Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

30results about How to "Improved thermal performance" patented technology

High-temperature high-power rare earth resistance paste and preparation method thereof

The invention discloses a high-temperature high-power rare earth resistance paste and a preparation method thereof. The high-temperature high-power rare earth resistance paste comprises a functional phase, an inorganic adhesive phase, a burning promoter and an organic carrier, wherein the functional phase is composite powder consisting of micrometer silver powder and bismuth ruthenate powder; the inorganic adhesive phase is lead-free pyroceram powder consisting of SiO2, MgO, B2O3, ZnO, Bi2O3, rare earth oxides and a nucleation agent; and the organic carrier is a mixture consisting of a solvent, resin, a dispersing agent, a deforming agent and a thixotropic agent. The resistance paste has the advantages that firstly, the damages of lead on the environment and human bodies can be avoided; secondly, the resistance paste is high in compatibility, wettability, thermal performance, electrical performance, manufacturability and adaptability; thirdly, the resistance paste is high in binding performance with ceramic and stainless steel substrates; and fourthly, the resistance paste is high in printing performance, burning performance and compatibility. The preparation method comprises preparation of the inorganic adhesive phase, preparation of the functional phase, preparation of the organic carrier and preparation of the resistance paste in sequence, and the resistance paste can be produced and prepared effectively.
Owner:DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD

Package of shape memory alloy core structure

The invention provides a package of a shape memory alloy core structure, comprising a substrate, a chip arranged on the substrate, a plastic package material used for packing the chip on the substrate and a shape memory alloy embedded in the substrate. The package with the shape memory alloy embedded in the substrate improves the heat dispersion; due to the deformation of the shape memory alloy in the process of high temperature backflow in a packaging technology, the package can control the deformation direction to be opposite to the deformation directions of the substrate [such as a PCB (printed circuit board)] and the plastic package, thus at least partially restraining and / or offsetting the deformation of the substrate (such as the PCB) at a high temperature, and solving the problem of the packaging structure failure due to the deformation of the substrate and the plastic package at the high temperature.
Owner:SAMSUNG SEMICON CHINA RES & DEV +1

Intelligent temperature-control cooling module for automobile and control method thereof

The invention relates to an intelligent temperature-control cooling module for an automobile and a control method thereof. The module comprises a heat radiator (2), an air protection cover (3), an electrical fan (4) and a control unit (6), wherein the electrical fan (4) with an inwards concave air suction type structure is arranged in an electrical fan installation ort seat (16) on the air protection cover (3); the heat radiator (2) and the electrical fan (4) are connected with the control unit (6); the control unit (6) is connected with a vesical control unit and a vehicle dashboard; and a coolant temperature sensor (8) at a water inlet / outlet of the heat radiator (2) is connected with the control unit (6). According to the method, the real-time changes of cooling water temperature and the rotary speed of the electrical fan (4) are controlled accurately by adopting pulse-width modulation (PWM), and the rotary speed and the cooling intensity of the electrical fan (4) are adjusted and stabilized in real time according to the temperature of the coolant temperature sensor (8) and the feedback of the electrical fan (4), so that accurate temperature control and demand-based cooling arearealized, the aims of saving energy and reducing consumption are achieved, and the comfort in riding is improved.
Owner:DONGFENG COMML VEHICLE CO LTD

Vertical-cavity surface-emitting laser array for full-color display illumination

The invention discloses a vertical-cavity surface-emitting laser array for full-color display illumination and relates to semiconductor lasers. The vertical-cavity surface-emitting laser array is provided with a radiator copper substrate, a bonding layer, a current spreading and P-type electrode, a current limit layer, a P-type GaN layer, a quantum dot active area, an N-type GaN layer and an N-type electrode from bottom to top. The N-type GaN layer, the quantum dot active area and the P-type GaN layer sequentially grow on the radiator copper substrate; the current limit layer deposits on the P-type GaN layer and is provided with a P-type current injection hole; the current spreading and P-type electrode grows in the injection hole; the P-type electrode and a bottom distributed Bragg reflector are deposited in the current spreading and P-type electrode; the bonding layer is bonded between the bottom distributed Bragg reflector and the radiator copper substrate; the N-type electrode and a top distributed Bragg reflector are deposited on the N-type GaN layer; an a resonant cavity is formed between the bottom distributed Bragg reflector and the top distributed Bragg reflector.
Owner:XIAMEN UNIV

