The invention discloses a hole filling liquid
medicine for
direct current electroplating of a micro
blind hole. The hole filling liquid
medicine comprises a
wetting agent, an efficient inhibitor, an accelerator and a leveling agent, wherein the
wetting agent plays a role in increasing the wettability of a
copper surface, so that holes in the hole are prevented from being generated due to the factthat
copper ions in the hole are not consumed in time. According to the hole filling liquid
medicine, the efficient inhibitor is effectively adsorbed in the vicinity of a hole opening, and
copper growth of the hole opening is prevented, so that the hole wrapping phenomenon caused by too fast growth of the
electroplating copper at the hole opening of the fine
blind hole is improved; the acceleratorcan enter the hole and can be rapidly enriched with
electroplating, so that the plating speed in the hole is higher than the plating speed of the exterior of the hole, and the effect of efficiently filling the hole is achieved; the leveling agent is combined with a part with dense negative charges at the hole opening, the
copper plating speed of the hole openning is inhibited, and holes in the hole are prevented from being generated; by means of the synergistic effect of the components, efficient electroplating filling of fine and high-thickness-
diameter-ratio blind holes is realized, the hole filling process can be completed through
direct current plating, cost is low, the hole filling efficiency is high, the quality is high, and the
equipment requirement is low, and the hole filling liquid medicine is suitable for a
blind hole filling process with the
processing aperture being lower than 60 microns and the thickness-
diameter ratio being greater than 1.