The purpose of the present invention is to provide a photosensitive film with good resolution after development, excellent dispersion stability to the developer, no aggregates, excellent flexibility of the cured film, hole capping and good etchant resistance. A photosensitive resin composition, a photosensitive resin laminate having a photosensitive resin layer composed of the composition, a method of forming a resist pattern using the laminate, and a method of producing a conductive pattern. The present invention solves the above-mentioned problems by providing the following photosensitive resin composition, that is, a photosensitive resin composition characterized in that it contains (a) binder resin: 10 to 90% by mass, and its carboxyl group content is The acid equivalent is 100 to 600, contains benzyl (meth)acrylate as a copolymerization component, and has a weight average molecular weight of 5,000 to 500,000, (b) photopolymerizable unsaturated compound: 5 to 70% by mass, (c) as photopolymerizable unsaturated compound: The specific compound of the polymerization initiator is 0.1 to 20% by mass.