The invention provides a compression-joint type IGBT packaging structure with heat tubes. The compression-joint type IGBT packaging structure is composed of an outer shell and a plurality of sub-unit structures located inside the outer shell, and the multiple sub-unit structures are arranged in parallel. Each sub-
unit structure comprises an upper end cover, conductive
copper sheets, a disc spring set, the heat tube, a base, a silver sheet, a
molybdenum sheet, a
chip and a lower end cover, wherein the lower end cover, the
chip, the
molybdenum sheet, the silver sheet and the base are sequentially arranged from bottom to top, the upper end of the heat tube is inserted into the upper end cover and penetrates through the disc spring set, the lower end of the heat tube is inserted into the base, the upper ends of the conductive
copper sheets are located between the upper end cover and the disc spring set, and the lower ends of the conductive
copper sheets are located between the disc spring set and the base. By means of the compression-joint type IGBT packaging structure, the chips can be effectively protected; meanwhile, as the heat tubes are used, two-sided radiating is achieved in function, and the overall
heat resistance is small; as the heat tubes are introduced, although single-face hard contact is generated, a radiating path is good, and consideration is given to
chip protection and the small
heat resistance. The overall structure has the advantages that
short circuit efficacy losing of a compression-joint type IGBT is achieved, and reliability is high.