Radio frequency amplifying system and heat radiating device thereof

Abstract

The invention relates to a radio frequency amplifying system and a heat radiating device thereof. The radio frequency amplifying system comprises a radio frequency amplifier and a heat radiating device. The radio frequency amplifier comprises a radio frequency power component. The heat radiating device comprises a heat conducting plate, a plurality of heat pipes, and a plurality of fins. The heat conducting plate is in heat conducting connection with the radio frequency power component. One ends of the heat pipes are in heat conducting connection with the heat conducting plate. The fins are arranged in parallel and at intervals, and the other ends of the heat pipes are connected with the fins in a penetrating manner. The heat of the radio frequency power component is conducted to the heat conducting plate and the heat pipes, and then conducted to the fins through the heat pipes and dissipated. Thus, the purpose of quick heat dissipation is achieved. The radio frequency power component can reach a thermally stable temperature quickly.

Description

technical field [0001] The invention relates to a radio frequency amplification system, especially a radio frequency amplification system which utilizes heat pipes and fins to dissipate heat from the radio frequency amplifier. Background technique [0002] The RF amplifier is an extremely important component in the RF transmitter circuit. Its main function is to amplify the power of the signal and output it to the antenna, so that the antenna can radiate the signal to a remote RF receiver. Since the RF power element in the RF amplifier is the most power-consuming element in the RF transmitter circuit and directly determines the quality of the transmitted signal, the RF power element needs to be designed with output power, distortion, efficiency, bandwidth and reliability at the same time. degree and other factors. [0003] Existing RF amplifiers are limited by the low-voltage and high-current manufacturing technology of the old RF power components. Therefore, the design of ...

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Problems solved by technology

[0003] Existing RF amplifiers are limited by the low-voltage and high-current manufacturing technology of the old RF power components. Therefore, the design of high-wattage RF power components mostly adopts the traditional parallel distributed structure to reduce current stress and disperse heat sources.

In addition, because the RF amplification system will be affected by the parameters of other parasitic elements (Parasiticelement), most of them use bulky heat sinks, resulting in the overall weight of the RF amplification system being too heavy; in addition, the thermal stability of the current RF power components is still relatively slow. Due to the disadvantages, the user has to wait for the system to warm up for a long time

[0004] Compared with the existing traditional RF amplification system structure, due to the use of old RF power components, there are disadvantages of poor conversion efficiency and a large number of components.

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