112 results about "Roll bonding" patented technology

A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier.

A method and apparatus for bonding and aperturing one or more fibrous webs including bonding at least one fibrous web in a bonding nip created by a rotatable bonding roll and a rotatable anvil roll and aperturing the at least one fibrous web in an aperturing nip created by a rotatable aperture roll and an anvil roll. The bonding roll has a plurality of protuberances extending from the peripheral bonding surface that define a bonding pattern and result in highly bonded regions within the fibrous web. The aperture roll has a plurality of projections extending from the peripheral aperture surface that define an aperturing pattern. The aperturing pattern substantially aligns with the bonding pattern thereby creating apertures within the highly bonded regions.

The invention provides a high-strength/toughness magnesium lithium alloy and a preparation method thereof by an accumulative roll bonding process. The method comprises the following steps: a) carrying out homogenizing treatment on a smelted magnesium lithium alloy cast ingot; b) carrying out thermal deformation processing to obtain a magnesium lithium alloy plate; c) carrying out stress-relief annealing; d) cutting the plate for accumulative roll bonding into two pieces with equal size, and carrying out surface treatment; e) fixing the two Mg-Li alloy plates; f) rolling; g) repeating the roll bonding according to the steps d)-f) 4-6 times; and h) carrying out annealing treatment. The obtained alloy comprises the following components in percentage by mass: 7.5-9.5% of Li, 2.5-3.5% of Al, 0.5-1.5% of Zn, less than 0.03% of inevitable impurities (Fe, Cu, Ni, Mn and Si), and the balance of Mg. The magnesium lithium alloy is reinforced according to the specific alloying elements and proportioning thereof, and subjected to multipass accumulative roll bonding at proper temperature to refine the magnesium lithium alloy crystal grains, so that the alloy has higher strength on the premise of keeping favorable plasticity.

The invention discloses a method for preparing a metal layered micro-gradient composite material. The method is mainly characterized in that the micro-gradient composite material is obtained through interface diffusion of alloy elements with the homologous-series heterogeneous multi-layer metal rolling bonding and heat processing technology. Metal with two kinds of alloy content is adopted for rolling bonding, and the to-be-bonded surfaces are grinded and washed; after the ends are fixed, rolling bonding is carried out, and a multi-layer heterogeneous metal composite board is prepared; then heat processing is carried out on the composite board, the temperature is kept for a certain period of time according to requirements, the alloy elements are diffused on interfaces, and therefore the layered micro-gradient composite material is obtained. According to the metal layered micro-gradient composite material prepared with the method, obvious micro-gradients in chemical components and performance exist nearby the interfaces, and the good interface bonding strength can be achieved; the number of the micro-gradient interfaces and the thickness of micro-gradient layers can be adjusted and controlled by changing the rolling bonding technology, the laminating order and the heat processing technology.

The invention discloses a method for preparing a titanium alloy thin plate by cladding and rolling of a steel plate, and relates to a processing method of a metal plate. It is characterized in that the rolling process is that the titanium alloy plate is hermetically covered by a steel plate to form a stacked rolling bag, and then rolling is carried out. The method of the invention has low rolling cost, and the titanium alloy thin plate is produced by cladding, welding, stacking and hot rolling, the process is simple, and the comprehensive performance of the obtained material is excellent.

Galvanically protected reinforcement dowel pins and methods of producing the same. In one embodiment, the reinforcement dowel pins comprise a bar or tube, the longitudinal exposed surfaces of which are covered by a heavy gauge of a sacrificial metal, such as zinc, zinc alloy, magnesium, magnesium alloy, aluminum, or aluminum alloy. The bar or tube comprises steel, carbon steel, or other ferrous metal. The heavy gauge of sacrificial metal is applied to the ferrous metal by various processes, such as roll bonding, lock seaming, welding, die casting, flame spraying, plasma spraying, dipping, sinking, and drawing. The resulting reinforcement dowel pins resist corrosion without sacrificing structural integrity, and are reasonable in materials and manufacturing costs. These dowel pins may be installed in adjacent concrete panels using conventional methods, and therefore do not introduce additional costs in installation.

The invention relates to a roll-bonding process for semisolid copper-lead bearing alloys/steel bimetals. The weight content percentage of the lead in the copper-lead bearing alloy is 10.0 to 30.0%. In order to refine the crystalline grain of the lead and improve the mechanical property of the alloy, sulfur, tin, nickel, manganese, rare earth and other the third alloy elements can be added in the copper-lead alloy. The process comprises four steps: pretreatment of steel plates, preparation of semisolid sizing agent, roll bounding and water cooling. The detailed process comprises the following steps: performing mechanical agitation to the melted copper-lead bearing alloys at 930 to 1050 DEG C to obtain the semisolid sizing agent; pouring the semisolid sizing agent on the pretreated steel plates; synchronously feeding the semisolid copper-lead bearing alloys and solid steel plates in to a mill for rolling; spraying water for cooling to obtain the bimetallic composite plate. The invention effectively overcomes the defect of lead segregation in the production of the copper-lead bearing alloys in the prior art, therefore, metallographic structure with fine lead particle and even distribution is obtained. According to mechanical test results, the interfacial shear strength of the copper-lead bearing alloys/steel bimetallic slabs prepared using the process is more than 60Mpa, increased by about 10Mpa.