Laser photovoltaic battery of upside-down mounting structure, and manufacturing method therefor

The invention discloses a laser photovoltaic battery of an upside-down mounting structure. The photovoltaic battery comprises a second insulation substrate and an epitaxial layer disposed on the second insulation substrate. The epitaxial layer comprises a negative electrode, an N-type conductive layer, a P / N junction battery, a P-type window layer and a P-type contact layer which are successively formed on the second insulation substrate. The invention further discloses a manufacturing method for the laser photovoltaic battery of the upside-down mounting structure. The laser battery provided by the invention greatly reduces series resistance, improves the heat dissipation performance of the battery, and accordingly enhances the conversion efficiency of the photovoltaic battery. A stripped first substrate can be repeatedly used, thus the cost is reduced.
Owner:SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI

Equipment outlet casing adapting electrical conductivity adaptive control composite

The invention provides an equipment outlet casing adapting electrical conductivity adaptive control composite, which belongs to the technical field of high voltage transmission connection equipment. The equipment outlet casing includes a guide bar, a pressure sharing layer, a current limiting layer and a glass fiber sleeve which are wrapped in the outside of the guide rod from the inside to the outside; the upper lateral of the glass fiber sleeve is wrapped with a silicone rubber umbrella sheath. An electrode extension layer is embedded in the current limiting layer; the pressure sharing layerand an extension layer of motor are both made of electrical conductivity adaptive control composite combined with inorganic filler powder and high insulation strength organic materials; the two endsof the guide rod are both provided with first flanges which form a closed space with the glass fiber sleeve; the central section of the glass fiber-sleeve is provided with a second flange, the top ofwhich is attached to one end of the silicone rubber umbrella sheath and the inner wall of which is contacted with the electrode extension layer. The equipment outlet casing adapting the electrical conductivity adaptive control composite has the advantages that the problem of flashover of the main insulation breakdown and flange is solved, and the size of the equipment outlet casing is reduced, andthe heat and mechanical properties of the casing are improved, the production process is simplified.
Owner:TSINGHUA UNIV

White light LED luminescence apparatus

The invention discloses a white light LED luminescence apparatus. The luminescence apparatus comprises an LED chip, a heat radiation substrate, a fluorescence LTCC slice, a reflection cup and an electrode framework. The LED chip is bonded on the heat radiation substrate. The fluorescence LTCC slice is sleeved on the LED chip and coats an upper surface and four side surfaces of the LED chip. The reflection cup is sleeved around the fluorescence LTCC slice. The LED chip is connected to the electrode framework through a leading wire. The material of the fluorescence LTCC slice is a CaO-B2O3-SiO2: RE system or a BaO-TiO2-SiO2-B2O3: RE system. The white light LED luminescence apparatus has the following advantages: firstly, only employing a simple structure-the fluorescence LTCC slice, lots of light of the side surfaces of the LED chip can be outputted and utilized, and since the fluorescence LTCC slice is ceramic material, the apparatus has effects of stabilizing light and controlling light scattering; secondly, since the fluorescence LTCC slice has high thermal conductivity 2-5W / (m*K), through the using of the fluorescence LTCC slice, a heat radiation channel of a whole surface of the chip is realized, and heat radiation performance of a product is improved.
Owner:TSINGHUA UNIV

Thermal conductive pole piece and preparation method and use thereof

The invention relates to a thermal conductive pole piece. The thermal conductive pole piece comprises a positive electrode pole piece and a heat conductive coating arranged on both sides of the positive electrode pole piece. According to the invention, thermal conductive slurry is coated on the surface of the pole piece of a battery and directly contacts the pole piece; after cold pressing, the thermal conductive layer and the pole piece are in close contact; through heat conduction, heat generated during the operation of the battery can be quickly sent out; after the pole piece is rolled, thethermal conductive layer and the battery pole piece are tightly combined without falling off, which is more safe and reliable; at the same time, without passing through the casing body of the batteryor an external cooling pipe and the like, the efficiency of heat conduction is more high; and mass production, automated production and high manufacturability can be realized.
Owner:东莞维科电池有限公司

Peripheral component interconnect extensions for instrumentation (PXI) heat dissipation case and PXI test system

