244results about "Chromatisation" patented technology

The invention relates to a method and system for preventing corrosion of at least one metallic structure in an electrolyte medium, comprising applying a superimposed time-varying frequency electromagnetic wave to the structure, the method comprising the steps of generating a superimposed time-varying frequency electromagnetic wave (DAC wave) where an AC driving signal with time-varying frequency is riding on a DC output with a predefined DC bias voltage, transmitting the DAC wave current to one or more emitters, emitting the DAC wave via the one or more emitters, placing the one or more emitters at a spaced distance from the metallic structure, subjecting the metallic structure to the DAC wave current, controlling the negative return current of the DAC wave from the metallic structure, such that the DAC wave is distributed across the structure surface and directly excites a target region of the metallic structure, and wherein the excitation induces a flow of ionic current having a DC component travelling in a pulsating and time-varying manner in the target region and effects induced vibration of electrons and molecules in the target region. The method and the system of the invention significantly reduce capital costs and require very low energy, they avoid environmentally unfriendly final products, and are able to result in effective corrosion protection of metallic structures in different surrounding conditions.

Disclosed is a copper foil which has excellent high frequency characteristics and heat resistance, while achieving high heat-resistant adhesion to a resin substrate at the same time. Specifically disclosed is a heat-resistant copper foil which has a configuration wherein a primary roughened surface layer which has been subjected to a primary roughening process by copper metal, a secondary roughened surface layer which has been subjected to a secondary roughening process by copper metal, and a tertiary processed surface layer which has been subjected to a tertiary processing process by zinc metal are sequentially provided on one surface of an unprocessed copper foil. Also specifically disclosed are: a circuit board which is obtained by laminating the heat-resistant copper foil on a flexible resin substrate or a rigid resin substrate; and a method for manufacturing a copper-clad laminate board wherein the heat-resistant copper foil and a heat-resistant resin substrate are thermally pressure-bonded and the tertiary processed surface layer, which is composed of the roughened copper metal and the zinc metal, is alloyed.

A copper foil with a resistance layer is provided, wherein the variation value is small when it is made into a resistance element, the adhesion with the resin substrate to be laminated with is able to be sufficiently maintained, which has an excellent characteristics as a resistance element for a rigid and a flexible substrate. A copper foil with a resistance layer of the present invention comprises a copper foil on one surface of which a metal layer or alloy layer is formed from which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles. A method of production of a copper foil with a resistance layer of the present invention comprises: forming a resistance layer of phosphorus-containing nickel on a matte surface of an electrodeposited copper foil having crystals comprised of columnar crystal grains wherein a foundation of the matte surface is within a range of 2.5 to 6.5 [mu]m in terms of Rz value prescribed in JIS-B-0601; and performing roughening treatment to a surface of the resistance layer with nickel particles wherein a roughness is within a range of 4.5 to 8.5 [mu]m in terms of Rz value prescribed in JIS-B-0601. The alloy layer is for example formed from phosphorus-containing nickel.