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608results about How to "Suppress manufacturing cost" patented technology
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Fabric and method for sharing an I/O device among virtual machines formed in a computer system
InactiveUS7313637B2System reliability is assuredSuppress manufacturing costResource allocationError detection/correctionFailoverOperational system
Disclosed herein is a computer system provided with a mechanism for connecting a single port disk to an active server and the disk to a standby server when in a fail-over processing. An “add_pci” command issued from a clustering program is used to let a control program change the allocation of a PCI slot while an interruption signal issued to a standby server permits an ACPI processing routine to hot-add a PCI card that includes the disk unit on the subject guest OS.
Owner:HITACHI LTD
Light emission apparatus, illumination system and illumination method
InactiveUS20130141013A1Suppress manufacturing costSuppressing reduction in luminousPlanar light sourcesPoint-like light sourceDriving currentControl signal
A light emission apparatus includes: a wiring board; a plurality of LED chips that are disposed on an LED chip mounting surface of the wiring board and are grouped into a plurality of LED groups; a wavelength conversion member that is disposed at a position corresponding to the LED chip mounting surface of the wiring board, converts a wavelength of light emitted by the corresponding LED chips, and emits first-order light with a different color temperature for each wavelength conversion region; a current supply section that supplies a driving current to the LED chips independently for each LED group through the wiring board; and a control section that controls the current amount supplied for each LED group in response to a control signal. The control section independently controls timing of starting to light the LED groups in accordance with the light control level.
Owner:MITSUBISHI CHEM CORP
LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
ActiveUS20120313131A1Less discolorationImprove featuresSemiconductor/solid-state device detailsSolid-state devicesAlloySemiconductor
An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.
Owner:DAI NIPPON PRINTING CO LTD
Lighting device and method for manufacturing the same
InactiveUS20120217863A1Suppress manufacturing costReduce lighting costsIncadescent screens/filtersElectric discharge tubesRefractive indexChemistry
The lighting device includes a first resin layer having a first refractive index and a second resin layer having a second refractive index lower than the first refractive index and higher than the refractive index of the air, which are over a light-emitting element layer, a plurality of granules provided at the interface between the first resin layer and the second resin layer and each having the second refractive index or a plurality of projections each having an apex provided inside the first resin layer and a flat surface in contact with the interface between the first resin layer and the second resin layer and having the second refractive index, an uneven structure provided at the interface with the air, and a resin substrate having the second refractive index.
Owner:SEMICON ENERGY LAB CO LTD
Electronic apparatus and method for measuring direction of output laser light
ActiveUS20150369920A1Manufacturing cost be increaseAccurately seekOptical rangefindersHeight/levelling measurementLaser lightLight source
An electronic apparatus includes a light source that outputs a laser light; a scanning unit that scans the laser light; a reflective member having a reflective surface that reflects the laser light; a light-receiving unit that receives a first reflected light reflected by the reflective member; and a signal processing unit that calculates a distance from the light source to the reflective surface using the first reflected light and determines a direction in which the laser light is output using the distance.
Owner:FUNAI ELECTRIC CO LTD
Image processing apparatus, image processing system, imaging apparatus and image processing method
InactiveUS20050053307A1Amount of necessary be reduceSuppress memory capacityTelevision system detailsGeometric image transformationDistortion correctionImaging equipment
An image processing apparatus includes an zoom position acquiring section for acquiring a zoom position representing a lens position condition of the optical zoom mechanism on taking the inputted image, a zooming-direction decoding section for decompressing correction parameter associated with the zoom position, which is acquired by the zoom position acquiring section, according to a zoom compression parameter, into which a correction parameter for distortion correction corresponding to each lens position condition is compressed by utilizing zoom partitioning points at which lens position conditions of the optical zoom mechanism are sequentially partitioned into plural levels that are set between a wide-end and a tele-end and that include both ends, and an image correction section for correcting distortion of the inputted image according to the correction parameter decompressed by the zooming-direction decoding section.
Owner:SONY CORP
Printed circuit board
InactiveUS20110203834A1Reduce signal reflectionQuality improvementPrinted circuit aspectsMeanderDifferential signaling
There is provided a printed circuit board having a differential signal transmission line composed of non-skew-adjusting portions and skew-adjusting portions. The non-skew-adjusting portion consists of parallel conductive traces spaced apart by a spacing. The skew-adjusting portion consists of a pair of meander traces for the skew adjustment. The skew-adjusting portion include convex transmission line segments and concave transmission line segments. The convex transmission line segment has parallel traces having a differential trace pair spacing greater than the differential trace pair spacing in the non-skew-adjusting portion. The concave transmission line segment has parallel traces having a differential trace pair spacing smaller than the differential trace pair spacing in the non-skew-adjusting portion.