The invention relates to a peripheral component interconnect extensions for instrumentation (PXI) heat dissipation case and a PXI test system, wherein the PXI heat dissipation case comprises a case shell body and PXI backplanes which are respectively arranged in the case shell body, a plurality of PXI groove positions are arranged in the PXI backplanes, and back face of the case shell body is an air inlet gridding surface. A heat dissipation fan is arranged in the position, adjacent to the air inlet gridding surface, in the case shell body, and an air guide duct is formed between a blow-off nozzle of the heat dissipation fan and the PXI groove positions and used for guiding the wind blown by the heat dissipation fan to the PXI groove positions. Heat dissipation efficiency is improved, and heat dissipation performance of the PXI case is improved.
Owner:NAT INSTR CORP

Indication emergency lamp

The invention provides an indication emergency lamp which comprises a frame, a shell and a panel provided with an indication pattern. The frame is composed of metal frame bodies. The metal frame bodies are sequentially connected in an end-to-end mode to form the closed frame. The shell and the panel are installed inside the frame. One set of opposite metal frame bodies of the frame are respectively provided with a substrate, one face of each substrate is tightly attached to the corresponding metal frame body, and the other face of each substrate is provided with an LED light source; or one set of opposite metal frame bodies of the frame are respectively and directly provided with an LED light source in a packaging mode, and the periphery of each LED light source is covered with an optical layer. Batteries and power supply plates which are tightly attached to the metal frame bodies are arranged on the metal frame bodies of the frame. The batteries and the power supply plates are electrically connected with the LED light sources. The metal frame bodies are used as radiators for radiation, so that the radiating performance is improved, the reliability of the indication emergency lamp is improved, and the service life of the indication emergency lamp is prolonged; the LED light sources are installed on the set of opposite metal frame bodies, the light-emitting faces of the LED light sources of the two metal frame bodies are opposite, and the two sides of the panel are provided with light-emitting sources respectively, so that the brightness of the indication pattern of the panel is high and uniform.
Owner:浙江中博光电科技有限公司

Highly-integrated green LED resonance power circuit

The invention discloses a highly-integrated green LED resonance power circuit comprising an alternating-current input rectification circuit, a PFC circuit, a PFC and LLC signal control integrated circuit, a LLC soft switching circuit, an output circuit and a feedback control circuit. The alternating-current input rectification circuit, the PFC circuit, the LLC soft switching circuit and the output circuit are connected in sequence. The PFC and LLC signal control integrated circuit is respectively connected with the PFC circuit and the LLC soft switching circuit. The feedback control circuit is respectively connected with the PFC and LLC signal control integrated circuit and the output circuit and is used for automatically controlling output voltage and current. The highly-integrated green LED resonance power circuit has the following beneficial effects: the power circuit is a high-performance and high-energy-efficiency green LED power supply which highly integrates various functions of PFC and LLC; the power circuit has the characteristics of high reliability and high efficiency; 95% of peak efficiency can be provided; the thermal performance of a LED power supply is improved; and meanwhile, waste of electric energy is reduced and the service life of LEDs is prolonged.
Owner:SHENZHEN MEIKAI ELECTRONICS

Safe, reliable and energy-saving frame glass curtain wall system and assembling method

InactiveCN112376762AExcellent waterproof and noise reduction performanceOptimize the installation processWallsHeat proofingEngineeringSealant
The invention provides a safe, reliable and energy-saving frame glass curtain wall system, and relates to the technical field of building curtain walls. The safe, reliable and energy-saving frame glass curtain wall system comprises aluminum vertical frames, vertical auxiliary frames, aluminum transverse frames, transverse auxiliary frames and a glass panel; the aluminum transverse frames are correspondingly arranged on the two sides of the aluminum vertical frames, and the aluminum vertical frames and the aluminum transverse frames are fixedly connected through aluminum connectors and stainless steel screws; vertical transverse frames are arranged on one sides of the aluminum vertical frames, the transverse auxiliary frames are arranged on one sides of the aluminum transverse frames, the vertical auxiliary frames and the transverse auxiliary frames are connected with form small unit plates, and the multiple small unit plates are sealed through ethylene-propylene-diene monomer rubber strips to form an aluminum alloy auxiliary frame; and the glass panel is arranged on the aluminum transverse frames, outdoor aluminum protective edges are arranged outside the glass panel, and the outdoor aluminum protective edges are sealed by silicone weather-proof sealants. According to the safe, reliable and energy-saving frame glass curtain wall system, the excellent waterproof and noise reduction performance of a hidden frame curtain wall and the safety performance of a visible frame glass curtain wall are achieved, and the thermal performance of the system is greatly improved by adoptingthe process of the sealant, sealing rubber strips and heat insulation strips during design.
Owner:中铁十四局集团建筑工程有限公司

