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Method for improving orifice burrs after mechanical drilling of rigid-flex board with height difference on board surface

A technology of soft-rigid combination board and mechanical drilling, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., and can solve the problem of hole burr entry, poor quality of copper-plated Adam's apple, smaller hole diameter of parts, and scrapped holes And other issues

Inactive Publication Date: 2020-11-03
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a method for improving the hole burr after the mechanical drilling of the rigid-flex board with the height difference on the board surface in order to solve the above problems, which solves the problems caused by the design thickness of the rigid-flex board during the existing mechanical drilling operations. There is a difference in height on the uneven board surface. When the mechanical drilling is performed, the back of the board cannot completely contact the backing board, resulting in a gap. The drilling position on the back of the soft-rigid board is suspended. During mechanical drilling, the copper on the back surface will be affected by the impact of drilling down, resulting in hole burrs. The post-process electroplating station will cause hole burrs to enter the hole, copper-plated Adam's apple and other poor quality. After copper plating, the hole diameter of the parts becomes smaller and scrapped. The disadvantage that the film will be broken and scrapped

Method used

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  • Method for improving orifice burrs after mechanical drilling of rigid-flex board with height difference on board surface
  • Method for improving orifice burrs after mechanical drilling of rigid-flex board with height difference on board surface
  • Method for improving orifice burrs after mechanical drilling of rigid-flex board with height difference on board surface

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Embodiment Construction

[0025] Such as Figure 1-5 As shown, the present embodiment adopts the following technical scheme: a method for improving the hole burr after mechanical drilling of a rigid-flex board with a height difference on the board surface, and the method includes the following steps:

[0026] S1. Before drilling, prepare a cold stamping plate with the same size as the rigid-flex plate 1;

[0027] S2. Through the 2 positions of the raised part on the surface of the soft-hard combination plate and the 3 positions of the heat capacity block on the edge of the plate, correspondingly design the window opening of the above cold stamping plate to make the windowed cold stamping plate 4 for use;

[0028] S3. When mechanically drilling, use the cold stamping plate clamp pad after opening the window to perform mechanical drilling under the rigid-flex plate 1, so that the back of the drilling position of the rigid-flex plate 1 completely contacts the window-opening cold stamping plate 4, and the ...

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Abstract

The invention discloses a method for improving orifice burrs after mechanical drilling of a rigid-flex board with a height difference on a board surface. The method comprises the following steps: S1,preparing a cold punching board consistent with the rigid-flex board in size before drilling; S2, correspondingly designing the windowing of the cold punching plate according to the position of a convex part on the surface of the rigid-flex board and the position of a heat capacity block on the edge of the board, and manufacturing the windowing cold punching plate for later use; S3, during mechanical drilling, mechanically drilling below the rigid-flex board by using the windowed cold-punched board clamping pad, enabling the back surface of the drilling position of the rigid-flex board to be in complete contact with the windowed cold-punched board, replacing the drilling base plate by the windowed cold-punched board, and correspondingly stacking the non-porous bulge part position and the board edge heat capacity block position of the rigid-flex board at the windowed position. The invention has the beneficial effects that the problem of a gap between the rigid-flex board and the drilling base plate is solved, orifice burrs after mechanical drilling of the rigid-flex board with height difference on the board surface are effectively improved, the quality yield is improved, the qualityscrap rate is reduced, and the product processing material cost is reduced.

Description

Technical field: [0001] The invention belongs to the technical field of mechanical drilling, and in particular relates to a method for improving hole burrs after mechanical drilling of a soft-hard combination board with a board surface with a difference in height. Background technique: [0002] During the mechanical drilling operation, due to the uneven thickness of the rigid-flex board design, there is a difference in height on the board surface, and the back of the board cannot fully contact the backing plate during mechanical drilling, resulting in gaps, and the drilling position on the back of the rigid-flex board is in a suspended state. , if there is no opening of the cold stamping board when the soft-hard combination board is mechanically drilled, the copper on the back surface will be affected by the impact of drilling down, and the hole burrs will occur. The post-process electroplating station will cause the hole burrs to enter the hole, copper-plated Adam’s apple, e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047
Inventor 郭志伟余小丰杨俊徐杰
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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