Manufacturing methods of electrolytic copper foil having football-shaped copper particles and circuit board assembly

Abstract

The invention discloses manufacturing methods of an electrolytic copper foil having football-shaped copper particles and a circuit board assembly. The manufacturing methods of an electrolytic copper foil having football-shaped particles include forming a copper foil by an electrolyzing process, wherein the foil layer has a predetermined surface. Then, a roughening treatment layer is formed on thepredetermined surface of the copper foil to form an electrolytic copper foil having football-shaped protrusions on a surface layer. The roughening treatment layer includes a plurality of football-shaped copper particles, and a funnel-shaped arrangement space exists between two adjacent football-shaped copper particles. The steps of forming the roughening treatment layer further includes performinga first electrolytic roughening treatment and a first electrolytic curing treatment, in which a first electrolyte solution used in the first electrolytic roughening treatment includes copper ions, sulfuric acid, arsenic trioxide, and tungstate ions, in which the copper concentration ranges from 3 to 40 g / L, the sulfuric acid concentration ranges from 100 to 120 g / L, the arsenic trioxide concentration is not more than 20 ppm, and the tungstate ion concentration ranges from 5 to 20 ppm. Thus, since the surface layer has the electrolyte copper foil having the football-shaped structure and has alarger contact area with a resin substrate, higher peeling strength can be achieved.

Description

technical field [0001] The invention relates to a method for manufacturing electrolytic copper foil and circuit board components, in particular to a method for manufacturing electrolytic copper foil with a plurality of rugby-ball-shaped copper nodules on the surface, and a method for using copper with a plurality of rugby-ball-shaped copper nodules on the surface. A method of manufacturing a circuit board assembly of a knobby electrolytic copper foil. Background technique [0002] The existing copper foil used in printed circuit boards will be electroplated on the cathode wheel to form the original foil, and then undergo a post-processing process to form the final product. Post-processing includes roughening the rough surface of the original foil to form multiple copper nodules on the rough surface of the original foil, thereby increasing the bonding strength between the copper foil and the circuit substrate, that is, increasing the peel strength of the copper foil. [0003...

AI Technical Summary

Problems solved by technology

[0005] If you try to reduce the high-frequency signal transmission loss by reducing the roughness of the copper foil surface, it will reduce the peel strength of the copper foil and the circuit substrate.

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