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Manufacturing method for target material assembly

A manufacturing method and target technology, which are applied in manufacturing tools, metal processing equipment, welding equipment, etc., can solve the problems of easy defects in the backplane and target materials, difficulty in recycling indium solder, etc. Low dosage, strong binding effect

Inactive Publication Date: 2016-06-01
合肥江丰电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the problem that defects are prone to appear between the back plate and the target in the welding process of the existing target and the back plate, and the recovery of indium solder is difficult

Method used

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  • Manufacturing method for target material assembly
  • Manufacturing method for target material assembly
  • Manufacturing method for target material assembly

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Embodiment Construction

[0027] As mentioned in the background, in the current target welding process using indium solder, defects are prone to occur between the back plate and the target, and the recovery of the indium solder is relatively difficult.

[0028] The present invention uses indium solder to perform surface infiltration treatment on the welding surface of the back plate; coats indium solder on the welding surface of the target material, and uses a steel wire brush to rub the welding surface of the target material to perform surface infiltration treatment; the surface infiltration treatment will be completed The processed welding surface of the target is welded together with the welding surface of the back plate. Through the step of rubbing the welding surface of the target with a steel wire brush, the metal oxide on the welding surface of the target can be removed, and the roughness of the welding surface of the target is increased, so that the welding surface of the indium solder and the t...

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Abstract

The invention provides a manufacturing method for a target material assembly. The manufacturing method for the target material assembly includes the steps that surface infiltration treatment is carried out on a welding surface of a back plate through indium solder; a welding surface of a target material is coated with indium solder and is rubbed through a steel wire hairbrush, so that surface infiltration treatment is carried out; and the welding surface, subjected to surface infiltration treatment, of the target material and the welding surface of the back plate are welded together. Through the step of rubbing the welding surface of the target material through the steel wire hairbrush, metal oxide on the welding surface of the target material can be removed, the roughness of the welding surface of the target material is increased, and accordingly the indium solder can fully infiltrate the welding surface of the target material. After the welding surfaces of the target material and the back plate are welded, the bonding performance of the welding surfaces of the target material and the back plate is high, and defects are not prone to occurrence. The target material and the back plate are both infiltrated through the indium solder, the bonding performance of the indium solder is high, the total use amount of the indium solder is smaller compared with that in the prior art, and the recycling purity of the indium solder is improved.

Description

technical field [0001] The invention belongs to the field of semiconductor technology, in particular to a method for manufacturing a target component. Background technique [0002] In the semiconductor industry, the target assembly consists of a target that meets the sputtering performance and a back plate with a certain strength. The back plate can play a supporting role in assembling the target component to the sputtering base, and has the effect of conducting heat. [0003] Usually the target and the backing plate are welded to form a target assembly. Target components are usually large in size. If traditional tin-based solder with high hardness is used for soldering, it is easy to deform and difficult to correct. Therefore, LCD target components usually use pure indium with a low melting point and low hardness as solder. [0004] In LCD target components, aluminum targets, copper targets, and molybdenum targets are usually used according to different sputtering materia...

Claims

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Application Information

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IPC IPC(8): B23K1/08B23K1/19
Inventor 姚力军潘杰相原俊夫大岩一彦王学泽李健成周伟君
Owner 合肥江丰电子材料有限公司
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