support brackets provided in an outer side surface of a rear portion of each of main frames constructing the vehicle body frame so as to protrude outward is connected to a protruding end portion protruding to rightwardly and leftwardly relative to each of lower brace members in a reinforcing plate supporting a lower surface of the transmission case in a state in which a rear axle case protruding outward from the right and left side surfaces of the transmission case is sandwiched from upper and lower sides, in order to dissolve a risk that a load generated at a time of traveling in a backhoe installed state or at a time of an excavating work by the backhoe is propagated to the transmission case.

One object is to provide a semiconductor device that includes an oxide semiconductor and is reduced in size with favorable characteristics maintained. The semiconductor device includes an oxide semiconductor layer, a source electrode and a drain electrode in contact with the oxide semiconductor layer, a gate electrode overlapping with the oxide semiconductor layer; and a gate insulating layer between the oxide semiconductor layer and the gate electrode. The source electrode or the drain electrode includes a first conductive layer and a second conductive layer having a region extended in a channel length direction from an end face of the first conductive layer. The sidewall insulating layer has a length of a bottom surface in the channel length direction smaller than a length in the channel length direction of the extended region of the second conductive layer and is provided over the extended region.

A pressure container manufacturing method by forming an outer shell of a fiber reinforced composite material on a periphery of a liner having a cylindrical portion, dome portions connected to both ends of the cylindrical portion, and a mouth piece disposed on one top of the dome portions, has: forming a body on the periphery by braiding fiber bundles provided from bobbins of a braider disposed in a circumferential direction of the liner, while moving the liner in an axial direction, wherein when body formation reaches a root portion of the mouth piece, a movement in a first direction of the liner is stopped, each bobbin is rotated approximately a half-turn in the circumferential direction, and thereafter formation of the body is continued while moving the liner in a second direction opposite to the first direction; and curing a resin impregnated in the fiber bundles, to form an outer shell.

A binder material layer including an evaporation material is formed over a main surface of an evaporation source substrate, a substrate on which a film is formed is placed so that the binder material layer and a main surface thereof face each other, and heat treatment is performed on a rear surface of the evaporation source substrate so that the evaporation material in the binder material layer is heated to be subjected to sublimation or the like, whereby a layer of the evaporation material is formed on the substrate on which a film is formed. When a low molecular material is used for the evaporation material and a high molecular material is used for the binder material, the viscosity can be easily adjusted, and thus, film formation is possible with higher throughput than conventional film formation.

A bus bar (263) identified as a led-out conductor portion led out from a coil end (262) of a motor generator identified as an electrical apparatus, and a feeding terminal block (220) disposed at a spacing from the bus bar (263) and having a cable (3A) connected thereto, are connected by a connecting member (4). The connecting member (4) has a bent shape as a whole, and includes a misalignment absorbing portion (46) which is provided by bending a part of the connecting member (4) and is deformable to absorb misalignment between the bus bar (263) and the feeding terminal block (220).

A semiconductor device includes an oxide semiconductor layer, a source electrode and a drain electrode in contact with the oxide semiconductor layer, a gate electrode overlapping with the oxide semiconductor layer, and a gate insulating layer between the oxide semiconductor layer and the gate electrode, in which the source electrode or the drain electrode comprises a first conductive layer and a second conductive layer having a region which extends beyond an end portion of the first conductive layer in a channel length direction and which overlaps with part of the gate electrode, in which a sidewall insulating layer is provided over the extended region of the second conductive layer, and in which the sidewall insulating layer comprises a stack of a plurality of different material layers.

The invention relates to an X-Y address type solid-state image pickup device manufactured by a CMOS process, and has an object to provide an X-Y address type solid-state image pickup device in which a chip area is not increased, manufacturing costs are suppressed, and an image averaging processing can be carried out. Pixel regions Pmn are arranged in a matrix form in regions defined by horizontal selection lines RWm and vertical selection lines CLn. Each of the pixel regions Pmn includes a photodiode 10, a source follower amplifier 14 for converting an electric charge of the photodiode 10 into a voltage and amplifying it to output image data, and a horizontal selection transistor 16 for outputting the image data to a predetermined one of the vertical selection lines CLn. An amplifier / noise cancel circuit 6 has a built-in image averaging circuit for carrying out an averaging processing of the image data outputted from at least two of the plurality of the pixel regions Pmn.