34results about How to "Manufacturing Method Advantages" patented technology

The invention relates to a comfortable shoe and the manufacture method. The method comprises the following steps: selecting the shapes and sizes for comforting the feet of people in different area; determining the sole structure with performances of earthquake resistance and shock absorption; selecting the light and soft sole material with good performances of skid resistance, hard fold and wear resistance; distributing the feet pressure evenly on the inner mat made by principle of body physiology tutorial engineering; unifying the comfortable shoe last; ensuring the comfortable temperature and humidity in the intracavity of the shoe by special process treatment and craft processing. The invention also determines the class standard of comfort and the production trace routine of the comfortable shoe, so can ensure good air permeability of the whole footwear upper, the performances of moisture absorption and softness of the inner mat and the performances of earthquake resistance and shock absorption and the breath of the outer sole. The invention adopts new technique to make shoe last, so has the advantages of rapid speed and high precision. The invention also has the advantages of increasing the develop efficiency of the comfortable shoe greatly, ensuring the production quality, meeting the market demand rapid and improving the life quality of people.

The invention discloses a lightweight thermal insulation device for a composite material cylinder and a manufacturing method thereof, belonging to the technical field of launch cylinders. The lightweight thermal insulation device of the composite cylinder body includes an inner cylinder, a carbon fiber ventilation duct and an insulation structure layer; the carbon fiber ventilation duct is wound around the outer peripheral surface of the inner cylinder; the inner peripheral surface of the carbon fiber ventilation duct and the outer peripheral surface of the inner cylinder form a convenient The airflow channel through which the airflow passes; the thermal insulation structure layer wraps the outer peripheral surface of the carbon fiber ventilation duct. It solves the problem that the traditional air duct is bulky and cannot be integrated with the structural layer; the mounted air duct is directly ventilated, and the large-diameter air inlet destroys the structural continuity of the carbon fiber composite material cylinder and affects the rigidity of the cylinder. The carbon fiber ventilation pipe of the present invention is wound around the outer peripheral surface of the inner cylinder, so that the ventilation pipe and the structural layer are integrated; an airflow channel is formed between the inner peripheral surface of the carbon fiber ventilation pipe and the outer peripheral surface of the inner cylinder, and the bearing capacity of the inner cylinder is not be destroyed; the clad insulating structural layer ensures heat transfer efficiency.

The invention discloses a composite steel plate for a plastic mold. The composite steel plate is formed by two or more homogeneous billet layers through cladding rolling. The omposite steel plate forthe plastic mold comprises, by mass, 0.10-0.30% of C, 0.10-0.80% of Si, 1.00-2.00% of Mn, 1.00-2.00% of Cr, 0.01-0.50% of Mo, 0.01-1.00% of Ni, 0.01-0.10% of V, 0.01-0.10% of Ti, 0.010-0.070% of Al and the balance Fe and other inevitable impurities. Correspondingly, the invention further discloses a manufacturing method of the composite steel plate for the plastic mold. The composite steel plate for the plastic mold is uniform in thickness and section structure.

A method for fabricating a CMOS image sensor may include forming an isolation layer defining an active area on a semiconductor substrate, forming first and second gate electrodes in the transistor area of the semiconductor substrate, forming a photodiode area in the semiconductor substrate at a first side of the first gate electrode, forming an oxide layer over the photodiode area, the oxide layerhaving a thickness greater than that of the dielectric layer, forming a source / drain extension area in the semiconductor substrate at a second side of the second gate electrode and between the firstand second gate electrodes, forming source / drain regions in the transistor area of the semiconductor substrate by ion implantation through the dielectric layer, and forming a complementary ion implantation region in the photodiode area through the oxide layer.