Owner:HITACHI LTD
Motor and method of manufacturing the same
ActiveCN105743288ASuppress manufacturing costWindings insulation shape/form/constructionManufacturing dynamo-electric machinesMechanical engineeringStator
The invention relates to a motor and a method of manufacturing the same. The motor includes a rotor having a shaft which has its center on a center axis extending in one direction; a stator which surrounds the rotor in the axial circumference, and includes a plurality of coils; and bus bars connecting coil ends extending from the coils. The bus bars may include a plate shape member bent in a thickness direction, a width direction of the bus bars being identical to an axial direction of the motor. Each of the bus bars may include a main body portion, and a coil end connection portion which extends from the main body portion and grips one of the coil ends at an opening that is open toward one direction within a plane perpendicular to the axial direction.
Owner:NIDEC CORP
Spatial light modulator, spatial light modulator array, and image formation apparatus
InactiveUS7027206B2Simple configurationReduce restrictionsProjectorsSemiconductor/solid-state device manufacturingSpatial light modulatorPlanar substrate
Owner:FUJIFILM CORP +1
Pressure container manufacturing method
InactiveUS20050077643A1Manufacturing cost be suppressManufacturing time be shortenDomestic netsBraidFiber bundleFiber-reinforced composite
A pressure container manufacturing method for manufacturing a pressure container by forming an outer shell made of a fiber reinforced composite material on a periphery of a liner, has: preparing a first fiber bundle which has a large diameter fiber bundle unimpregnated with a resin, and a second fiber bundle which has a small diameter resin bundle and a thermoplastic resin covering the small diameter resin bundle; forming a body on the periphery of the liner by braiding the first fiber bundle and the second fiber bundle with a braider; impregnating the first fiber bundle with the thermoplastic resin in the second fiber bundle which is heated and melted; and curing the thermoplastic resin to form the outer shell, wherein a tension applied to the first fiber bundle is larger than a tension applied to the second fiber bundle when forming the body and / or impregnating the thermoplastic resin.
Owner:SUBARU CORP
Semiconductor device
ActiveUS20090080257A1Reduce semiconductor areaReduce chip areaSolid-state devicesRead-only memoriesEngineeringSemiconductor
The chip area of a semiconductor device including a nonvolatile memory is reduced. The semiconductor device includes a first memory cell and a second memory cell which are formed on the principal surface of a substrate, and arranged adjacent to each other. In a principal surface of the substrate, active regions which are electrically isolated from each other are arranged. In the first active region, the capacitor element of the first memory cell is arranged, while the capacitor element of the second memory cell is arranged in the fourth active region. In the second active region, the respective write / erase elements of the first and second memory cells are both arranged. Further, in the third active region, the respective read elements of the first and second memory cells are both arranged.
Owner:RENESAS ELECTRONICS CORP
Pressure container manufacturing method
InactiveUS7566376B2High strengthLight weightDomestic netsBraidFiber bundleFiber-reinforced composite
A pressure container manufacturing method for manufacturing a pressure container by forming an outer shell made of a fiber reinforced composite material on a periphery of a liner, by: preparing a first fiber bundle which has a large diameter fiber bundle unimpregnated with a resin, and a second fiber bundle which has a small diameter fiber bundle and a thermoplastic resin covering the small diameter fiber bundle; forming a body on the periphery of the liner by braiding the first fiber bundle and the second fiber bundle with a braider; impregnating the first fiber bundle with the thermoplastic resin in the second fiber bundle which is heated and melted; and curing the thermoplastic resin to form the outer shell, wherein tension applied to the first fiber bundle is larger than tension applied to the second fiber bundle when forming the body and / or impregnating the thermoplastic resin.
Owner:SUBARU CORP
Apparatus for suppressing structure borne noises
InactiveUS6480609B1Reduce weightSuppress noiseEar treatmentPublic address systemsElectricityPiezoelectric actuators
Body or structural noise transmitted through a connector such as a strut, that connects a noise source, such as an engine, to an enclosure, such as a passenger cabin or cell of a helicopter, is suppressed by at least one piezoactuator which is excited to counteract any vibrations of the strut caused by body noise so that body noise vibrations are cancelled or at least substantially suppressed. The excitation of the piezoactuator is controlled in closed loop fashion in response to feedback signals from a sensor secured to the connector.
