The invention discloses a packaging structure and a packaging method for a
fingerprint recognition
chip. The packaging structure comprises a substrate, a sensing
chip, a plurality of wires and a plastic
package layer. The substrate is provided with a first surface, and the first surface of the substrate is provided with a first
welding pad layer. The sensing
chip is located on the first surface of the substrate and provided with a first surface and a second surface, the second surface of the sensing chip is located on the first surface of the substrate, the first surface of the sensing chip is provided with a sensing area and a
peripheral area, and the surface of the portion, in the
peripheral area, of the sensing chip is provided with a second
welding pad layer. The two ends of the wires are electrically connected with the first
welding pad layer and the second welding pad layer respectively, the wires have top points with the maximum distance to the surface of the substrate, and a first distance is reserved between the top points and the first surface of the sensing chip. The plastic
package layer is located on the surface of the substrate and the surface of the sensing chip and surrounds the wires and the sensing chip, and a second distance is reserved between the surface of the plastic
package layer and the first surface of the sensing chip and is larger than the first distance. According to the packaging structure, the requirement for the sensitivity of the sensing chip is lowered, and application is wider.