Oil-water cooling automobile radiator

The invention discloses an oil-water cooling automobile radiator. The oil-water cooling automobile radiator is good in radiating effect and sealing effect, has double functions of water cooling and oil cooling, and comprises a radiator body and water tanks arranged on the left and right sides of the radiator body, wherein a cooling water pipe is arranged inside the radiator body; a water inlet pipe orifice and a water outlet pipe orifice which communicate with the cooling water pipe are arranged on the both-side water tanks respectively; an engine oil cooling pipe is also arranged inside the radiator body; both-end pipe connectors of the engine oil cooling pipe extend to the both-side water tanks respectively; the water tanks are welded to the two sides of the radiator body in a one-time forming manner through a brazing furnace; and snap-fit connecting structures are arranged on the water inlet pipe orifice and the water outlet pipe orifice respectively.
Owner:ZHEJIANG CHITIAN RADIATOR MFG

High optical power density light-emitting diode (LED) light source module

A high optical power density light-emitting diode (LED) light source module comprises a baseplate, a plurality of LED light-emitting chips, a condenser and a heat dissipation device, wherein the LED light-emitting chips are produced on the baseplate so as to form an LED light-emitting chip array; the condenser is fixed above the LED light-emitting chips on the baseplate, and the lights which are sent out by the LED light-emitting chips are converged; and the heat dissipation device is fixed below the baseplate so as to dissipate the heat of the LED light-emitting chips. The module structure is applicable to the fields of photomedicine, photobiology, photochemical catalysis, optical communication and the like.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Radio frequency amplifying system and heat radiating device thereof

The invention relates to a radio frequency amplifying system and a heat radiating device thereof. The radio frequency amplifying system comprises a radio frequency amplifier and a heat radiating device. The radio frequency amplifier comprises a radio frequency power component. The heat radiating device comprises a heat conducting plate, a plurality of heat pipes, and a plurality of fins. The heat conducting plate is in heat conducting connection with the radio frequency power component. One ends of the heat pipes are in heat conducting connection with the heat conducting plate. The fins are arranged in parallel and at intervals, and the other ends of the heat pipes are connected with the fins in a penetrating manner. The heat of the radio frequency power component is conducted to the heat conducting plate and the heat pipes, and then conducted to the fins through the heat pipes and dissipated. Thus, the purpose of quick heat dissipation is achieved. The radio frequency power component can reach a thermally stable temperature quickly.
Owner:DELTA ELECTRONICS INC

Macroscopic ordered body of silicon carbide nanowires and preparation method thereof

The present invention relates to a macroscopic ordered body of silicon carbide nanowires and a preparation method thereof. The preparation method of the macroscopic ordered body of the silicon carbidenanowires comprises the following steps: silicon carbide nanowires are dispersed in a solvent; then a dispersant, a binder and a plasticizer are added; the materials are mixed to obtain a silicon carbide nanowire slurry material; a tape casting method is used to prepare the silicon carbide nanowire slurry material into a disordered silicon carbide nanowire thin film; and the disordered silicon carbide nanowire thin film is treated by a mechanical stretching method to obtain the macroscopic ordered body of the silicon carbide nanowires.
Owner:SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI

Method for removing sapphire substrate on blue-light luminescent chip

A method of removing blue-ray light-emitting chip sapphire substrate takes the reaction of sodium hydroxide solution or other alkaline solution with the sapphire to corrode the sapphire substrate, then the light-emitting chip without the sapphire substrate or with the sapphire substrate greatly reduced can be obtained after being cleansed by de-ionized water. The technique steps can be shown in details below: firstly, the sodium hydroxide solution or other alkaline solution is poured into a container with a flat bottom, and the height of the solution is controlled below 100 microns, the mass percent concentration of the solution is between 1 percent and 40 percent; secondly, the chip with the sapphire substrate is arranged in the sodium hydroxide solution or other alkaline solution, thereby letting the sapphire substrate partially immerged into the solution for 12 to 24 hours, then the sapphire substrate is corroded away completely or in part; thirdly, the de-ionized water gets utilized to cleanse the chip which is then placed into an oven under 100DEG for an hour or two.
Owner:SOUTHEAST UNIV