Owner:AIRBUS HELICOPTERS DEUT GMBH
Mask blank glass substrate, multilayer reflective film coated substrate, mask blank, mask, and methods of manufacturing the same
ActiveUS20130078555A1Improve detection accuracyEnable recyclingSemiconductor/solid-state device manufacturingOriginals for photomechanical treatmentSurface roughnessOptoelectronics
Provided is a mask blank glass substrate that has high surface smoothness, that is formed with a fiducial mark capable of improving the detection accuracy of a defect position or the like, and that enables reuse or recycling of a glass substrate included therein. An underlayer is formed on a main surface, on the side where a transfer pattern is to be formed, of a glass substrate for a mask blank. The underlayer serves to reduce surface roughness of the main surface of the glass substrate or to reduce defects of the main surface of the glass substrate. A surface of the underlayer is a precision-polished surface. A fiducial mark which provides a reference for a defect position in defect information is formed on the underlayer.
Owner:HOYA CORP
Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
InactiveUS20120312590A1Suppress manufacturing costIncrease manufacturing costSemiconductor/solid-state device detailsPrinted circuit aspectsElectrical conductorEngineering
Disclosed is a method of manufacturing a multilayer wiring substrate having a principal plane of the substrate and a rear plane thereof, having a structure such that a plurality of resin insulating layers and a plurality of conductor layers are laminated, and a plurality of chip component connecting terminals to which chip components are connectable are disposed on the principal plane of the substrate. This method has a feature including a plating layer forming process in which product plating layers which provide the plurality of chip component connecting terminals and a dummy plating layer on the surrounding of the product plating layers are formed on the surface of an exposed outermost resin insulating layer at the principal plane of the substrate. This method permits a thickness dispersion of the chip component connecting terminals to be suppressed and permits a connection reliability thereof to the chip components to be increased.
Owner:NGK SPARK PLUG CO LTD
Working vehicle
InactiveUS7757805B2Improve support strengthSuppress manufacturing costMechanical machines/dredgersVehicle body-frame connectionsBraced frameBody frame
In a working vehicle in which a backhoe support frame for reinforcing is provided in a rear end portion of a vehicle body frame, and a transmission case is mounted on a rear portion of the vehicle body frame so as to be close to the backhoe support frame, each of support brackets provided in an outer side surface of a rear portion of each of main frames constructing the vehicle body frame so as to protrude outward is connected to a protruding end portion protruding to rightwardly and leftwardly relative to each of lower brace members in a reinforcing plate supporting a lower surface of the transmission case in a state in which a rear axle case protruding outward from the right and left side surfaces of the transmission case is sandwiched from upper and lower sides, in order to dissolve a risk that a load generated at a time of traveling in a backhoe installed state or at a time of an excavating work by the backhoe is propagated to the transmission case.
Owner:YANMAR POWER TECHNOLOGY CO LTD
Semiconductor device and method of manufacturing the same
InactiveUS20070018332A1Preferable yield rateImprove uniformitySemiconductor/solid-state device detailsSolid-state devicesDevice materialCopper
The method of manufacturing a semiconductor device according to the present invention includes: forming an interconnect trench in an insulating film formed on a semiconductor substrate (S100) ; forming a barrier metal layer on the whole surface of the insulating film (S102); forming a copper layer on the whole surface of the barrier metal layer so that the copper layer is embedded in the interconnect trench (S104); removing the copper layer outside the interconnect trench by polishing under a condition that the barrier metal layer is left on the surface of the insulating film (S106); selectively forming a cap metal layer on the copper layer formed in the interconnect trench after the step of removing the copper layer by polishing (S108); and flattening the cap metal layer by polishing (S110).
Owner:RENESAS ELECTRONICS CORP
Semiconductor device and electronic appliance
One object is to provide a semiconductor device that includes an oxide semiconductor and is reduced in size with favorable characteristics maintained. The semiconductor device includes an oxide semiconductor layer, a source electrode and a drain electrode in contact with the oxide semiconductor layer, a gate electrode overlapping with the oxide semiconductor layer; and a gate insulating layer between the oxide semiconductor layer and the gate electrode. The source electrode or the drain electrode includes a first conductive layer and a second conductive layer having a region extended in a channel length direction from an end face of the first conductive layer. The sidewall insulating layer has a length of a bottom surface in the channel length direction smaller than a length in the channel length direction of the extended region of the second conductive layer and is provided over the extended region.