The present invention relates to a liquid-solid rolling bonding method for heterogeneous metals and an apparatus therefor. The method comprises: pouring a liquid metal onto the surface of a heterogeneous solid base metal coated with a soldering flux; rolling the liquid metal and the solid metal under pressure; solidifying the liquid metal and making it bond to the surface of the solid base metal under rapid cooling to realize metallurgical bonding of the two or more metals. The apparatus comprises an unrolling machine, a soldering flux tank, a drying-heating apparatus, a pouring nozzle, an interior water-cooling rollers and a roll-collecting machine arranged in order, a pouring basket is disposed above the pouring nozzle and a base frame is disposed below the pouring nozzle. The present invention has the advantages of high bonding strength, lower production cost, high production efficiency, good product quality, fewer investment for the apparatus and lower consumption of energy. The method of the present invention can replace the convention rolling bonding method in solid-solid phase and is suitable for the production of various clad metal sheets and strip.

The invention provides a lithium supplement device for a pole piece and a lithium supplement method of the device. The device is provided with a sealing shell, a pole piece unrolling assembly, a lithium liquid coating assembly, a cooling assembly, a normal-temperature roll-in assembly and a pole piece rolling assembly, and the pole piece unrolling assembly, the lithium liquid coating assembly, thecooling assembly, the normal-temperature roll-in assembly and the pole piece rolling assembly are arranged in the sealing shell and connected in sequence; the lithium liquid coating assembly comprises a pair of rollers composed of an intaglio roller and a hot back roller, and a lithium liquid storage groove is formed below the intaglio roller and connected with a lithium liquid production devicethrough a pipe. The lithium supplement device is simple in structure, the equipment cost is greatly lowered, the problems such as rolling bonding and adhesion during pressing fit of a lithium band arecompletely solved, the consistency of lithium supplement is greatly improved, the production high-quality rate is greatly increased, and the production efficiency is greatly improved.

The invention discloses a dissimilar metal rolling bonding method with embedded type rib groove interlocking, and belongs to the field of bi-metal composite plate preparing. The method comprises the following steps of S1, single-side convex rib rolling, wherein a flat roller and a figure roller with a groove are matched, a first plate blank is rolled, and a convex rib is formed on the single sidesurface of the first plate blank; S2, preassembling rolling, wherein a second plate blank and the first plate blank are embedded, the first plate blank is embedded into the second plate blank to formchain type connection, and an embedded composite workpiece is formed; and S3, asymmetrical rolling, wherein the embedded composite workpiece is subjected to asymmetrical forming rolling, and a dissimilar metal composite plate is formed. The problem that in the prior art, the bonding strength of a dual-metal composite plate is low totally can be solved, the rolling bonding method that embedded typeribs and grooves are manufactured in dissimilar metal contact, and through asymmetrical rolling, rib and groove interlocking is achieved is adopted, measures of combining mechanical type connection,generation of an interlocking structure and increasing the diffusion rate are used, and the interface contact strength can be sufficiently improved.

A method for making a metal laminate comprising at least one plating step and at least one cold roll bonding step. A metal laminate comprising a plurality of alternating structural layers and non-structural layers, where the structural layers contribute significantly to the overall strength of the metal laminate, while the non-structural layers do not contribute significantly to the overall strength of the metal laminate, but serve to bind the structural layers together.

The invention relates to a use of a multi-layer metal composite material, which is produced by way of roll-bonding and can be wound, in a vehicle structure, particularly a body structure. It is the object of the invention to provide a use of a metal composite material as an alternative to monolithic materials. The object is achieved in that the composite material is a lightweight composite material and comprises three layers of a steel alloy, wherein at least one of the layers is made of a steel alloy having higher strength or maximum strength.

Provided are a process method for bond-packaging an LED using a refined photoconverter, and a refining equipment system. The process method includes the following continuous process flow: roll-shaping of a special-shaped microporous carrier sheet, refining of a semi-cured photoconversion sheet, preparation of a flip chip LED array sheet, forming of LED package elements by roll-bonding, curing of the LED package elements, and cutting of the LED package elements. The present invention has a significant advantage of a refined photoconverter, and especially can meet a requirement of a continuous process flow of bond-packaging an LED using an organic silicone resin photoconverter, so as to enhance the production efficiency and yield of LED packages in industrialized batch production.

A method for bonding a gas barrier film and an electronic device, comprising continuously feeding a film composite that contains a gas barrier film having a support and a gas barrier layer, and an adhesive layer; blanking or slitting a part of the film composite to form a wire lead-out part therein; and continuously roll-bonding the film composite to a substrate with an electronic device formed thereon; wherein the feeding of the film composite, the forming of the wire lead-out part and the roll-bonding are carried out through in-line operation.

The invention discloses a package based on the technology that a frame is connected through bonding wires and a manufacturing process of the package. The package comprises a chip, a plastic packaging body, a silver-plated layer and the bonding wires. The silver-plated layer is composed of silver-plated layer sections which are independent from each other, the chip is located on a part of the silver-plated layer, the chip is connected with the portions, without the chip, of the silver-plated layer through the bonding wires, the plastic packaging body wraps the chip, the silver-plated layer and the bonding wires, and the chip, the silver-plated layer and the bonding wires constitute a power source and signal channel of a circuit. The package further comprises metal bumps. The manufacturing process comprises silver plating of the frame, wafer thinning, scribing, assembly of the chip, manufacturing of the metal bumps, pressure welding, plastic packaging, corrosion of the frame, cutting and packing, wherein the step of manufacturing of the metal bumps can be eliminated. According to the package and the manufacturing process thereof, due to the fact that pressure welding is directly conducted on the metal bumps after electrosilvering or the method of direct wiring after electrosilvering is used, design of a frame graph is finished when the frame is manufactured, the manufacturing period is shortened, interconnection of the chip and carriers is achieved better, the higher I/O density is achieved, and cost is lower.