Welding type LED substrate and manufacturing technology thereof

The invention discloses a welding type LED substrate and a manufacturing technology thereof. The welding type LED substrate comprises an LED light source and a substrate body. The surface of the substrate body is coated with a metal layer in a hot spraying mode. The LED light source is welded to the metal layer. The substrate body can be the bottom of an outer shell or a plane panel or a heat dissipating device with a cooling fin. According to the manufacturing technology of the welding type LED substrate, firstly, the surface of the substrate body is coated with the metal layer in the hot spraying mode, and secondly, the LED light source is fixed on the metal layer based on the welding technology. Compared with mechanical contact of existing heat conducting glue filling, the welding type LED substrate has the advantages that the LED light source direct welding method is adopted, the LED light source is fixed on the metal layer of the heat dissipating device, the heat conducting middle transition of an aluminum substrate is omitted, and the welded light source is higher in strength and better in stability. The metal layer is generally made of copper and other high-thermal conductivity welding metal. The LED light source can directly transmit the heat to the metal layer after being welded, then the heat is transmitted to the heat dissipating device through the metal layer to be dissipated, the heat resistance is reduced to the maximum extent, the heat conducting efficiency is improved, and the light attenuation of the LED light source is reduced.
Owner:ZHEJIANG GEMCORE TECH

Machine tool large part structure optimization method considering gravity and heat influence

The invention discloses a machine tool large part structure optimization method considering gravity and heat influence. The method comprises the following steps: (1) determining a heat source and a heat dissipation boundary of a machine tool; (2) according to the heat source and the heat dissipation boundary of the machine tool, performing simulation calculation on deformation of the machine tool large piece under the influence of gravity and heat; and (3) according to a thermal deformation simulation calculation result of the machine tool large part, carrying out structure optimization on the machine tool large part. On the basis of a traditional machine tool structure design method, the machine tool large part structure optimization method considering the gravity and heat influences is provided, simulation calculation is carried out on deformation of the machine tool large part under the gravity and heat influences, weak links are obtained through analysis, structure optimization is carried out, therefore, the structural optimization of key parts of the tool body is more targeted.
Owner:XI AN JIAOTONG UNIV

Packaging structure and packaging method thereof, and display device

The invention belongs to the technical field of display device packaging, and particularly relates to a packaging structure, which comprises a protective layer, a barrier layer and a heat dissipation layer arranged between the protective layer and the barrier layer, wherein the heat dissipation layer comprises a graphene nanosheet and / or a boron nitride nanosheet. According to the invention, the packaging structure can effectively isolate corrosion of oxygen, water and other components in air to the display device, has good heat dissipation performance, can timely conduct and evacuate heat generated in the use process of the display device, and prevents low luminous efficiency and too fast service life degradation of the display device caused by heat accumulation, so that the display device has more stable photoelectric performance and longer service life.
Owner:TCL CORPORATION

Room-temperature-based thermoelectric material containing infinite conjugated polymer and preparation method of room-temperature-based thermoelectric material

The invention provides a room-temperature-based thermoelectric material containing an infinite conjugated polymer and a preparation method thereof, and the preparation method comprises the following steps: carrying out the mixing and ball milling of the infinite conjugated polymer and p-type bismuth telluride Bi (2-x) SbxTe3, and obtaining composite material powder, 0 < x < = 2; and carrying out hot-pressing discharge plasma sintering on the composite material powder at 240-450 DEG C to obtain the thermoelectric material, wherein the infinite conjugated polymer is a metal-based infinite conjugated polymer synthesized from an organic ligand shown in the following structural formula (1) and metal elements; wherein R is amino or sulfydryl, and R'is sulfydryl, hydroxyl, carboxyl or amido.By means of the technical scheme, the carrier concentration and lattice thermal conductivity of the thermoelectric material are cooperatively regulated and controlled, the electrical and thermal properties of the thermoelectric material are improved, and a new thought is provided for obtaining the high-performance thermoelectric material.
Owner:HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL

High-efficiency air-cooling forced heat dissipation brake pad and manufacturing method thereof