Owner:SEMICON ENERGY LAB CO LTD
Pressure container manufacturing method
A pressure container manufacturing method by forming an outer shell of a fiber reinforced composite material on a periphery of a liner having a cylindrical portion, dome portions connected to both ends of the cylindrical portion, and a mouth piece disposed on one top of the dome portions, has: forming a body on the periphery by braiding fiber bundles provided from bobbins of a braider disposed in a circumferential direction of the liner, while moving the liner in an axial direction, wherein when body formation reaches a root portion of the mouth piece, a movement in a first direction of the liner is stopped, each bobbin is rotated approximately a half-turn in the circumferential direction, and thereafter formation of the body is continued while moving the liner in a second direction opposite to the first direction; and curing a resin impregnated in the fiber bundles, to form an outer shell.
Owner:SUBARU CORP
Packaging bag with weak sealed duct
InactiveUS7040483B2Reduce manufacturing costDesired different sealing strengths with easeEnvelopes/bags making machineryFlexible coversEngineeringMechanical engineering
A packaging material capable of having a desired sealing strength with ease and a packaging bag using such material are provided. A packaging material, which serves as either one of a first and a second packaging materials to be heat-sealed to each other, includes a sealing portion. This sealing portion is relatively weaker in sealing strength and composed of an applied area of a coating agent preventing the heat sealing and a non-applied area of the coating agent. The applied area and the non-applied area are changed in an area size from each other depending on the sealing strength required for the sealing portion.
Owner:HOSOKAWA YOKO CO LTD
Pressure container manufacturing method
A pressure container manufacturing method by forming an outer shell of a fiber reinforced composite material on a periphery of a liner having a cylindrical portion, dome portions connected to both ends of the cylindrical portion, and a mouth piece disposed on one top of the dome portions, has: forming a body on the periphery by braiding fiber bundles provided from bobbins of a braider disposed in a circumferential direction of the liner, while moving the liner in an axial direction, wherein when body formation reaches a root portion of the mouth piece, a movement in a first direction of the liner is stopped, each bobbin is rotated approximately a half-turn in the circumferential direction, and thereafter formation of the body is continued while moving the liner in a second direction opposite to the first direction; and curing a resin impregnated in the fiber bundles, to form an outer shell.
Owner:SUBARU CORP
Film Formation Method and Method for Manufacturing Light-Emitting Device
InactiveUS20080268137A1Improve throughputFilm qualityElectroluminescent light sourcesSolid-state devicesProduction rateEvaporation
A binder material layer including an evaporation material is formed over a main surface of an evaporation source substrate, a substrate on which a film is formed is placed so that the binder material layer and a main surface thereof face each other, and heat treatment is performed on a rear surface of the evaporation source substrate so that the evaporation material in the binder material layer is heated to be subjected to sublimation or the like, whereby a layer of the evaporation material is formed on the substrate on which a film is formed. When a low molecular material is used for the evaporation material and a high molecular material is used for the binder material, the viscosity can be easily adjusted, and thus, film formation is possible with higher throughput than conventional film formation.
Owner:SEMICON ENERGY LAB CO LTD
Connecting structure for connecting electrical apparatus and feeder terminal portion, and vehicle
InactiveUS20090108688A1Simple structureEasy connection workVehicle connectorsWindingsElectrical conductorMotor–generator
A bus bar (263) identified as a led-out conductor portion led out from a coil end (262) of a motor generator identified as an electrical apparatus, and a feeding terminal block (220) disposed at a spacing from the bus bar (263) and having a cable (3A) connected thereto, are connected by a connecting member (4). The connecting member (4) has a bent shape as a whole, and includes a misalignment absorbing portion (46) which is provided by bending a part of the connecting member (4) and is deformable to absorb misalignment between the bus bar (263) and the feeding terminal block (220).
Owner:TOYOTA JIDOSHA KK
Semiconductor device
ActiveUS20110210326A1Small sizeFunction increaseSolid-state devicesRead-only memoriesDevice materialPhysical chemistry
A semiconductor device includes an oxide semiconductor layer, a source electrode and a drain electrode in contact with the oxide semiconductor layer, a gate electrode overlapping with the oxide semiconductor layer, and a gate insulating layer between the oxide semiconductor layer and the gate electrode, in which the source electrode or the drain electrode comprises a first conductive layer and a second conductive layer having a region which extends beyond an end portion of the first conductive layer in a channel length direction and which overlaps with part of the gate electrode, in which a sidewall insulating layer is provided over the extended region of the second conductive layer, and in which the sidewall insulating layer comprises a stack of a plurality of different material layers.
