Compression-joint type IGBT packaging structure with heat tubes

Abstract

The invention provides a compression-joint type IGBT packaging structure with heat tubes. The compression-joint type IGBT packaging structure is composed of an outer shell and a plurality of sub-unit structures located inside the outer shell, and the multiple sub-unit structures are arranged in parallel. Each sub-unit structure comprises an upper end cover, conductive copper sheets, a disc spring set, the heat tube, a base, a silver sheet, a molybdenum sheet, a chip and a lower end cover, wherein the lower end cover, the chip, the molybdenum sheet, the silver sheet and the base are sequentially arranged from bottom to top, the upper end of the heat tube is inserted into the upper end cover and penetrates through the disc spring set, the lower end of the heat tube is inserted into the base, the upper ends of the conductive copper sheets are located between the upper end cover and the disc spring set, and the lower ends of the conductive copper sheets are located between the disc spring set and the base. By means of the compression-joint type IGBT packaging structure, the chips can be effectively protected; meanwhile, as the heat tubes are used, two-sided radiating is achieved in function, and the overall heat resistance is small; as the heat tubes are introduced, although single-face hard contact is generated, a radiating path is good, and consideration is given to chip protection and the small heat resistance. The overall structure has the advantages that short circuit efficacy losing of a compression-joint type IGBT is achieved, and reliability is high.

Description

technical field [0001] The invention relates to a packaging structure, in particular to a crimping type IGBT packaging structure using a heat pipe. Background technique [0002] Insulated gate bipolar transistor (IGBT) has the characteristics of on-state voltage drop, large current capacity, high input impedance, fast response and simple control, and is widely used in industry, information, new energy, medicine, transportation, military and aviation fields . The crimp IGBT has high reliability, is easy to be connected in series, and exhibits a short-circuit failure mode when the device is damaged, so it is widely used in fields such as smart grids. [0003] The influence of temperature on device performance is very important. High temperature will not only affect the electrical characteristics of the device, but also seriously affect its fatigue life. During the operation of the device, the temperature will affect the thermal stress inside the chip, which may lead to damag...

AI Technical Summary

Problems solved by technology

[0005] The invention patent with the publication number CN1596472A discloses a high-power semiconductor module. In its structure, the lower side of the chip is sintered with the substrate, and the other side is a crimping structure, and finally contacts the upper end cover through the disc spring structure. The disc spring structure The use of the device makes the device have the advantage of protecting the chip, that is, when the pressing force is too large, the excess pressure will be borne by the shell of the device, and the force on the chip is only related to the compressible length of the disc spring, but also because of the existence of the disc spring , so that the thermal conductivity of the upper side of the chip is very poor, the heat can only be exported through the lower side, and the overall thermal resistance is relatively large

[0006] In the structure of the patent with the publication number US6678163B1, the upper and lower sides of the chip are all crimped structures, up to the upper and lower end caps. The advantage of this structure is that the device can realize double-sided heat dissipation, and the upper and lower sides of the chip have almost equal heat output. The overall thermal resistance is small, but because of the hard crimping structure in the vertical direction, the chip bears all the pressing force when the device is pressed, and the force on the chip also increases when the pressing force is too large, so The chip may be mechanically destroyed by excessive pressure

[0007] Through the above analysis, it can be seen that the products of the two companies have their own advantages, but they also have their own shortcomings. Chip protection and heat conduction cannot be balanced.

Images