Ventilation duct type layout is adopted, porous titanium carbide in a friction material is combined, the heat dissipation performance is improved, dust and noise are low, the ABS intervention peak braking distance is changed, the abrasion performance of the brake pad is improved, braking is linearly smooth, and the service life is effectively prolonged. And through data calculation, the efficiency is effectively improved by 15-25%. In the braking process, after the heat dissipation grooves make contact with the brake disc, a closed heat dissipation channel covering the surface of the brake disc is formed, and after hot air and dust are collected through the vertical heat dissipation well, heat is rapidly released through the heat dissipation channel under the action of the axial flow fan, so that the effects of forced heat dissipation and prevention of dust falling on tires are achieved.
Owner:摩擦一号制动科技(仙桃)有限公司

Flat traction motor

The invention discloses a flat traction motor for an elevator. The radial magnetic flux permanent-magnetism traction motor comprises a stator part and a rotor part, a rotor comprises a traction rope groove portion, a stator support portion and a rotor plate in U shaped connection; the inner edge of the rotor plate is integrated and connected to the first end edge of the stator support portion, theouter edge of the rotor plate is integrated and connected to the first end edge of the traction rope groove portion, and the traction rope groove portion is positioned in the periphery of the statorsupport portion; a traction rope groove is arranged in the outer peripheral surface of the traction rope groove portion, and magnetic steel is attracted by the inner peripheral surface of the tractionrope groove portion; a stator core is fixed to the outer peripheral surface of a stator core support portion, and the stator core, a stator coil and the stator core support portion are positioned inan annular groove between magnetic steel of the rotor and the stator support portion, and the inner peripheral surface of the stator core support portion is supported by the outer peripheral surface of the stator portion via a pair of bearings. The motor is short in the axial length, compact in structure and good in heat radiation effect.
Owner:SHANGHAI GIE EM

Rail lamp with good heat dissipation effect

The invention discloses a rail lamp with a good heat dissipation effect. The rail lamp comprises a lamp main body and a rail slide head, wherein the rail slide head is movably installed on the lamp main body; a base used for installing a light source is arranged on the lamp main body; at least one heat conduction element used for heat conduction is arranged on the base; and the heat conduction element is connected with the lamp main body. According to the rail lamp disclosed by the invention, because the at least one heat conduction element used for heat conduction is arranged on the base, and the heat conduction element is connected with the lamp main body, the heat generated when the light source installed on the base is electrified to emit a light can be transferred onto the lamp main body through the heat conduction element, and then is dissipated through the lamp main body; and in this way, the heat dissipation area of the rail lamp disclosed by the invention is increased, the manner of carrying out heat dissipation only by virtue of a heat dissipater, of a traditional rail lamp, is abandoned, and the heat dissipation performance of the rail lamp disclosed by the invention is greatly improved.
Owner:ZHONGSHAN JIUNENG PHOTOELECTRIC TECH

Heat-dissipation dustproof laptop case

The invention discloses a heat-dissipation dustproof laptop case. The heat-dissipation dustproof laptop case comprises a body, wherein a keyboard area is formed on the body and provided with a plurality of heat dissipation and dust removing channels, the body is made of plastic, a plurality of heat-dissipation strips are embedded in the plastic, a fan for blowing air towards the keyboard area and an air channel which extends below the heat dissipation and dust removing channels from the fan are arranged in the body, a plurality of foot pad groups are arranged at the bottom of the body, and each foot pad group comprises a foot pad seat integrally formed with a lower case and a foot pad which is matched with each foot pad seat and capable of adjusting the height. The heat-dissipation dustproof laptop case has the benefits as follows: the fan and the air channel which extends below the heat dissipation and dust removing channels are arranged in the body, the dust can be removed and prevented effectively, the dust can be effectively prevented from affecting heat dissipation of a laptop, and meanwhile, the heat dissipation can also be accelerated by the aid of the fan; meanwhile, the heat dissipation performance can be optimized by the aid of the heat dissipation strips embedded in the plastic body; and in addition, the foot pad groups are arranged to optimize the heat dissipation at the bottom of the laptop, so that the heat dissipation performance is further optimized.
Owner:KUNSHAN DAJIU ELECTRONICS

