The invention discloses manufacturing methods of an electrolytic
copper foil having football-shaped
copper particles and a circuit board
assembly. The manufacturing methods of an electrolytic
copper foil having football-shaped particles include forming a
copper foil by an electrolyzing process, wherein the foil layer has a predetermined surface. Then, a roughening treatment layer is formed on thepredetermined surface of the
copper foil to form an electrolytic
copper foil having football-shaped protrusions on a
surface layer. The roughening treatment layer includes a plurality of football-shaped copper particles, and a funnel-shaped arrangement space exists between two adjacent football-shaped copper particles. The steps of forming the roughening treatment layer further includes performinga first electrolytic roughening treatment and a first electrolytic curing treatment, in which a first
electrolyte solution used in the first electrolytic roughening treatment includes copper ions,
sulfuric acid,
arsenic trioxide, and
tungstate ions, in which the copper concentration ranges from 3 to 40 g / L, the
sulfuric acid concentration ranges from 100 to 120 g / L, the
arsenic trioxide concentration is not more than 20 ppm, and the
tungstate ion concentration ranges from 5 to 20 ppm. Thus, since the
surface layer has the
electrolyte copper foil having the football-shaped structure and has alarger contact area with a resin substrate, higher peeling strength can be achieved.