M12 large-size silicon wafer cutting process
A silicon wafer cutting and large-size technology, which is applied in the field of M12 large-size silicon wafer cutting process, can solve the problems of decreased production efficiency, increased difficulty of silicon wafer cutting end, and increased cost, so as to reduce the cost of slicing and reduce abnormal edge chipping. Poor, the effect of reducing the number of commutations
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Embodiment 1
[0030] A kind of M12 large-size silicon chip cutting process, comprises the following steps:
[0031] S1: sticking rod: select the qualified silicon rod with a size of 210*210mm, use a curing agent to bond the silicon rod to the workpiece plate for curing, the curing time is 3 hours, and the room temperature is 23-28°C;
[0032] S2: Loading rods: use the loading car to load the silicon rods into the clamping guide rail of the workbench of the cutting machine to ensure that the silicon rods are clamped normally in the clamping guide rails of the workbench;
[0033] S3: Add cutting fluid: The cutting fluid is a mixture of coolant and pure water. Take the cutting fluid and stir it evenly, and add it to the liquid supply tank of the multi-wire cutting machine for later use. The volume ratio of coolant to pure water is 1.5L: 250L;
[0034] S4: Preheating before cutting: Turn on the cutting fluid flow rate of 165L / min, set the diamond wire running speed at 1800m / min, perform recipr...
Embodiment 2
[0042] A kind of M12 large-size silicon chip cutting process, comprises the following steps:
[0043] S1: sticking rod: select the qualified silicon rod size 210*210mm, the length of the silicon rod is 650mm, use the curing agent to bond the silicon rod on the workpiece plate for curing, the curing time is 3 hours, and the room temperature is 23-28 ℃;
[0044] S2: Loading rods: use the loading car to load the silicon rods into the clamping guide rail of the workbench of the cutting machine to ensure that the silicon rods are clamped normally in the clamping guide rails of the workbench;
[0045] S3: Add cutting fluid: The cutting fluid is a mixture of coolant and pure water. Take the cutting fluid and stir it evenly, and add it to the liquid supply tank of the multi-wire cutting machine for later use. The volume ratio of coolant to pure water is 2.0L: 300L;
[0046] S4: Preheating before cutting: Turn on the cutting fluid flow rate of 180L / min, set the diamond wire running sp...
Embodiment 3
[0055] A kind of M12 large-size silicon chip cutting process, comprises the following steps:
[0056] S1: sticking rod: select the qualified silicon rod size 210*210mm, the length of the silicon rod is 650mm, use the curing agent to bond the silicon rod on the workpiece plate for curing, the curing time is 3 hours, and the room temperature is 23-28 ℃;
[0057] S2: Loading rods: use the loading car to load the silicon rods into the clamping guide rail of the workbench of the cutting machine to ensure that the silicon rods are clamped normally in the clamping guide rails of the workbench;
[0058] S3: Add cutting fluid: The cutting fluid is a mixture of coolant and pure water. Take the cutting fluid and stir it evenly, and add it to the liquid supply tank of the multi-wire cutting machine for later use. The volume ratio of coolant to pure water is 2.0L: 350L;
[0059] S4: Preheating before cutting: Turn on the cutting fluid flow rate of 170L / min, set the diamond wire running sp...
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