Heat-dissipating disk for LED (light-emitting diode) lamps

The invention discloses a heat-dissipating disk for LED (light-emitting diode) lamps The heat-dissipating disk is characterized by comprising a base and a plurality of heat-dissipating wings, wherein the base is arranged at the center of the heat-dissipating disk, and the plurality of heat-dissipating wings are arranged at the periphery of the base; and the heat-dissipating wings extend downwards, a concave part is formed at the bottom of the base, and an LED patch is arranged below the concave part. The heat-dissipating disk disclosed by the invention is of a flower-like structure and the LED patch is arranged at the concave part at the bottom of the base; therefore, the heat-dissipating disk can effectively conduct heat generated in the operating process of LED to the outside; a wind tunnel heat-dissipating effect can be formed between each heat-dissipating wing and a shell of an LED lamp, thereby significantly optimizing the heat-dissipating performance of the LED lamp; and under the condition of same brightness,the integrated level of the LED lamp can be improved greatly. The heat-dissipating disk disclosed by the invention has the advantages of high heat-dissipating rate, small volume, energy saving, long service life and the like.
Owner:管惠良

Manufacturing method of green pellets

The invention discloses a manufacturing method of green pellets. The manufacturing method comprises the steps of beneficiation; filtering, wherein after the step of beneficiation is finished, when orepulp is filtered, a certain quantity of sulfuric acid solution is firstly added into the ore pulp, dust is removed in a plant, then the ore pulp is filtered, and therefore iron ore concentrate powderis obtained; and pelletizing, wherein the iron ore concentrate powder is used for pelletizing to obtain the green pellets. According to the manufacturing method, when the ore pulp is filtered after the beneficiation process is finished, a certain quantity of sulfuric acid solution is added into the ore pulp, dust is removed in the plant, and then the iron ore concentrate powder is obtained afterthe ore pulp is filtered. Tests show that the green pellets manufactured through the iron ore concentrate powder can greatly reduce the cracking probability under the high temperature drying condition. Thus, by means of the manufacturing method, the heat performance of the green pellets can be improved, and the quality of the green pellets can be improved easily.
Owner:SHANXI TAIGANG STAINLESS STEEL CO LTD

Producing process for novel integrated heat insulating window used for breeding industry

The invention discloses a producing process for a novel integrated heat insulating window used for breeding industry. The producing process for the novel integrated heat insulating window used for breeding industry comprises the flowing steps that a, premixing of polyurethane white materials is conducted; b, pouring and foaming are conducted; c, pasting of color steel plates is conducted; and d, mounting of a side frame is conducted. The producing process for the novel integrated heat insulating window used for breeding industry has the advantages that the porosity structure is stable, the thermal conductivity coefficient is low, the thermotechnical performance is good, the heat insulation performance and the sound insulation performance are good, rigid polyurethane core materials and the side faces of the color steel plate in pairs are wrapped with the side frame with a U-shaped section, so that the structure strength is improved greatly, the good anti-deformation capacity is achieved, crack is not easy to occur, and the color steel plates are stable and not easy to fall off.
Owner:严华军

Gallium nitride transistor for AC/DC and manufacturing method thereof

The invention discloses a GaN transistor for AC / DC and manufacturing method thereof. The GaN transistor comprises a nucleating layer and a substrate layer; the substrate layer is arranged at the bottom of the nucleating layer, a fluid heat dissipation structure is arranged on the substrate layer, a heat dissipation base is fixedly mounted at the bottom of the substrate layer, a conductive buffer layer is arranged at the top of the nucleating layer, and a drift layer is arranged on the side, away from the nucleating layer, of the conductive buffer layer; an electron blocking layer is arranged on the side, away from the conductive buffer layer, of the drift layer; a channel layer is arranged on the side, away from the conductive buffer layer, of the electron blocking layer; a barrier layer is arranged on the side, away from the electron blocking layer, of the channel layer, and source electrodes are arranged on the two opposite sides of the top of the barrier layer. The GaN transistor has the beneficial effects that the fluid heat dissipation structure is arranged on the substrate layer; the substrate layer is good in heat dissipation performance, and the heat dissipation seat is mounted on the lower substrate layer, so that the gallium nitride transistor is integrally provided with a heat dissipation structure, with the added fluid heat dissipation structure and the heat dissipation seat, the heat dissipation performance of the gallium nitride transistor is effectively improved, the use performance of the gallium nitride transistor is optimized, the service life of the gallium nitride transistor is prolonged, and the cost is reduced.
Owner:令储(上海)科技发展有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products