73results about How to "Improve quality and yield" patented technology

The invention relates to an M12 large-size silicon wafer cutting process, and belongs to the technical field of crystalline silicon processing. The M12 large-size silicon wafer cutting process comprises the following steps of performing rod adhesion, namely fixing a silicon rod and a workpiece plate; performing feeding, namely assembling the silicon rod and the workpiece plate into a cutting machine to be cut; adding cutting fluid, namely adding the cutting liquid into the cutting machine; performing preheating before cutting, namely opening the cutting liquid and a wire net, and performing reciprocating wiring; cutting, namely setting cutting parameters and cutting the silicon rod; and performing blanking, namely setting retracting parameters, and enabling the silicon rod to be graduallyseparated from the wire net. According to the M12 large-size silicon wafer cutting process, a wear condition of a diamond wire can be reduced, the abnormal and bad edge breakage of the adhesive surface of the silicon wafer is effectively reduced, the diamond wire consumption is reduced, and the M12 large-size silicon wafer cutting process has the characteristics that the phenomenon of edge breakage of the silicon wafer is remarkably reduced and the slicing cost is reduced.

The invention relates to an intelligent cloud technology based plant growth mechanism control system and a control method thereof. The intelligent cloud technology based plant growth mechanism control system comprises an executing terminal, a control terminal and a cloud server, wherein the executing terminal is a plant growth mechanism body, responds to an instruction of the control terminal and executes a corresponding action, the control terminal comprises an externally connected communication device, can access server data and can also send the instruction to the executing terminal, the cloud server is used for establishing a database, a virtual community and an interactive platform, and communication between the executing terminal and the control terminal is performed through the cloud server. The intelligent cloud technology based plant growth mechanism control system achieves automatic planting, sowing in all seasons, improvement of plant quality and yield and real organic environmental protection. In addition, the intelligent cloud technology based plant growth mechanism control system achieves remote real-time monitoring, control and harvesting, interactivity improvement and planting fun increase based on an intelligent cloud technology. Furthermore, WeChat friends can operate similar happy farms on line, executes one-key planting, one-key watering, one-key fertilization, one-key harvesting and other functions and performs corresponding actions on offline executing terminals.

The invention provides a technical flow applicable to the mass production of tetraploid radix scutellariae, which is characterized in that: radix scutellariae is used as a breeding material, a tetraploid radix scutellariae seedling with excellent and consistent characters can be rapidly obtained through the plant polyploidy breeding technology, the tissue culture and rapid propagation technology and the stem cuttage technology. The tetraploid radix scutellariae seedling belongs to the KT optimization, height of the tetraploid radix scutellariae seedling is 1.84 times of a reference, length of a leaf is 1.50 times of the reference, width of the leaf is 2.14 times of the reference, yield of a single plant is high, the yield of a single root is 1.70 times of a diploid reference, content of baicalin is improved by 1.86 percent compared to the reference, the fertility of the polyploidy radix scutellariea excellent variety is sterile, the entire growth period is 25 to 30 days longer than the reference, the tissue culture and rapid propagation technology is used for propagating the polyploidy radix scutellariea excellent variety to obtain original seedlings, and then the original seedlings are made into seedlings through the stem cuttage technology, the seedlings are transplanted to a field to be planted, about 5000 seedlings per Mu are planted, leaves and roots can be harvested in current year, about 40 to 50 kilograms of radix scutellariae tea can be produced per Mu, about 350 to 450 kilograms of roots can be produced, the content of the baicalin can reach 13.5 to 16.56 percent which is far higher than the requirement of pharmacopoeia that the content of the baicalin is not less than 8 percent, and the quality of the radix scutellariae is excellent.

The invention relates to a film stripping process of a high-precision circuit board, and relates to the technical field of printed circuit board processing. The film stripping process of the high-precision circuit board sequentially comprises a bulking section, a film stripping section I and a film stripping section II, the bulking section adopts an inorganic film stripping solution with the mass concentration of 3-5% or an organic film stripping solution with the mass concentration of 10-12%, the film stripping section I adopts an environment-friendly high-precision circuit film stripping solution with the mass concentration of 10-12%, and the film stripping section II adopts an inorganic film stripping solution with the mass concentration of 3-5% or an organic film stripping solution with the mass concentration of 10-12%. According to the film stripping process, the film stripping speed is high, and the service life of the bath solution is long; film stripping is clean, no dry film residue is caused, and a copper surface and a tin surface are not corroded; the film removing device is suitable for film removing of fine lines, IC carrier plates and MSAP manufacturing procedures; and the film stripping liquid basically does not contain ammonia nitrogen and is very environment-friendly.

The invention discloses a coating surface density detection device and method. The device comprises a thickness detection module used for detecting the total thickness of a to-be-detected multi-layercoating; a surface density detection module, used for detecting the total surface density of the multi-layer coating to be detected; and a detection control module, used for calculating the surface density of each coating in the to-be-detected multi-layer coating based on the total thickness and the total surface density. According to the embodiment of the invention, the detection of the surface density of each coating layer can be realized.

The invention discloses a method for solving the problem of oil bleeding of an anti-welding plug hole in a single-side windowed PCB (printed circuit board). The method includes the steps: performing development processing on the single-side windowed PCB, performing light-sensitive curing on unexposed printing ink in the anti-welding plug hole in the single-side windowed PCB, and forming a layer of light-sensitive cured film so as to prevent oil bleeding in the subsequent curing process. In other words, the anti-welding plug hole is prevented from post-curing thermal expansion as a result of oil bleeding, so that quality and yield are improved. In addition, for the PCB, hardness of the printing oil is improved after one more time of UV (ultraviolet) curing, and the board is prevented from being scratched caused by carrying before post curing.

The invention provides a manufacturing apparatus and manufacturing method of a plastic component. The manufacturing apparatus includes a conveying device, a plurality of clamping devices, a heating device and a molding device. The conveying device is configured to move along a movement path back and forth. The clamping devices are detachably fixed to the conveying device. The clamping devices areconfigured to clamp a plastic plate, and tension applied to the plastic plate can be adjusted through at least any two oppositely arranged clamping devices. The heating device is arranged on the movement path and is configured to heat the plastic plate. The molding device is arranged on the movement path and is configured to mold the heated plastic plate. The manufacturing apparatus and manufacturing method of the plastic component provided by the invention can improve the yield and quality of a product.