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2637results about How to "Reduce processing load" patented technology

Catalysis and micro-electrolysis combined technology for high-concentration refractory organic wastewater

The invention relates to a catalysis and micro-electrolysis combined technology for high-concentration refractory organic wastewater; the organic wastewater is collected to an adjusting tank and enters an air floatation tank for air floatation treatment to remove part of the organic matters after the adjustment of water volume and water quality; the scruff is collected or recovered; the wastewatergoes through Ph adjustment and then enters a catalytic iron-carbon and micro-electrolysis unit to improve the biochemical quality; the effluent goes through Ph adjustment and then enters a sedimentation tank; the effluent of the sedimentation tank adopts anoxic-aerobic biochemistry treatment to remove the organic matters and ammonia nitrogen and then is emitted after reaching the standard; and the filler of the catalytic iron-carbon and micro-electrolysis unit comprises iron, carbon and a catalyst, wherein the mass ratio of the iron, carbon and catalyst is 1: (0.3-1.5): (0.01-0.5). The invention can effectively improve the micro-electrolysis electrochemical reaction efficiency and the degrading capability to the organic matters, and reduce the wastewater treatment cost with convenient technological operation.
Owner:CENT SOUTH UNIV

Semiconductor device and manufacturing process therefor

To provide a very-low-cost and short-TAT connection structure superior in connection reliability in accordance with a method for three-dimensionally connecting a plurality of semiconductor chips at a shortest wiring length by using a through-hole electrode in order to realize a compact, high-density, and high-function semiconductor system. The back of a semiconductor chip is decreased in thickness up to a predetermined thickness through back-grinding, a hole reaching a surface-layer electrode is formed at a back position corresponding to a device-side external electrode portion through dry etching, a metallic deposit is applied to the sidewall of the hole and the circumference of the back of the hole, a metallic bump (protruded electrode) of another semiconductor chip laminated on the upper side is deformation-injected into the through-hole by compression bonding, and the metallic bump is geometrically caulked and electrically connected to the inside of a through-hole formed in an LSI chip. It is possible to realize a unique connection structure having a high reliability in accordance with the caulking action using the plastic flow of a metallic bump in a very-low-cost short-TAT process and provide a three-dimensional inter-chip connection structure having a high practicability.
Owner:RENESAS TECH CORP

Information transmission system, information sending device, information receiving device, information transmission method, information sending method, information receiving method and program product

An information transmission system is constituted by: an information sending device including a light emitting section that emits light in a plurality of colors, a modulating section that modulates information to be transmitted into signals composed of changes in color, and a light emission control section that controls the light emitting section to emit light while changing color temporally based on the signals generated by the modulating section; and a receiving device including a camera that captures an image having color, and a control and communication section that detects a temporal color change of the light emitting section emitting light by light emission control by the information transmitting device, from images consecutively captured by the camera, decodes the detected color change into information, and outputs the generated information to a display section.
Owner:CASIO COMPUTER CO LTD

Dynamic range control and equalization of digital audio using warped processing

This invention describes a method for adjusting the loudness and the spectral content of digital audio signals in a real-time using warped spectral filtering. A warped processing module modifies a spectral content of a digital audio signal with a set of gains for a plurality of non-linearly-scaled frequency bands determined by a warping factor λ of a warped delay line. Warped delay line signals, generated by the warped delay line, are processed by a warped filter block containing multiple warped finite impulse response filters, e.g., Mth band filters, using individual warped spectral filtering in said plurality of the non-linearly-scaled frequency bands, which is followed by a conventional processing by a dynamic range control / equalization block. The present invention describes another innovation, that is embedding the warped processing module in a two-channel quadrature mirror filter (QMF) bank for improving processing efficiency at high sample rates.
Owner:BEIJING XIAOMI MOBILE SOFTWARE CO LTD

Communication apparatus, transmission apparatus and reception apparatus

Upon reception of a transport stream of information data from an encoder, an RTP transmission process unit employed in an RTP process circuit is activated to packetize the transport stream in an RTP packet. A network device then outputs the resulting RTP packet to a network. At that time, sender information for the transmission is created and stored. On the other hand, an RTP reception process unit employed in the RTP process circuit depacketizes an RTP packet received from the network through the network device to obtain a transport stream and supplies the transport stream to a decoder. At that time, receiver information for the reception is created and stored. An RTCP process means employed in a control unit on the host side acquires the sender information and the receiver information through an internal bus and uses them to create an RTCP packet to be output to the network by way of the network device. As a result, the streaming quality can be assured independently of the state of the control unit on the host side.
Owner:SONY CORP
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