Owner:SEMICON ENERGY LAB CO LTD
Silicon carbide substrate, semiconductor device, and methods for manufacturing them
ActiveUS20130256700A1Improve production efficiencySuppress manufacturing costPolycrystalline material growthDiffusion/dopingPower semiconductor deviceSulfur
A silicon carbide substrate has a first main surface, and a second main surface opposite to the first main surface. A region including at least one main surface of the first and second main surfaces is made of single-crystal silicon carbide. In the one main surface, sulfur atoms are present at not less than 60×1010 atoms / cm2 and not more than 2000×1010 atoms / cm2, and carbon atoms as an impurity are present at not less than 3 at % and not more than 25 at %. Thereby, a silicon carbide substrate having a stable surface, a semiconductor device using the substrate, and methods for manufacturing them can be provided.
Owner:SUMITOMO ELECTRIC IND LTD
Shift register and electronic device using the same
InactiveUS20050276369A1Improve manufacturing yieldImprove reliabilityStatic indicating devicesSolid-state devicesShift registerProcessor register
The invention provides a shift register which can function normally even with an abnormal register or a broken register while suppressing the manufacturing cost as little as possible. The shift register of the invention includes n regular registers (SR(1) to SR(n)) connected in series and n output lines (L1 to Ln) corresponding to the n regular registers, r (r≦n) redundant registers (SR(n+1) to SR(n+r)) connected in series to the n regular registers, and a switch circuit for selectively connecting the regular and redundant resistors to output lines. The switch circuit connects the n regular registers to the corresponding output lines in a normal state, connects normal registers of upper and lower stages of the broken register by skipping and disabling the broken register if any, and connects normal regular registers and the same number of redundant registers as the broken registers to the n output lines.
Owner:SEMICON ENERGY LAB CO LTD
Imaging device
ActiveUS20090294634A1Satisfactory mass-productivitySuppressed fabrication costRadiation pyrometryBeam/ray focussing/reflecting arrangementsParallel plateLength wave
A close contact type imaging device is an imaging device for acquiring an image of an object in a state that the object is in close contact to an image sensor. This imaging device has an angle limiting filter. The angle limiting filter is constructed from: a glass substrate of a parallel plate; and a dielectric multilayer film provided on the glass substrate. This angle limiting filter transmits light within a particular wavelength range approximately perpendicularly incident onto the surface, and shields light outside the particular wavelength range and light within the particular wavelength obliquely incident onto the surface.
Owner:FUJIFILM CORP
Biological information measuring module, biological information measuring apparatus, light detecting apparatus, light detecting module, and electronic apparatus
InactiveUS20160198966A1Efficient cuttingAccurate informationCatheterOptical sensorsMeasurement deviceElectron
A biological information measuring module includes a light emitting unit that emits light, a light receiving unit that receives the light via an object, and a multilayered film optical filter that is provided on the light receiving unit on a side where the light is incident. The multilayered film optical filter is constituted by a laminated body of five or more layers and 120 or less layers.
Owner:SEIKO EPSON CORP
Transport system and transport method
InactiveCN103303639AReduced inspection workReduced parts countGearingBiological testingTransport systemTransport engineering
According to an embodiment, a transport system configured to transport a receptacle which accommodates an upright sample holder containing a sample, characterized by comprising, a screw comprising a rotatable shaft disposed along a predetermined transport path and a helical ridge protruding outward from an outer peripheral surface of the shaft, and a drive unit configured to rotate the screw. The transport method according to another shape utilizes a pair of parallel screws for conveying the receptacle, and conveys the receptacle which is held among a plurality of ridges which are arranged in an axial direction in a transportation path. The transport system and transport method of the invention have the following advantages: small number of components, simplified device structure, and reduced manufacturing cost.
Owner:AOI SEIKI
X-Y address type solid-state image pickup device with an image averaging circuit disposed in the noise cancel circuit
InactiveUS7242427B2Suppress manufacturing costTelevision system detailsTelevision system scanning detailsAudio power amplifierImage averaging
The invention relates to an X-Y address type solid-state image pickup device manufactured by a CMOS process, and has an object to provide an X-Y address type solid-state image pickup device in which a chip area is not increased, manufacturing costs are suppressed, and an image averaging processing can be carried out. Pixel regions Pmn are arranged in a matrix form in regions defined by horizontal selection lines RWm and vertical selection lines CLn. Each of the pixel regions Pmn includes a photodiode 10, a source follower amplifier 14 for converting an electric charge of the photodiode 10 into a voltage and amplifying it to output image data, and a horizontal selection transistor 16 for outputting the image data to a predetermined one of the vertical selection lines CLn. An amplifier / noise cancel circuit 6 has a built-in image averaging circuit for carrying out an averaging processing of the image data outputted from at least two of the plurality of the pixel regions Pmn.
Owner:SOCIONEXT INC
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