PCB BGA area zero-distance through hole design method

Abstract

The invention discloses a PCB BGA area zero-distance through hole design method. The design method includes that a BGA area is displayed on the spherical contact of a PCB board, a plurality of through holes are arranged as needed, a pad is arranged at the outer sides of the through holes and deviates from the through holes at a certain distance, and an oil cover ring is arranged in the deviation distance, the oil cover ring is a recess ring surrounding the outer sides of the through holes, and the outer sides of the oil cover ring is contacted with the edge of the pad. Compared with the prior art, the PCB BGA area zero-distance through hole design method can prevent the pad from being subjected to oil explosion through the BGA through holes and effectively improves the production yield rate and quality of the PCB board by modifying the PCB design and additionally arranging the oil cover ring; and through the modification of the PCB design, printing ink plug holes can be continuously used, the cost is effectively saved, the application is wide, the practicality is high, and the popularization is easy.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a design method with strong practicability and zero-distance via holes in the PCBBGA area. Background technique [0002] As the carrier of electronic circuits, PCB generally exists in the hardware erection system of servers. In the design process of multi-layer PCB, in order to ensure the interconnection of inner and outer layers, there are ubiquitous via holes. During the PCB manufacturing process, the via holes need to be soldered and plugged. . At present, ink plugging is generally used as a plugging method. This plugging method is simple, convenient, and cheap, and can meet various applications. [0003] For PCBs with BGAs, the traditional design method in the industry in the BGA area is to directly connect the vias to the pads to ensure the continuity of the inner and outer circuits. However, in the process of PCB production, if the hole is plugged with ink,...

AI Technical Summary

Problems solved by technology

The improvement methods in the industry mainly include changing to one-sided window opening, reducing the ink in the hole, and controlling the fluidity of the ink, but this plugging hole will produce yellow false copper exposure, which will affect the appearance

At present, the best method is to use resin plug holes, that is, to change all the holes of solder resist plug holes into resin plug holes, but the cost of resin plug holes is too high, and the application level is not high.

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